ATP114-TL-H MOSFET P-Channel 60V 55A Equivalent & Substitute Parts

Part Overview

The ATP114-TL-H is a P-Channel MOSFET manufactured by onsemi, rated for 60V drain-to-source voltage with 55A continuous drain current at 25°C. This device is packaged in the ATPAK surface mount configuration and is designed for applications requiring moderate to high current switching in P-channel configurations.

The ATP114-TL-H carries an Obsolete product status. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for systems utilizing this component.

Substiute Parts

ATP114-TL-H
onsemiIn Stock: 1135ATP114-TL-H Datasheet
ATP114-TL-H
Current Part
TJ50S06M3L(T6L1,NQ
Toshiba Semiconductor and StorageIn Stock: 3146TJ50S06M3L(T6L1,NQ Datasheet
TJ50S06M3L(T6L1,NQ
Similar

Key Parameters

Parameter Value Unit
FET Type P-Channel
Drain to Source Voltage (Vdss) 60 V
Current - Continuous Drain (Id) @ 25°C 55 A (Ta)
Rds On (Max) @ Id, Vgs 16 mOhm @ 28A, 10V
Gate Charge (Qg) (Max) @ Vgs 92 nC @ 10V
Power Dissipation (Max) 60 W (Tc)
Operating Temperature (TJ) 150 °C
Mounting Type Surface Mount
Package / Case ATPAK (2 Leads+Tab)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitute parts for the ATP114-TL-H are identified based on the following critical electrical and mechanical parameters:

Electrical Compatibility Criteria:

  • FET Type: P-Channel topology
  • Drain to Source Voltage (Vdss): 60V minimum rating
  • Continuous Drain Current (Id): Rated at or above 50A at 25°C
  • On-State Resistance (Rds On): Performance within acceptable switching loss parameters
  • Gate Charge (Qg): Comparable drive requirements
  • Power Dissipation: Thermal capability suitable for application demands

Mechanical Compatibility Criteria:

  • Mounting Type: Surface Mount
  • Package Configuration: Alternative surface mount packages acceptable if thermal and electrical performance maintained
  • Lead Configuration: 2 Leads + Tab standard

Compliance & Regulatory Criteria:

  • RoHS3 Compliance: Required
  • Moisture Sensitivity Level: MSL 1 or equivalent
  • ECCN & HTSUS Classification: Consistent with original component

The TJ50S06M3L(T6L1,NQ substitute part meets these criteria through equivalent P-Channel topology, matching 60V Vdss rating, comparable continuous drain current specification, and superior thermal performance characteristics.

Parameter Comparison

Parameter ATP114-TL-H (Main) TJ50S06M3L(T6L1,NQ (Substitute) Unit
Manufacturer onsemi Toshiba Semiconductor and Storage
FET Type P-Channel P-Channel
Drain to Source Voltage (Vdss) 60 60 V
Current - Continuous Drain (Id) @ 25°C 55 50 A (Ta)
Rds On (Max) @ Id, Vgs 16 @ 28A, 10V 13.8 @ 25A, 10V mOhm
Gate Charge (Qg) (Max) @ Vgs 92 @ 10V 124 @ 10V nC
Power Dissipation (Max) 60 (Tc) 90 (Tc) W
Operating Temperature (TJ) 150 175 °C
Mounting Type Surface Mount Surface Mount
Package / Case ATPAK (2 Leads+Tab) TO-252-3, DPAK (2 Leads + Tab), SC-63
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)

Engineering Selection Recommendations

Product Status Consideration: The ATP114-TL-H carries Obsolete status, while the TJ50S06M3L(T6L1,NQ is classified as Active. The substitute part maintains current manufacturing support and supply chain availability.

Electrical Performance: Both parts share identical 60V Vdss ratings and P-Channel topology. The substitute part delivers 50A continuous drain current, representing a 9% reduction from the original 55A specification. The substitute exhibits lower on-state resistance (13.8 mOhm versus 16 mOhm), resulting in reduced conduction losses. Gate charge increases from 92 nC to 124 nC, indicating slightly higher drive requirements but within acceptable switching performance parameters.

Thermal Performance: The substitute part provides 90W maximum power dissipation compared to 60W in the original, with maximum junction temperature of 175°C versus 150°C. This enhanced thermal capability supports higher power applications and provides additional design margin.

Compliance & Regulatory: Both components maintain ROHS3 compliance, MSL 1 rating, and identical ECCN/HTSUS classifications. No regulatory barriers exist for substitution.

Package Consideration: The substitute employs DPAK+ (TO-252-3) packaging versus the original ATPAK configuration. PCB layout modifications are required to accommodate the different package footprint. Both packages maintain 2 Leads + Tab configuration with equivalent thermal tab functionality.

Frequently Asked Questions (FAQ)

Q: Can the TJ50S06M3L(T6L1,NQ directly replace the ATP114-TL-H without circuit modifications?

A: Electrical substitution is valid based on matching Vdss (60V), P-Channel topology, and comparable continuous drain current (50A versus 55A). However, package geometry differs between ATPAK and DPAK+, requiring PCB layout redesign. Gate charge increase (92 nC to 124 nC) may necessitate gate drive circuit evaluation for switching speed compatibility.

Q: What is the current rating difference between these parts, and does it affect application suitability?

A: The substitute part is rated for 50A continuous drain current compared to 55A in the original. This represents a 9% reduction. Applications operating below 50A continuous current experience no functional impact. Applications requiring the full 55A specification require alternative parts or circuit redesign.

Q: Are there thermal performance implications when substituting these parts?

A: The substitute part provides superior thermal performance with 90W maximum power dissipation versus 60W, and maximum junction temperature of 175°C versus 150°C. This enhancement allows operation at higher power levels or provides additional thermal margin in existing applications.

Q: What package considerations apply to this substitution?

A: The ATP114-TL-H uses ATPAK packaging while the substitute employs DPAK+ (TO-252-3). These packages have different footprints, lead spacing, and thermal tab dimensions. PCB redesign is required. Both maintain 2 Leads + Tab configuration with equivalent thermal functionality.

Q: Do compliance certifications differ between these parts?

A: Both parts maintain identical ROHS3 compliance, MSL 1 rating, and ECCN/HTSUS classifications. No regulatory or compliance barriers exist for substitution.

Q: What is the supply availability status for each part?

A: The ATP114-TL-H is classified as Obsolete with 1077 pieces in current inventory. The TJ50S06M3L(T6L1,NQ is classified as Active with 3129 pieces in inventory, indicating ongoing manufacturing support and superior long-term availability.

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