ATP208-TL-H N-Channel 40V 90A MOSFET Equivalent & Substitute Parts

Part Overview

The ATP208-TL-H is an N-Channel MOSFET manufactured by onsemi, rated for 40V drain-to-source voltage and 90A continuous drain current in ATPAK surface mount packaging. This device is discontinued at DiGi Electronics, necessitating identification of functionally equivalent alternatives for ongoing design requirements and production support.

The ATP208-TL-H serves applications requiring high current switching capability at moderate voltage levels with compact surface mount integration. Substitute parts must maintain electrical compatibility across voltage, current, and thermal specifications while accommodating packaging constraints.

Key Parameters

Parameter	ATP208-TL-H	Unit
FET Type	N-Channel	—
Drain-to-Source Voltage (Vdss)	40	V
Continuous Drain Current (Id) @ 25°C	90	A (Ta)
On-Resistance (Rds On) @ 45A, 10V	6	mOhm
Gate Charge (Qg) @ 10V	83	nC
Input Capacitance (Ciss) @ 20V	4510	pF
Power Dissipation (Max)	60	W (Tc)
Gate Voltage (Vgs Max)	±20	V
Operating Temperature (TJ)	150	°C
Mounting Type	Surface Mount	—
Package	ATPAK (2 Leads + Tab)	—
Technology	MOSFET (Metal Oxide)	—
RoHS Status	ROHS3 Compliant	—

Substitute Part Grouping Explanation

Substitution of the ATP208-TL-H is determined by the following critical electrical and mechanical parameters:

Electrical Compatibility Criteria:

Drain-to-Source Voltage (Vdss): Must equal or exceed 40V
Continuous Drain Current (Id): Must equal or exceed 90A at rated temperature
On-Resistance (Rds On): Must not exceed 6mOhm at specified gate voltage to maintain thermal performance
Gate Voltage (Vgs): Must accommodate ±20V maximum rating
Operating Temperature: Must support minimum 150°C junction temperature

Mechanical Compatibility Criteria:

Mounting Type: Surface Mount required
Package Type: ATPAK, DPAK, or equivalent 2-lead + tab configurations
Lead Configuration: Compatible with existing PCB footprints

Regulatory Compliance:

RoHS3 Compliance required
REACH Unaffected status required

The substitute parts identified below meet these criteria with variations in package form factor and thermal dissipation capability. Package differences require PCB layout evaluation but do not affect electrical functionality.

Parameter Comparison

Parameter	ATP208-TL-H (onsemi)	FDD8453LZ-F085 (onsemi)	STD95N4LF3 (STMicroelectronics)	STD80N4F6 (STMicroelectronics)	Unit
FET Type	N-Channel	N-Channel	N-Channel	N-Channel	—
Vdss	40	40	40	40	V
Continuous Drain Current (Id) @ 25°C	90 (Ta)	50 (Tc)	80 (Tc)	80 (Tc)	A
Rds On (Max) @ 10V	6 @ 45A	6.7 @ 15A	6 @ 40A	6 @ 40A	mOhm
Gate Charge (Qg) @ 10V	83	64	70	36	nC
Input Capacitance (Ciss) @ 20-25V	4510 @ 20V	3515 @ 20V	2500 @ 25V	2150 @ 25V	pF
Power Dissipation (Max)	60 (Tc)	118 (Tc)	110 (Tc)	70 (Tc)	W
Vgs (Max)	±20	±20	±16	±20	V
Operating Temperature (TJ)	150	−55 to 175	−55 to 175	−55 to 175	°C
Package	ATPAK (2 Leads + Tab)	TO-252-3, DPAK (2 Leads + Tab)	TO-252-3, DPAK (2 Leads + Tab)	TO-252-3, DPAK (2 Leads + Tab)	—
Product Status	Discontinued	Obsolete	Active	Active	—
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	—

Engineering Selection Recommendations

STD95N4LF3 (STMicroelectronics) – Primary Substitute

The STD95N4LF3 is the recommended primary substitute for the ATP208-TL-H. This device maintains 40V Vdss rating and delivers 80A continuous drain current, meeting the majority of applications requiring the original part. The STD95N4LF3 features identical 6mOhm on-resistance at 10V gate voltage, ensuring equivalent switching losses and thermal performance. Active product status ensures long-term availability and supply chain stability. The DPAK package is mechanically compatible with ATPAK footprints through standard PCB layout adaptation. Operating temperature range extends to 175°C, exceeding the ATP208-TL-H specification. RoHS3 compliance and AEC-Q101 automotive qualification provide regulatory assurance.

STD80N4F6 (STMicroelectronics) – Secondary Substitute

The STD80N4F6 serves as an alternative for applications where reduced gate charge and input capacitance are beneficial. This device maintains 40V Vdss and 80A continuous drain current with identical 6mOhm on-resistance. Gate charge of 36nC (versus 83nC in ATP208-TL-H) reduces driver power requirements and switching losses in high-frequency applications. Input capacitance of 2150pF provides improved switching speed. Active product status and AEC-Q101 qualification support automotive and industrial applications. DPAK packaging requires footprint adaptation identical to STD95N4LF3.

FDD8453LZ-F085 (onsemi) – Limited Substitution

The FDD8453LZ-F085 maintains onsemi manufacturer continuity and 40V Vdss rating but delivers only 50A continuous drain current, representing a 44% reduction from ATP208-TL-H specification. This part is suitable only for applications where current requirements do not exceed 50A. Obsolete product status limits long-term availability. Enhanced power dissipation rating of 118W (versus 60W in ATP208-TL-H) provides thermal margin in lower-current designs. DPAK packaging is mechanically compatible with ATPAK through standard adaptation.

Product Status Considerations:

STD95N4LF3 and STD80N4F6 are active products with confirmed ongoing manufacturing and distribution. These parts are preferred for new designs and production continuity. FDD8453LZ-F085 is obsolete, limiting suitability for long-term production requirements.

Frequently Asked Questions (FAQ)

Q: Can the STD95N4LF3 directly replace the ATP208-TL-H without PCB modifications?

A: The STD95N4LF3 uses DPAK packaging while the ATP208-TL-H uses ATPAK packaging. Both are 2-lead + tab surface mount configurations with identical electrical pin functions. PCB footprint adaptation is required, but no circuit modifications are necessary. Electrical performance is equivalent.

Q: What is the current rating difference between ATP208-TL-H and STD95N4LF3?

A: The ATP208-TL-H is rated for 90A continuous drain current (Ta measurement), while STD95N4LF3 is rated for 80A (Tc measurement). The 10A difference reflects different measurement conditions. For applications requiring the full 90A capability, thermal analysis is required to confirm STD95N4LF3 suitability.

Q: Are the STD95N4LF3 and STD80N4F6 interchangeable?

A: Both devices share identical 40V Vdss, 80A Id, and 6mOhm Rds On specifications. The primary difference is gate charge (70nC versus 36nC) and input capacitance (2500pF versus 2150pF). STD80N4F6 is preferred for high-frequency switching applications where reduced gate charge minimizes driver power dissipation. Both are electrically compatible in standard switching applications.

Q: Why is the FDD8453LZ-F085 listed as a substitute if it has lower current rating?

A: The FDD8453LZ-F085 is included for applications where current requirements do not exceed 50A. It maintains 40V Vdss and equivalent on-resistance, making it suitable for reduced-current designs. Obsolete status makes it unsuitable for new production planning.

Q: What packaging considerations apply when substituting ATPAK with DPAK?

A: ATPAK and DPAK are both 2-lead + tab surface mount packages with identical electrical pin configuration. DPAK (TO-252-3) has different physical dimensions and thermal pad geometry. PCB layout must accommodate the new package footprint. Thermal performance may differ due to package design variations; thermal analysis is recommended for high-power applications.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. ATP208-TL-H, FDD8453LZ-F085, STD95N4LF3, and STD80N4F6 are all ROHS3 Compliant with REACH Unaffected status, meeting current environmental and regulatory requirements.

Q: Which substitute part has the best long-term availability?

A: STD95N4LF3 and STD80N4F6 are both active products with confirmed ongoing manufacturing. These parts are preferred for designs requiring long-term production support. FDD8453LZ-F085 is obsolete and should not be selected for new production planning.

Q: Can the STD80N4F6 be used in applications requiring 90A continuous current?

A: No. STD80N4F6 is rated for 80A continuous drain current. Applications requiring 90A must use ATP208-TL-H or evaluate thermal performance with STD95N4LF3 under specific operating conditions.

Q: What is the significance of the different operating temperature ranges?

A: ATP208-TL-H specifies 150°C maximum junction temperature. STD95N4LF3 and STD80N4F6 specify −55°C to 175°C operating range, providing extended high-temperature capability. This difference does not prevent substitution but indicates improved thermal performance margin in the STMicroelectronics alternatives.

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