ATSAM3S1BA-MU Equivalent & Substitute Parts

Part Overview

The ATSAM3S1BA-MU is an ARM Cortex-M3 SAM3S microcontroller IC featuring 32-bit single-core architecture, 64MHz clock speed, and 64KB FLASH memory in a 64-QFN (9x9) surface mount package. This device is classified as obsolete, making equivalent substitute parts necessary for ongoing design support and production continuity. The SAM3S series provides integrated connectivity options including I2C, MMC, SPI, SSC, UART/USART, and USB interfaces, along with essential peripherals such as DMA, PWM, and watchdog timer functionality.

Substiute Parts

ATSAM3S1BA-MU
Microchip TechnologyIn Stock: 881ATSAM3S1BA-MU Datasheet
ATSAM3S1BA-MU
Current Part
ATSAM3S1BB-MU
Microchip TechnologyIn Stock: 2220ATSAM3S1BB-MU Datasheet
ATSAM3S1BB-MU
Direct

Key Parameters

Parameter Value
Core Processor ARM Cortex-M3
Core Size 32-Bit Single-Core
Speed 64MHz
Program Memory Size 64KB (64K x 8) FLASH
RAM Size 16K x 8
Voltage Supply (Vcc/Vdd) 1.62V ~ 3.6V
Number of I/O 47
Connectivity I2C, MMC, SPI, SSC, UART/USART, USB
Data Converters A/D 10x10/12b; D/A 2x12b
Mounting Type Surface Mount
Package 64-QFN (9x9)
Operating Temperature -40°C ~ 85°C (TA)

Substitute Part Grouping Explanation

The ATSAM3S1BB-MU qualifies as a direct substitute for the ATSAM3S1BA-MU based on identical electrical and mechanical parameters. Substitution is valid when the following criteria are met:

  • Identical core processor architecture (ARM Cortex-M3)
  • Matching core size and speed (32-Bit Single-Core, 64MHz)
  • Identical program memory capacity (64KB FLASH)
  • Identical RAM configuration (16K x 8)
  • Matching voltage supply range (1.62V ~ 3.6V)
  • Identical I/O count (47 pins)
  • Identical connectivity interfaces (I2C, MMC, SPI, SSC, UART/USART, USB)
  • Identical peripheral set (Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT)
  • Matching data converter specifications (A/D 10x10/12b; D/A 2x12b)
  • Identical package form factor (64-QFN 9x9)
  • Identical operating temperature range (-40°C ~ 85°C)

Parameter Comparison

Parameter ATSAM3S1BA-MU ATSAM3S1BB-MU Match
Manufacturer Microchip Technology Microchip Technology Yes
Series SAM3S SAM3S Yes
Core Processor ARM Cortex-M3 ARM Cortex-M3 Yes
Core Size 32-Bit Single-Core 32-Bit Single-Core Yes
Speed 64MHz 64MHz Yes
Program Memory Size 64KB (64K x 8) FLASH 64KB (64K x 8) FLASH Yes
RAM Size 16K x 8 16K x 8 Yes
Voltage Supply (Vcc/Vdd) 1.62V ~ 3.6V 1.62V ~ 3.6V Yes
Number of I/O 47 47 Yes
Connectivity I2C, MMC, SPI, SSC, UART/USART, USB I2C, MMC, SPI, SSC, UART/USART, USB Yes
Peripherals Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Yes
Data Converters A/D 10x10/12b; D/A 2x12b A/D 10x10/12b; D/A 2x12b Yes
Oscillator Type Internal Internal Yes
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) Yes
Mounting Type Surface Mount Surface Mount Yes
Package / Case 64-VFQFN Exposed Pad 64-VFQFN Exposed Pad Yes
Supplier Device Package 64-QFN (9x9) 64-QFN (9x9) Yes
RoHS Status ROHS3 Compliant ROHS3 Compliant Yes
REACH Status REACH Unaffected REACH Unaffected Yes
ECCN 3A991A2 3A991A2 Yes
HTSUS 8542.31.0001 8542.31.0001 Yes
Product Status Obsolete Active Different
Packaging Not specified Tray Different
Moisture Sensitivity Level (MSL) 1 (Unlimited) 3 (168 Hours) Different

Engineering Selection Recommendations

The ATSAM3S1BB-MU is a direct functional equivalent to the ATSAM3S1BA-MU. Both devices share identical electrical specifications, memory configurations, peripheral sets, and package form factors. The primary distinction is product status: the ATSAM3S1BA-MU is obsolete, while the ATSAM3S1BB-MU maintains active production status.

Both parts maintain ROHS3 compliance and REACH unaffected status, satisfying equivalent regulatory requirements. The ATSAM3S1BB-MU is supplied in Tray packaging with MSL 3 (168 Hours) moisture sensitivity, compared to the original part's MSL 1 (Unlimited) rating. This difference reflects standard industry packaging variations and does not affect functional compatibility in applications where standard moisture control procedures are observed.

For new designs or production continuity where the ATSAM3S1BA-MU is unavailable, the ATSAM3S1BB-MU provides complete electrical and mechanical interchangeability.

Frequently Asked Questions (FAQ)

Q: Can the ATSAM3S1BB-MU directly replace the ATSAM3S1BA-MU in existing designs?

A: Yes. Both parts are identical in core processor, memory capacity, speed, I/O configuration, connectivity interfaces, and package form factor. No design modifications are required for functional substitution.

Q: What is the difference between the two part numbers?

A: The ATSAM3S1BA-MU is obsolete, while the ATSAM3S1BB-MU is in active production. The suffix letter change reflects Microchip's product lifecycle management. Electrical and mechanical specifications remain identical.

Q: Are there packaging differences between these parts?

A: The ATSAM3S1BA-MU packaging is not specified in available documentation. The ATSAM3S1BB-MU is supplied in Tray packaging. Both use the 64-QFN (9x9) form factor with identical pin configuration and exposed pad design.

Q: What is the significance of the different MSL ratings?

A: The ATSAM3S1BA-MU has MSL 1 (Unlimited moisture sensitivity), while the ATSAM3S1BB-MU has MSL 3 (168 Hours). MSL 3 requires standard moisture control during storage and handling. This is a typical industry variation and does not affect device performance when standard moisture management procedures are followed.

Q: Are both parts RoHS and REACH compliant?

A: Yes. Both the ATSAM3S1BA-MU and ATSAM3S1BB-MU are ROHS3 compliant and REACH unaffected, meeting equivalent environmental and regulatory standards.

Q: What is the operating temperature range for both parts?

A: Both parts operate across -40°C to 85°C (TA), providing identical thermal performance specifications.

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