ATSAM3S1BA-MUR Equivalent & Substitute Parts

Part Overview

The ATSAM3S1BA-MUR is an ARM Cortex-M3 based 32-bit microcontroller from Microchip Technology's SAM3S series, featuring 64KB Flash memory and 16KB RAM in a 64-QFN package. This device is classified as obsolete, making identification of compatible substitute parts essential for ongoing design support, production continuity, and legacy system maintenance.

Key Parameters

Parameter	Value
Manufacturer	Microchip Technology
Series	SAM3S
Core Processor	ARM Cortex-M3
Core Size	32-Bit Single-Core
Speed	64MHz
Program Memory Size	64KB (64K x 8)
RAM Size	16K x 8
Voltage Supply (Vcc/Vdd)	1.62V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TA)
Package / Case	64-VFQFN Exposed Pad
Mounting Type	Surface Mount
Number of I/O	47
Connectivity	I2C, MMC, SPI, SSC, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Data Converters	A/D 10x10/12b; D/A 2x12b
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the ATSAM3S1BA-MUR is determined by strict equivalence across the following critical parameters:

Processor Architecture: ARM Cortex-M3 core
Memory Configuration: 64KB Flash, 16KB RAM
Operating Frequency: 64MHz
Supply Voltage Range: 1.62V ~ 3.6V
Package Type: 64-VFQFN Exposed Pad (9x9mm)
I/O Count: 47 pins
Peripheral Set: I2C, MMC, SPI, SSC, UART/USART, USB, DMA, PWM, WDT, Brown-out Detect/Reset, I2S, POR
Data Converter Specifications: A/D 10x10/12b; D/A 2x12b
Temperature Range: -40°C ~ 85°C

The ATSAM3S1BB-MUR meets all substitution criteria, with identical electrical and functional specifications. Differences are limited to product status and packaging format.

Parameter Comparison

Parameter	ATSAM3S1BA-MUR	ATSAM3S1BB-MUR
Manufacturer	Microchip Technology	Microchip Technology
Series	SAM3S	SAM3S
Core Processor	ARM Cortex-M3	ARM Cortex-M3
Core Size	32-Bit Single-Core	32-Bit Single-Core
Speed	64MHz	64MHz
Program Memory Size	64KB (64K x 8)	64KB (64K x 8)
RAM Size	16K x 8	16K x 8
Voltage Supply (Vcc/Vdd)	1.62V ~ 3.6V	1.62V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TA)	-40°C ~ 85°C (TA)
Package / Case	64-VFQFN Exposed Pad	64-VFQFN Exposed Pad
Mounting Type	Surface Mount	Surface Mount
Number of I/O	47	47
Connectivity	I2C, MMC, SPI, SSC, UART/USART, USB	I2C, MMC, SPI, SSC, UART/USART, USB
Peripherals	Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT	Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Data Converters	A/D 10x10/12b; D/A 2x12b	A/D 10x10/12b; D/A 2x12b
RoHS Status	ROHS3 Compliant	ROHS3 Compliant
Product Status	Obsolete	Active
Supplier Device Package	64-QFN (9x9)	64-QFN (9x9)
Packaging Format	Bulk	Tape & Reel (TR)
Moisture Sensitivity Level (MSL)	1 (Unlimited)	3 (168 Hours)

Engineering Selection Recommendations

The ATSAM3S1BB-MUR is a direct functional equivalent to the ATSAM3S1BA-MUR. Selection between these parts should be based on the following factors:

Product Status: The ATSAM3S1BA-MUR is classified as obsolete. The ATSAM3S1BB-MUR maintains active product status with Microchip Technology, ensuring continued availability and technical support.

Compliance and Certifications: Both parts are ROHS3 compliant and carry identical ECCN (3A991A2) and HTSUS (8542.31.0001) classifications, meeting regulatory requirements for equivalent substitution.

Packaging and Handling: The ATSAM3S1BA-MUR is supplied in bulk format with MSL 1 (unlimited moisture sensitivity). The ATSAM3S1BB-MUR is supplied in Tape & Reel format with MSL 3 (168-hour moisture sensitivity). MSL 3 requires controlled storage and handling procedures within 168 hours of package opening. Select based on production workflow and storage capabilities.

Inventory and Availability: The ATSAM3S1BB-MUR is the recommended choice for new designs and ongoing production due to active status and standard commercial availability through distribution channels.

Frequently Asked Questions (FAQ)

Q: Are the ATSAM3S1BA-MUR and ATSAM3S1BB-MUR pin-compatible?

A: Yes. Both devices use the 64-VFQFN Exposed Pad package with 47 I/O pins in identical pin configurations. PCB layouts and schematics require no modification for substitution.

Q: What is the difference between MSL 1 and MSL 3?

A: MSL (Moisture Sensitivity Level) indicates the maximum time a component can remain outside controlled humidity storage after package opening. MSL 1 allows unlimited exposure. MSL 3 requires use within 168 hours of opening. If the ATSAM3S1BB-MUR (MSL 3) is stored beyond this window, baking procedures are required before assembly to prevent moisture-induced defects.

Q: Can I use the ATSAM3S1BB-MUR in existing designs originally specified for the ATSAM3S1BA-MUR?

A: Yes. Electrical specifications, memory configuration, peripheral set, and package dimensions are identical. No design changes are required. Verify that your production and storage procedures accommodate MSL 3 handling requirements.

Q: Why is the ATSAM3S1BA-MUR marked as obsolete?

A: Product obsolescence is determined by the manufacturer based on market demand and product lifecycle management. The ATSAM3S1BB-MUR provides equivalent functionality and is the active replacement part.

Q: Are there any performance differences between these parts?

A: No. Both parts operate at 64MHz, support identical peripheral sets, and provide equivalent data converter specifications. Performance is functionally identical across all operating conditions within the specified temperature range (-40°C ~ 85°C).

Q: What certifications apply to both parts?

A: Both the ATSAM3S1BA-MUR and ATSAM3S1BB-MUR are ROHS3 compliant. The ATSAM3S1BB-MUR carries REACH Unaffected status. Both share identical ECCN and HTSUS classifications for export and tariff purposes.

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