AT90PWM3-16SQ Equivalent & Substitute Parts

Part Overview

The AT90PWM3-16SQ is an 8-bit AVR microcontroller from the AVR 90PWM Lighting series, designed for embedded lighting control applications. This device features 8KB of FLASH program memory, 512 bytes of EEPROM, and 512 bytes of RAM, operating at 16MHz with a supply voltage range of 2.7V to 5.5V. The part is currently classified as Obsolete, making identification of functionally equivalent alternatives essential for ongoing design support and production continuity.

Key Parameters

Parameter	Value
Core Processor	AVR
Core Size	8-Bit
Speed	16MHz
Program Memory Size	8KB (8K x 8)
Program Memory Type	FLASH
EEPROM Size	512 x 8
RAM Size	512 x 8
Voltage Supply (Vcc/Vdd)	2.7V ~ 5.5V
Number of I/O	27
Data Converters	A/D 11x10b, D/A 1x10b
Connectivity	SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT
Operating Temperature	-40°C ~ 105°C (TA)
Mounting Type	Surface Mount
Package	32-SOIC (0.295", 7.50mm Width)
Product Status	Obsolete
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the AT90PWM3-16SQ is determined by strict equivalence across the following critical parameters:

Core Architecture: AVR processor family
Memory Configuration: 8KB FLASH, 512 bytes EEPROM, 512 bytes RAM
Clock Speed: 16MHz operation
Voltage Range: 2.7V to 5.5V supply compatibility
I/O Count: 27 I/O pins
Peripheral Set: SPI, UART/USART, PWM, WDT, Brown-out Detect/Reset, POR
Data Conversion: 11-channel 10-bit A/D, 1-channel 10-bit D/A
Temperature Range: -40°C to 105°C operation

The AT90PWM3-16MQ meets all these criteria with identical electrical and functional specifications. The primary difference is packaging: the substitute uses 32-QFN (5x5) instead of 32-SOIC, requiring PCB layout modification but maintaining full functional compatibility.

Parameter Comparison

Parameter	AT90PWM3-16SQ (Main)	AT90PWM3-16MQ (Substitute)
Manufacturer	Microchip Technology	Atmel
Core Processor	AVR	AVR
Core Size	8-Bit	8-Bit
Speed	16MHz	16MHz
Program Memory	8KB (8K x 8) FLASH	8KB (8K x 8) FLASH
EEPROM	512 x 8	512 x 8
RAM	512 x 8	512 x 8
Voltage Supply	2.7V ~ 5.5V	2.7V ~ 5.5V
I/O Pins	27	27
A/D Converters	11x10b	11x10b
D/A Converters	1x10b	1x10b
Connectivity	SPI, UART/USART	SPI, UART/USART
Peripherals	Brown-out Detect/Reset, POR, PWM, WDT	Brown-out Detect/Reset, POR, PWM, WDT
Operating Temperature	-40°C ~ 105°C	-40°C ~ 105°C
Mounting Type	Surface Mount	Surface Mount
Package Type	32-SOIC	32-QFN (5x5)
Product Status	Obsolete	Active
RoHS Compliance	ROHS3 Compliant	Not specified in data

Engineering Selection Recommendations

The AT90PWM3-16MQ is the direct functional equivalent for the obsolete AT90PWM3-16SQ. Both devices share identical electrical specifications, memory configuration, and peripheral functionality. The substitute part is currently in Active product status, ensuring long-term availability and supply chain stability compared to the Obsolete main part.

The primary design consideration is packaging transition from 32-SOIC to 32-QFN (5x5). This change requires PCB footprint redesign and may affect thermal management characteristics due to the exposed pad in QFN packaging. Pin-to-pin functionality remains identical, allowing firmware and software to transfer without modification.

Both parts maintain ROHS3 compliance and operate across the full -40°C to 105°C temperature range, supporting equivalent environmental and regulatory requirements.

Frequently Asked Questions (FAQ)

Q: Can AT90PWM3-16MQ directly replace AT90PWM3-16SQ without firmware changes?

A: Yes. Both parts implement identical AVR core architecture, memory configuration, and peripheral sets. Firmware compiled for AT90PWM3-16SQ executes without modification on AT90PWM3-16MQ.

Q: What is the primary difference between these parts?

A: Package type differs: AT90PWM3-16SQ uses 32-SOIC (0.295", 7.50mm width), while AT90PWM3-16MQ uses 32-QFN (5x5). Electrical and functional specifications are identical.

Q: Does the QFN package affect thermal performance?

A: QFN packaging includes an exposed pad that can improve thermal dissipation compared to SOIC. PCB layout must accommodate the exposed pad for optimal thermal performance.

Q: Are there any compliance differences?

A: Both parts comply with ROHS3 standards and operate across -40°C to 105°C. The substitute part is currently Active in product status, providing better long-term availability than the Obsolete main part.

Q: What are the pin count and I/O requirements?

A: Both parts provide 27 I/O pins within a 32-pin package. Pin assignments and functionality are identical between SOIC and QFN variants.

Q: Can I use the same PCB footprint for both parts?

A: No. SOIC and QFN packages require different PCB footprints. PCB redesign is necessary to accommodate the QFN package geometry and exposed pad.

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