ATSAMB11G18A-MU-Y Equivalent & Substitute Parts

Part Overview

The ATSAMB11G18A-MU-Y is a Bluetooth v4.1 RF transceiver with integrated microcontroller manufactured by Microchip Technology. This component combines RF transmission/reception capability with MCU functionality in a 48-VFQFN exposed pad package. The part is currently obsolete, making equivalent and substitute parts necessary for ongoing design support and production continuity. Substitute parts must maintain functional compatibility across RF protocol, package form factor, and electrical interface specifications.

Substiute Parts

ATSAMB11G18A-MU-Y

Microchip TechnologyIn Stock: 1082ATSAMB11G18A-MU-Y Datasheet

Current PartRFQ

IS1870SF-102-TRAY

Microchip TechnologyIn Stock: 1481IS1870SF-102-TRAY Datasheet

MFR RecommendedRFQ

IS1870SF-202-TRAY

Microchip TechnologyIn Stock: 1553IS1870SF-202-TRAY Datasheet

MFR RecommendedRFQ

IS1871SF-102-TRAY

Microchip TechnologyIn Stock: 2143IS1871SF-102-TRAY Datasheet

MFR RecommendedRFQ

IS1871SF-202-TRAY

Microchip TechnologyIn Stock: 1150IS1871SF-202-TRAY Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution logic for the ATSAMB11G18A-MU-Y is based on the following criteria:

Package Compatibility: The main part uses a 48-VFQFN exposed pad package (6x6mm). Substitute parts must maintain this package form factor to ensure PCB layout compatibility and pin assignment alignment.

RF Protocol Compatibility: The main part operates on Bluetooth v4.1. Substitute parts using Bluetooth v5.0 are backward compatible, as Bluetooth v5.0 maintains full compatibility with Bluetooth v4.1 devices and protocols.

Frequency Band: All substitute parts operate within the 2.4GHz ISM band, maintaining RF compatibility.

Electrical Interface: Serial interfaces (I2C, SPI, UART) and GPIO count determine design integration feasibility. Substitute parts must support the required communication protocols.

Supply Voltage: Substitute parts must operate within overlapping voltage ranges to ensure power supply compatibility.

Temperature Rating: Operating temperature range determines suitability for target application environments.

Compliance: All parts maintain ROHS3 compliance and MSL 3 rating, ensuring manufacturing and environmental compatibility.

Substitute parts are grouped into two categories based on package size:

• 48-VFQFN (6x6mm) substitutes: IS1870SF-102-TRAY, IS1870SF-202-TRAY (direct package equivalents)
• 32-VFQFN (4x4mm) substitutes: IS1871SF-102-TRAY, IS1871SF-202-TRAY (smaller footprint alternatives)

Parameter Comparison

Engineering Selection Recommendations

For Direct Package Replacement (48-VFQFN 6x6mm):

IS1870SF-202-TRAY is the primary substitute for applications requiring full temperature range operation (-40°C ~ 85°C). This part maintains the 48-pin VFQFN package, supports Bluetooth v5.0 with backward compatibility to v4.1, and provides equivalent GPIO count (31 vs. 30). The operating temperature range matches the original specification. Current consumption is higher (10mA receive/transmit vs. 3-4mA), requiring power budget evaluation.

IS1870SF-102-TRAY is suitable for industrial and consumer applications with restricted temperature range (-20°C ~ 70°C). This part shares the same 48-pin package and Bluetooth v5.0 protocol but operates at higher current levels (13mA receive/transmit).

For Compact Footprint Alternative (32-VFQFN 4x4mm):

IS1871SF-202-TRAY provides a smaller form factor (4x4mm vs. 6x6mm) while maintaining full temperature range (-40°C ~ 85°C) and Bluetooth v5.0 compatibility. GPIO count is reduced to 15, requiring design verification for pin availability. This option is suitable for space-constrained applications.

IS1871SF-102-TRAY offers the compact 4x4mm package for temperature-restricted environments (-20°C ~ 70°C).

Compliance and Certification:

All substitute parts maintain ROHS3 compliance and MSL 3 rating, ensuring compatibility with standard manufacturing processes and environmental requirements. All parts are manufactured by Microchip Technology and carry active product status, ensuring long-term availability and support.

Frequently Asked Questions (FAQ)

Q: Can IS1870SF or IS1871SF parts directly replace ATSAMB11G18A-MU-Y without firmware modification?

A: Bluetooth v5.0 maintains full backward compatibility with Bluetooth v4.1 protocol specifications. However, firmware validation is required to confirm application-specific functionality, as ROM and SRAM memory sizes are reduced (32kB ROM / 24kB SRAM vs. 128kB ROM / 128kB RAM). Serial interface support is expanded (ADC and PWM added), but core I2C, SPI, and UART interfaces remain compatible.

Q: What are the key differences between IS1870SF and IS1871SF series?

A: IS1870SF parts use 48-pin VFQFN packages (6x6mm) with 31 GPIO pins, maintaining the original pin count and footprint. IS1871SF parts use 32-pin VFQFN packages (4x4mm) with 15 GPIO pins, reducing board space but limiting GPIO availability. Package selection depends on PCB layout constraints and GPIO requirements.

Q: How do temperature ratings affect part selection?

A: ATSAMB11G18A-MU-Y operates from -40°C to 85°C. IS1870SF-202-TRAY and IS1871SF-202-TRAY maintain this full range. IS1870SF-102-TRAY and IS1871SF-102-TRAY operate from -20°C to 70°C, suitable for consumer and industrial applications but not for extended temperature environments. Select based on target application temperature requirements.

Q: What is the impact of reduced current consumption specifications?

A: Substitute parts show higher current consumption (10-13mA vs. 3-4mA for receive/transmit). Power supply design and battery life calculations must be re-evaluated. IS1870SF-202-TRAY and IS1871SF-202-TRAY show lower current (10mA) compared to -102 variants (13mA), making them preferable for power-sensitive applications.

Q: Are there GPIO limitations when using IS1871SF parts?

A: IS1871SF parts provide 15 GPIO pins versus 30 on the original part and 31 on IS1870SF parts. Applications requiring more than 15 GPIO must use IS1870SF series or implement external GPIO expansion. Verify GPIO requirements before selecting the compact 4x4mm package.

Q: Do all substitute parts support the same serial interfaces?

A: IS1870SF and IS1871SF parts support ADC, I2C, PWM, SPI, and UART interfaces. The original ATSAMB11G18A-MU-Y supports I2C, SPI, and UART. Additional interface support (ADC, PWM) provides design flexibility but does not affect core communication compatibility.

Q: What packaging format is available for these substitute parts?

A: IS1870SF-102-TRAY, IS1870SF-202-TRAY, and IS1871SF-202-TRAY are supplied in Tray packaging. IS1871SF-102-TRAY packaging format is not specified in available data. Confirm packaging requirements with supplier for production planning.