ATSAM3N1BA-MU Equivalent & Substitute Parts

Part Overview

The ATSAM3N1BA-MU is an ARM Cortex-M3 SAM3N microcontroller IC featuring 32-bit single-core architecture, 48MHz operation, and 64KB FLASH memory in a 64-QFN (9x9) surface mount package. This device is classified as obsolete, necessitating identification of active equivalent parts for ongoing design requirements and production continuity. The substitute part ATSAM3N1BB-MU maintains identical core functionality and electrical specifications while offering active product status.

Substiute Parts

ATSAM3N1BA-MU
Microchip TechnologyIn Stock: 1612ATSAM3N1BA-MU Datasheet
ATSAM3N1BA-MU
Current Part
ATSAM3N1BB-MU
Microchip TechnologyIn Stock: 1508ATSAM3N1BB-MU Datasheet
ATSAM3N1BB-MU
Direct

Key Parameters

Parameter Value
Core Processor ARM Cortex-M3
Core Size 32-Bit Single-Core
Speed 48MHz
Program Memory Size 64KB (64K x 8) FLASH
RAM Size 8K x 8
Voltage Supply (Vcc/Vdd) 1.62V ~ 3.6V
Data Converters A/D 10x10b, D/A 1x10b
Connectivity I2C, IrDA, SPI, UART/USART
Number of I/O 47
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Package 64-VFQFN Exposed Pad (9x9)
Series SAM3N

Substitute Part Grouping Explanation

Substitution eligibility for the ATSAM3N1BA-MU is determined by strict equivalence across the following critical parameters:

  • Core processor architecture and instruction set (ARM Cortex-M3)
  • Memory configuration (64KB FLASH, 8KB RAM)
  • Operating frequency (48MHz)
  • Supply voltage range (1.62V ~ 3.6V)
  • Peripheral set (I2C, IrDA, SPI, UART/USART, DMA, PWM, WDT, Brown-out Detect/Reset, POR)
  • I/O count (47 pins)
  • Data converter specifications (A/D 10x10b, D/A 1x10b)
  • Package type and pin configuration (64-QFN 9x9)
  • Mounting technology (Surface Mount)
  • Temperature range (-40°C ~ 85°C)

The ATSAM3N1BB-MU meets all substitution criteria, differing only in product status (Active vs. Obsolete) and packaging format (Tray vs. unspecified for main part).

Parameter Comparison

Parameter ATSAM3N1BA-MU ATSAM3N1BB-MU
Manufacturer Microchip Technology Microchip Technology
Series SAM3N SAM3N
Core Processor ARM Cortex-M3 ARM Cortex-M3
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 48MHz 48MHz
Program Memory 64KB (64K x 8) FLASH 64KB (64K x 8) FLASH
RAM Size 8K x 8 8K x 8
Voltage Supply 1.62V ~ 3.6V 1.62V ~ 3.6V
A/D Converter 10x10b 10x10b
D/A Converter 1x10b 1x10b
Connectivity I2C, IrDA, SPI, UART/USART I2C, IrDA, SPI, UART/USART
Peripherals Brown-out Detect/Reset, DMA, POR, PWM, WDT Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O 47 47
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 64-VFQFN Exposed Pad 64-VFQFN Exposed Pad
Supplier Device Package 64-QFN (9x9) 64-QFN (9x9)
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected
ECCN 3A991A2 3A991A2
HTSUS 8542.31.0001 8542.31.0001

Engineering Selection Recommendations

The ATSAM3N1BB-MU is a direct functional equivalent to the ATSAM3N1BA-MU. Both parts maintain identical electrical specifications, memory configuration, peripheral functionality, and package geometry. The primary distinction is product lifecycle status: ATSAM3N1BA-MU is obsolete while ATSAM3N1BB-MU is active.

For new designs or production continuity, ATSAM3N1BB-MU is the appropriate selection. Both parts carry ROHS3 compliance and REACH unaffected status, satisfying equivalent regulatory requirements. The identical ECCN and HTSUS classifications confirm equivalent export and tariff treatment.

Frequently Asked Questions (FAQ)

Q: Can ATSAM3N1BB-MU directly replace ATSAM3N1BA-MU in existing designs?

A: Yes. The parts are electrically and mechanically identical across all functional parameters. Pin configuration, voltage requirements, memory capacity, peripheral set, and operating characteristics are equivalent. Direct substitution is supported without design modification.

Q: Are there differences in package handling or storage?

A: ATSAM3N1BB-MU is supplied in Tray packaging. Verify that your assembly process accommodates this packaging format. Both parts share identical moisture sensitivity level requirements and thermal specifications.

Q: Do both parts meet the same compliance standards?

A: Yes. Both ATSAM3N1BA-MU and ATSAM3N1BB-MU are ROHS3 compliant and REACH unaffected. Export classification (ECCN 3A991A2) and tariff codes (HTSUS 8542.31.0001) are identical.

Q: Why is ATSAM3N1BA-MU classified as obsolete?

A: Obsolete status indicates the part is no longer in active production. ATSAM3N1BB-MU provides continuity for applications requiring SAM3N series functionality with active product support and availability.

Q: Are firmware or software modifications required when switching to ATSAM3N1BB-MU?

A: No. Identical core processor architecture, instruction set, memory organization, and peripheral configuration eliminate the need for firmware changes. Existing code compiled for ATSAM3N1BA-MU executes without modification on ATSAM3N1BB-MU.

Request Quote (Ships tomorrow)