ATSAM3S1CA-CUR Equivalent & Substitute Parts

Part Overview

The ATSAM3S1CA-CUR is a 32-bit ARM Cortex-M3 microcontroller from Microchip Technology's SAM3S series, featuring 64KB Flash memory and operating at 64MHz. This device is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support, design updates, and procurement planning. The ATSAM3S1CB-CUR serves as a direct substitute with identical electrical and mechanical specifications but maintains active product status.

Key Parameters

Parameter	Value
Core Processor	ARM® Cortex®-M3
Core Size	32-Bit Single-Core
Speed	64MHz
Program Memory Size	64KB (64K x 8) FLASH
RAM Size	16K x 8
Voltage Supply (Vcc/Vdd)	1.62V ~ 3.6V
Data Converters	A/D 15x10/12b; D/A 2x12b
Number of I/O	79
Operating Temperature	-40°C ~ 85°C (TA)
Package / Case	100-TFBGA (9x9)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)

Substitute Part Grouping Explanation

The ATSAM3S1CB-CUR qualifies as a direct substitute for the ATSAM3S1CA-CUR based on strict equivalence across all critical electrical and mechanical parameters. Substitution is valid when the following conditions are met:

Identical core processor architecture (ARM Cortex-M3)
Matching core size (32-Bit Single-Core)
Identical operating frequency (64MHz)
Identical program memory capacity (64KB FLASH)
Identical RAM capacity (16K x 8)
Matching voltage supply range (1.62V ~ 3.6V)
Identical data converter specifications (A/D 15x10/12b; D/A 2x12b)
Identical I/O count (79)
Matching operating temperature range (-40°C ~ 85°C)
Identical package form factor (100-TFBGA 9x9)
Identical surface mount mounting type
Matching RoHS compliance (ROHS3)
Identical MSL rating (3, 168 Hours)

The ATSAM3S1CB-CUR maintains all functional and physical characteristics of the ATSAM3S1CA-CUR while offering active product status and improved availability.

Parameter Comparison

Parameter	ATSAM3S1CA-CUR	ATSAM3S1CB-CUR	Match
Manufacturer	Microchip Technology	Microchip Technology	✓
Series	SAM3S	SAM3S	✓
Core Processor	ARM® Cortex®-M3	ARM® Cortex®-M3	✓
Core Size	32-Bit Single-Core	32-Bit Single-Core	✓
Speed	64MHz	64MHz	✓
Program Memory Size	64KB (64K x 8) FLASH	64KB (64K x 8) FLASH	✓
RAM Size	16K x 8	16K x 8	✓
Voltage Supply (Vcc/Vdd)	1.62V ~ 3.6V	1.62V ~ 3.6V	✓
Data Converters	A/D 15x10/12b; D/A 2x12b	A/D 15x10/12b; D/A 2x12b	✓
Number of I/O	79	79	✓
Connectivity	EBI/EMI, I2C, Memory Card, SPI, SSC, UART/USART, USB	EBI/EMI, I2C, Memory Card, SPI, SSC, UART/USART, USB	✓
Peripherals	Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT	✓
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)	✓
Package / Case	100-TFBGA (9x9)	100-TFBGA (9x9)	✓
Mounting Type	Surface Mount	Surface Mount	✓
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	✓
Moisture Sensitivity Level (MSL)	3 (168 Hours)	3 (168 Hours)	✓
Product Status	Obsolete	Active	Substitute is Active
ECCN	3A991A2	3A991A2	✓
HTSUS	8542.31.0001	8542.31.0001	✓

Engineering Selection Recommendations

The ATSAM3S1CB-CUR is the appropriate selection for applications currently using or specifying the ATSAM3S1CA-CUR. This substitution is based on complete electrical and mechanical equivalence across all specified parameters. The ATSAM3S1CB-CUR offers the additional advantage of active product status, ensuring long-term availability and manufacturing support. Both devices maintain identical ROHS3 compliance and export classification (ECCN 3A991A2), supporting equivalent regulatory and supply chain requirements. The identical MSL rating (3, 168 Hours) ensures equivalent moisture handling and storage protocols.

Frequently Asked Questions (FAQ)

Q: Are the ATSAM3S1CA-CUR and ATSAM3S1CB-CUR pin-compatible?

A: Yes. Both devices use the 100-TFBGA (9x9) package with identical pinout, I/O count (79), and electrical characteristics. Direct PCB-level substitution is supported without layout modifications.

Q: What is the difference between these two part numbers?

A: The primary difference is product status. The ATSAM3S1CA-CUR is obsolete, while the ATSAM3S1CB-CUR maintains active status. All electrical specifications, memory configurations, operating parameters, and package specifications are identical.

Q: Can I use the ATSAM3S1CB-CUR as a drop-in replacement in existing designs?

A: Yes. The ATSAM3S1CB-CUR is a direct functional and physical equivalent. No firmware modifications, PCB redesign, or peripheral reconfiguration is required.

Q: Are there any differences in supply voltage or operating temperature ranges?

A: No. Both devices operate across the identical voltage range (1.62V ~ 3.6V) and temperature range (-40°C ~ 85°C). Thermal and power management specifications are equivalent.

Q: Do both parts have the same data converter specifications?

A: Yes. Both the ATSAM3S1CA-CUR and ATSAM3S1CB-CUR include identical analog-to-digital converters (15x10/12b) and digital-to-analog converters (2x12b).

Q: What is the MSL rating, and does it differ between these parts?

A: Both devices carry MSL 3 (168 Hours) rating. This indicates identical moisture sensitivity and storage requirements. Devices must be stored in controlled humidity environments and baked according to IPC standards before reflow soldering.

Q: Are the connectivity and peripheral sets identical?

A: Yes. Both parts support identical connectivity interfaces (EBI/EMI, I2C, Memory Card, SPI, SSC, UART/USART, USB) and peripheral functions (Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT).

Q: What is the packaging difference between these parts?

A: The ATSAM3S1CA-CUR uses standard packaging, while the ATSAM3S1CB-CUR is supplied in Tape & Reel (TR) format. Both use the 100-TFBGA (9x9) package form factor. The TR packaging is standard for high-volume automated assembly.

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