ATP404-H-TL-H MOSFET N-Channel 60V 95A Equivalent & Substitute Parts

Part Overview

The ATP404-H-TL-H is an N-channel MOSFET manufactured by onsemi, rated for 60V drain-to-source voltage and 95A continuous drain current in Surface Mount ATPAK packaging. This component is classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing design support and procurement. Substitute parts must maintain electrical compatibility across voltage, current, and thermal specifications while accommodating packaging and mounting requirements.

Substiute Parts

ATP404-H-TL-H
onsemiIn Stock: 1057ATP404-H-TL-H Datasheet
ATP404-H-TL-H
Current Part
NTD5862NT4G
onsemiIn Stock: 4571NTD5862NT4G Datasheet
NTD5862NT4G
MFR Recommended

Key Parameters

Parameter ATP404-H-TL-H
Manufacturer onsemi
Category Transistors, FETs, MOSFETs
FET Type N-Channel
Drain-to-Source Voltage (Vdss) 60V
Continuous Drain Current (Id) @ 25°C 95A (Tj)
Operating Temperature Range 150°C (TJ)
Mounting Type Surface Mount
Package Type ATPAK (2 Leads + Tab)
Product Status Obsolete
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited)
REACH Status REACH Unaffected

Substitute Part Grouping Explanation

Substitution of the ATP404-H-TL-H is determined by the following critical electrical and mechanical parameters:

Electrical Compatibility Criteria:

  • Drain-to-Source Voltage (Vdss): Must equal or exceed 60V
  • Continuous Drain Current (Id): Must equal or exceed 95A at rated temperature
  • FET Type: N-Channel topology required
  • Technology: MOSFET (Metal Oxide) construction

Mechanical & Environmental Criteria:

  • Mounting Type: Surface Mount required
  • RoHS Compliance: ROHS3 Compliant status maintained
  • Moisture Sensitivity: MSL 1 (Unlimited) preferred for handling compatibility
  • REACH Status: REACH Unaffected maintained

Package Consideration: The ATP404-H-TL-H uses ATPAK packaging. Substitute parts may employ alternative Surface Mount packages (such as DPAK/TO-252-3) provided electrical performance and thermal characteristics remain within design margins. Package transitions require PCB layout verification.

The onsemi NTD5862NT4G meets all electrical substitution criteria with equivalent voltage rating (60V), superior current rating (98A vs. 95A), and maintains full compliance certifications.

Parameter Comparison

Parameter ATP404-H-TL-H NTD5862NT4G Compatibility
Manufacturer onsemi onsemi Same
FET Type N-Channel N-Channel Compatible
Drain-to-Source Voltage (Vdss) 60V 60V Equal
Continuous Drain Current (Id) @ 25°C 95A (Tj) 98A (Tc) Substitute Exceeds
Technology Not specified MOSFET (Metal Oxide) Standard MOSFET
Operating Temperature (Max) 150°C (TJ) 175°C (TJ) Substitute Exceeds
Mounting Type Surface Mount Surface Mount Compatible
Package Type ATPAK (2 Leads + Tab) DPAK/TO-252-3 (2 Leads + Tab) Different Package
RoHS Status ROHS3 Compliant ROHS3 Compliant Compatible
Moisture Sensitivity Level 1 (Unlimited) 1 (Unlimited) Compatible
REACH Status REACH Unaffected REACH Unaffected Compatible
Product Status Obsolete Obsolete Both Obsolete

Engineering Selection Recommendations

Primary Substitute: NTD5862NT4G

The NTD5862NT4G is the onsemi-recommended substitute for ATP404-H-TL-H applications. This part maintains electrical equivalence across all critical parameters:

  • Voltage rating identical at 60V Vdss
  • Current rating superior at 98A continuous drain current versus 95A
  • Maximum junction temperature rating increased to 175°C, providing thermal margin
  • Full ROHS3 compliance and REACH unaffected status preserved
  • Moisture sensitivity level maintained at MSL 1 (Unlimited)

Package Transition Consideration:

The NTD5862NT4G employs DPAK/TO-252-3 packaging in place of the original ATPAK. Both packages feature 2 leads plus tab configuration with identical electrical connectivity (Gate, Drain, Source). PCB layout modifications are required to accommodate the different footprint geometry. Thermal performance characteristics of DPAK packaging are suitable for equivalent power dissipation applications.

Compliance Status:

Both the ATP404-H-TL-H and NTD5862NT4G maintain ROHS3 compliance and REACH unaffected status, supporting continued use in regulated manufacturing environments without additional material declaration requirements.

Frequently Asked Questions (FAQ)

Q: Can NTD5862NT4G directly replace ATP404-H-TL-H without circuit modification?

A: Electrical substitution is direct. The 60V voltage rating, N-channel topology, and gate-drain-source pin configuration are identical. However, the package footprint differs (DPAK versus ATPAK), requiring PCB layout changes. No circuit schematic modifications are necessary.

Q: What is the significance of the current rating difference (95A vs. 98A)?

A: The NTD5862NT4G exceeds the original specification, providing 3A additional continuous drain current capacity. This represents a performance improvement with no compatibility concerns for designs rated at or below 95A.

Q: Are there thermal performance differences between ATPAK and DPAK packages?

A: Both packages feature tab-based thermal dissipation to PCB ground planes. DPAK (TO-252-3) is a widely standardized package with established thermal modeling. Thermal performance depends on PCB copper area, via placement, and layer stackup. Consult package thermal resistance specifications for specific application thermal analysis.

Q: Why are both parts classified as obsolete?

A: Obsolete status indicates these components are no longer in active production by onsemi. Existing inventory remains available through authorized distributors. For new designs, evaluation of current-generation onsemi MOSFET offerings is recommended for long-term supply assurance.

Q: Does the substitute part maintain the same moisture sensitivity handling requirements?

A: Yes. Both ATP404-H-TL-H and NTD5862NT4G carry MSL 1 (Unlimited) classification, indicating no moisture sensitivity restrictions. Standard surface mount handling procedures apply without special dry-pack or bake-out requirements.

Q: What compliance certifications are maintained in substitution?

A: Both parts maintain ROHS3 compliance and REACH unaffected status. No additional material declarations or compliance documentation changes are required for regulated applications.

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