ATXMEGA192D3-AN Equivalent & Substitute Parts

Part Overview

The ATXMEGA192D3-AN is an AVR XMEGA D3 series microcontroller manufactured by Microchip Technology, designed for embedded applications requiring 8/16-bit processing at 32MHz with 192KB flash memory. This device is currently in active production status and widely used in industrial control, IoT, and consumer electronics applications. Finding equivalent and substitute parts becomes necessary when managing supply chain continuity, optimizing inventory costs, or accommodating specific packaging and temperature range requirements across different production batches or regional sourcing strategies.

Key Parameters

Parameter	Value
Manufacturer	Microchip Technology
Series	AVR® XMEGA® D3
Core Processor	AVR
Core Size	8/16-Bit
Speed	32MHz
Program Memory Size	192KB (96K x 16)
Program Memory Type	FLASH
EEPROM Size	2K x 8
RAM Size	16K x 8
Number of I/O	50
Voltage Supply (Vcc/Vdd)	1.6V ~ 3.6V
Data Converters	A/D 16x12b
Connectivity	I2C, IrDA, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT
Oscillator Type	Internal
Mounting Type	Surface Mount
Package / Case	64-TQFP (14x14)
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the ATXMEGA192D3-AN is determined by strict equivalence across the following critical parameters:

Manufacturer & Series: Both parts must be Microchip Technology AVR XMEGA D3 series devices
Core Architecture: 8/16-Bit AVR processor
Memory Configuration: 192KB FLASH (96K x 16), 2K x 8 EEPROM, 16K x 8 RAM
Processing Speed: 32MHz operation
I/O Count: 50 I/O pins
Connectivity & Peripherals: Identical I2C, IrDA, SPI, UART/USART, and peripheral feature set
Package: 64-TQFP (14x14) surface mount
Voltage Supply Range: 1.6V ~ 3.6V
Compliance: ROHS3 compliant, MSL 3 rating

The ATXMEGA192D3-AU qualifies as a direct substitute based on matching all core electrical and mechanical parameters. Differences are limited to packaging format (Tray vs. standard packaging) and operating temperature range specification.

Parameter Comparison

Parameter	ATXMEGA192D3-AN	ATXMEGA192D3-AU
Manufacturer	Microchip Technology	Microchip Technology
Series	AVR® XMEGA® D3	AVR® XMEGA® D3
Core Processor	AVR	AVR
Core Size	8/16-Bit	8/16-Bit
Speed	32MHz	32MHz
Program Memory Size	192KB (96K x 16)	192KB (96K x 16)
EEPROM Size	2K x 8	2K x 8
RAM Size	16K x 8	16K x 8
Number of I/O	50	50
Voltage Supply (Vcc/Vdd)	1.6V ~ 3.6V	1.6V ~ 3.6V
Data Converters	A/D 16x12b	A/D 16x12b
Connectivity	I2C, IrDA, SPI, UART/USART	I2C, IrDA, SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Oscillator Type	Internal	Internal
Mounting Type	Surface Mount	Surface Mount
Package / Case	64-TQFP (14x14)	64-TQFP (14x14)
Operating Temperature	-40°C ~ 105°C (TA)	-40°C ~ 85°C (TA)
RoHS Status	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)	3 (168 Hours)

Engineering Selection Recommendations

The ATXMEGA192D3-AU is a qualified direct substitute for the ATXMEGA192D3-AN. Both devices maintain identical electrical specifications, memory architecture, and peripheral functionality. Selection between these parts should be based on the following factors:

Operating Temperature Range: The ATXMEGA192D3-AN supports extended temperature operation from -40°C to 105°C, while the ATXMEGA192D3-AU operates within -40°C to 85°C. Applications requiring sustained operation above 85°C must use the ATXMEGA192D3-AN.

Packaging Format: The ATXMEGA192D3-AU is supplied in Tray packaging, which may offer advantages for high-volume automated assembly processes. The ATXMEGA192D3-AN uses standard packaging suitable for mixed-volume production environments.

Compliance & Certification: Both parts maintain ROHS3 compliance and identical MSL 3 ratings, ensuring equivalent environmental and regulatory suitability for industrial and consumer applications.

Inventory & Availability: The ATXMEGA192D3-AU currently maintains higher inventory levels (3400 Pcs) compared to the ATXMEGA192D3-AN (1060 Pcs), which may influence supply chain decisions for time-sensitive projects.

Frequently Asked Questions (FAQ)

Q: Can ATXMEGA192D3-AU be used as a direct replacement for ATXMEGA192D3-AN in all applications?

A: The ATXMEGA192D3-AU is a direct electrical and functional equivalent. However, applications operating continuously above 85°C ambient temperature must use the ATXMEGA192D3-AN, which is rated to 105°C. For all other operating conditions within the -40°C to 85°C range, the ATXMEGA192D3-AU provides identical performance.

Q: Are there any pin compatibility differences between these parts?

A: No. Both devices use the 64-TQFP (14x14) package with identical pin assignments, I/O configuration, and 50 I/O pins. PCB layouts and firmware are fully interchangeable.

Q: What is the significance of the packaging difference (Tray vs. standard)?

A: Tray packaging is optimized for automated pick-and-place assembly in high-volume manufacturing. Standard packaging is suitable for general production environments. The electrical and functional characteristics remain identical regardless of packaging format.

Q: Do both parts have the same memory specifications?

A: Yes. Both the ATXMEGA192D3-AN and ATXMEGA192D3-AU feature identical memory: 192KB FLASH (96K x 16), 2K x 8 EEPROM, and 16K x 8 RAM. Firmware compatibility is complete.

Q: Are there any differences in connectivity or peripheral features?

A: No differences exist. Both parts provide identical I2C, IrDA, SPI, and UART/USART connectivity, along with Brown-out Detect/Reset, POR, PWM, and WDT peripherals.

Q: What compliance certifications apply to both parts?

A: Both devices are ROHS3 compliant and carry MSL 3 (168 Hours) moisture sensitivity ratings, ensuring equivalent environmental and regulatory suitability.

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