ATP112-TL-H Equivalent & Substitute Parts

Part Overview

The ATP112-TL-H is a P-Channel 60V 25A MOSFET manufactured by onsemi in ATPAK surface mount packaging. This device is classified as obsolete, necessitating identification of equivalent and substitute components for ongoing design support and production requirements. The ATP112-TL-H serves applications requiring moderate current handling at 60V drain-source voltage with integrated thermal management through its ATPAK package configuration.

Substiute Parts

ATP112-TL-H

onsemiIn Stock: 4782ATP112-TL-H Datasheet

Current PartRFQ

ATP113-TL-H

onsemiIn Stock: 2337ATP113-TL-H Datasheet

DirectRFQ

AOD409

Alpha & Omega Semiconductor Inc.In Stock: 250232AOD409 Datasheet

SimilarRFQ

NP20P06SLG-E1-AY

Renesas Electronics CorporationIn Stock: 40706NP20P06SLG-E1-AY Datasheet

SimilarRFQ

TJ15S06M3L(T6L1,NQ

Toshiba Semiconductor and StorageIn Stock: 811TJ15S06M3L(T6L1,NQ Datasheet

SimilarRFQ

TSM680P06CP ROG

Taiwan Semiconductor CorporationIn Stock: 1467TSM680P06CP ROG Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the ATP112-TL-H is determined by the following critical parameters:

Electrical Compatibility Criteria:

• Drain to Source Voltage (Vdss) must equal or exceed 60V
• Continuous Drain Current (Id) must meet or exceed 25A at 25°C
• Gate Charge (Qg) and Input Capacitance (Ciss) must remain within acceptable ranges to preserve circuit timing and drive requirements
• On-resistance (Rds On) characteristics must support the intended power dissipation profile

Mechanical and Packaging Criteria:

• Surface mount mounting type required
• Package compatibility: ATPAK packages provide direct pin-for-pin substitution; TO-252 (DPAK) packages require PCB layout modification but maintain electrical functionality
• Thermal performance: Power dissipation rating must support application requirements

Compliance and Availability:

• RoHS3 compliance required
• MSL rating of 1 (Unlimited) preferred for supply chain flexibility
• Active product status preferred for long-term availability

Substitute parts are grouped into two categories: direct ATPAK package equivalents and functionally compatible TO-252 (DPAK) alternatives with higher current ratings or improved thermal characteristics.

Parameter Comparison

Engineering Selection Recommendations

Direct ATPAK Package Substitution:

The ATP113-TL-H is the primary direct substitute for the ATP112-TL-H. Both devices share identical ATPAK packaging, enabling pin-for-pin replacement without PCB modification. The ATP113-TL-H provides superior electrical performance with 35A continuous drain current (versus 25A), 29.5mOhm on-resistance (versus 43mOhm), and 50W power dissipation (versus 40W). The ATP113-TL-H maintains active product status with ROHS3 compliance and MSL 1 rating, ensuring long-term availability and supply chain reliability.

TO-252 (DPAK) Package Alternatives:

For applications where package footprint modification is acceptable, three TO-252 alternatives provide functional substitution with varying current and thermal characteristics:

• AOD409 (Alpha & Omega Semiconductor Inc.): Delivers 26A continuous drain current with 40mOhm on-resistance and 60W power dissipation. Extended operating temperature range (-55°C to 175°C) supports demanding thermal environments. Active product status with 250,200 units in inventory provides exceptional supply availability.

• NP20P06SLG-E1-AY (Renesas Electronics Corporation): Rated for 20A continuous drain current with 48mOhm on-resistance and 38W power dissipation. Operating temperature extends to 175°C. Active product status with 40,600 units in inventory supports production continuity.

• TJ15S06M3L(T6L1,NQ (Toshiba Semiconductor and Storage): Provides 15A continuous drain current with 50mOhm on-resistance and 41W power dissipation. U-MOSVI series designation indicates optimized switching characteristics. Active product status with 175°C maximum junction temperature.

Lower-Performance Alternative:

The TSM680P06CP ROG (Taiwan Semiconductor Corporation) operates at 18A continuous drain current with 68mOhm on-resistance and 20W power dissipation. This device exhibits the lowest gate charge (16.4nC) and input capacitance (870pF), beneficial for high-frequency switching applications. MSL 3 rating requires controlled moisture exposure during storage and assembly.

Selection Criteria Summary:

• Pin-for-pin replacement with enhanced performance: ATP113-TL-H
• Higher current capacity with extended temperature range: AOD409
• Balanced performance with active status: NP20P06SLG-E1-AY or TJ15S06M3L(T6L1,NQ
• High-frequency switching optimization: TSM680P06CP ROG

All recommended substitutes maintain ROHS3 compliance and EAR99 export classification consistent with the original ATP112-TL-H specification.

Frequently Asked Questions (FAQ)

Q: Can the ATP113-TL-H directly replace the ATP112-TL-H without PCB modification?

A: Yes. The ATP113-TL-H shares identical ATPAK packaging with the ATP112-TL-H, enabling direct pin-for-pin substitution. No PCB layout changes are required. The ATP113-TL-H provides improved electrical performance with higher current rating (35A versus 25A) and lower on-resistance (29.5mOhm versus 43mOhm).

Q: What is the primary difference between ATPAK and TO-252 (DPAK) packages?

A: ATPAK and TO-252 (DPAK) packages differ in physical footprint and thermal characteristics. ATPAK packages are optimized for higher current applications with enhanced thermal dissipation. TO-252 (DPAK) packages are smaller and more widely used across the industry. Substitution from ATPAK to TO-252 requires PCB layout modification but maintains electrical functionality.

Q: Which substitute part offers the best thermal performance?

A: The AOD409 provides the highest power dissipation rating at 60W (Tc), exceeding the original ATP112-TL-H specification of 40W (Tc). The AOD409 also features an extended operating temperature range (-55°C to 175°C), supporting applications in extreme thermal environments.

Q: Is the TSM680P06CP ROG suitable for high-frequency switching applications?

A: Yes. The TSM680P06CP ROG exhibits the lowest gate charge (16.4nC) and input capacitance (870pF) among all substitute options, reducing switching losses and enabling higher frequency operation. However, this device is rated for only 18A continuous drain current, making it suitable for lower-current applications.

Q: What does MSL 3 rating mean for the TSM680P06CP ROG?

A: MSL 3 (Moisture Sensitivity Level 3) indicates the device requires controlled moisture exposure during storage and assembly. Components with MSL 3 rating must be baked before reflow soldering if exposed to ambient humidity for extended periods. MSL 1 devices (ATP113-TL-H, AOD409, NP20P06SLG-E1-AY, TJ15S06M3L) have unlimited shelf life and do not require moisture control procedures.

Q: Can I use the NP20P06SLG-E1-AY if my application requires 25A continuous drain current?

A: The NP20P06SLG-E1-AY is rated for 20A continuous drain current, which is below the 25A requirement of the ATP112-TL-H. This device is not suitable for applications requiring the full 25A specification. The ATP113-TL-H (35A), AOD409 (26A), or TJ15S06M3L (15A with thermal derating) should be evaluated based on actual current requirements.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All substitute parts listed (ATP113-TL-H, AOD409, NP20P06SLG-E1-AY, TJ15S06M3L, TSM680P06CP ROG) maintain ROHS3 compliance, consistent with the original ATP112-TL-H specification.

Q: What is the inventory status of each substitute part?

A: ATP113-TL-H: 2,300 units; AOD409: 250,200 units; NP20P06SLG-E1-AY: 40,600 units; TJ15S06M3L: 782 units; TSM680P06CP ROG: 1,430 units. The AOD409 offers the highest inventory availability for immediate production requirements.