AT88SC0204CA-MJTG Equivalent & Substitute Parts

Part Overview

The AT88SC0204CA-MJTG is a Secure Memory M2 - J Module (TWI) manufactured by Microchip Technology, part of the CryptoMemory® series. This component is an integrated circuit designed for embedded and smart card applications requiring secure memory functionality. The part is currently in active product status with 1025 pieces available in new original inventory.

Substitute parts are identified when equivalent electrical and mechanical parameters are maintained across different package configurations. The AT88SC0204CA-MJTG utilizes an M2 J Smart Card Module (TWI) package, while alternative configurations of the same base product (AT88SC0204) are available in different package types to accommodate varying design requirements and assembly processes.

Substiute Parts

AT88SC0204CA-MJTG
Microchip TechnologyIn Stock: 1091AT88SC0204CA-MJTG Datasheet
AT88SC0204CA-MJTG
Current Part
AT88SC0204CA-SH-T
Microchip TechnologyIn Stock: 4423AT88SC0204CA-SH-T Datasheet
AT88SC0204CA-SH-T
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number AT88SC0204CA-MJTG
Manufacturer Microchip Technology
Base Product Number AT88SC0204
Series CryptoMemory®
Type Secure Memory
Package / Case M2 J, Smart Card Module (TWI)
Mounting Type Surface Mount
Applications Embedded, Smart Card
Product Status Active
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)
REACH Status REACH Unaffected
ECCN 5A992C
HTSUS 8542.32.0051

Substitute Part Grouping Explanation

Substitution of the AT88SC0204CA-MJTG is determined by equivalence in the following core parameters:

Electrical Equivalence Criteria:

  • Base product number (AT88SC0204)
  • Series designation (CryptoMemory®)
  • Functional type (Secure Memory)
  • Application compatibility (Embedded, Smart Card)

Compliance & Regulatory Equivalence:

  • RoHS3 Compliance status
  • REACH Unaffected designation
  • ECCN classification (5A992C)
  • HTSUS code (8542.32.0051)
  • Moisture Sensitivity Level (MSL 3)

Mechanical Substitution Constraints:

  • Package configuration differences determine physical compatibility
  • Mounting type remains Surface Mount across all variants
  • Supplier device package specifications must align with PCB design requirements

The AT88SC0204CA-SH-T represents a manufacturer-recommended substitute variant utilizing an 8-SOIC package configuration instead of the M2 J Smart Card Module format. Both parts share identical electrical specifications, compliance certifications, and base product functionality while differing in physical form factor and assembly methodology.

Parameter Comparison

Parameter AT88SC0204CA-MJTG (Main Part) AT88SC0204CA-SH-T (Substitute)
Manufacturer Microchip Technology Microchip Technology
Base Product Number AT88SC0204 AT88SC0204
Series CryptoMemory® CryptoMemory®
Type Secure Memory Secure Memory
Applications Embedded, Smart Card Embedded, Smart Card
Mounting Type Surface Mount Surface Mount
Package / Case M2 J, Smart Card Module (TWI) 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package M2 - J Module (TWI) 8-SOIC
Product Status Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
MSL 3 (168 Hours) 3 (168 Hours)
REACH Status REACH Unaffected REACH Unaffected
ECCN 5A992C 5A992C
HTSUS 8542.32.0051 8542.32.0051

Engineering Selection Recommendations

Active Product Status: Both the AT88SC0204CA-MJTG and AT88SC0204CA-SH-T maintain active product status with Microchip Technology, ensuring continued manufacturing support and availability.

Regulatory Compliance: Both parts satisfy ROHS3 compliance requirements and maintain REACH Unaffected status, meeting international environmental and hazardous substance directives. Identical ECCN and HTSUS classifications confirm equivalent export control and tariff treatment.

Moisture Sensitivity: Both variants specify MSL 3 (168 Hours), requiring identical handling and storage protocols during manufacturing and assembly operations.

Package Selection Basis: Selection between AT88SC0204CA-MJTG and AT88SC0204CA-SH-T depends exclusively on PCB design requirements and assembly process compatibility. The M2 J Smart Card Module (TWI) package is appropriate for smart card form factor applications, while the 8-SOIC package accommodates standard surface mount assembly processes on conventional printed circuit boards.

Inventory Availability: AT88SC0204CA-MJTG: 1025 pieces. AT88SC0204CA-SH-T: 4400 pieces. Substitute availability may influence procurement decisions based on project timeline requirements.

Frequently Asked Questions (FAQ)

Q: Can AT88SC0204CA-SH-T replace AT88SC0204CA-MJTG in all applications?

A: Electrical and functional equivalence is confirmed. Physical compatibility depends on PCB design and assembly methodology. The M2 J Smart Card Module package differs from the 8-SOIC package in form factor, pin configuration, and mounting interface. Design review is required to confirm mechanical compatibility with existing PCB layouts.

Q: What are the key differences between these substitute parts?

A: The primary difference is package configuration. AT88SC0204CA-MJTG uses an M2 J Smart Card Module (TWI) format designed for smart card applications. AT88SC0204CA-SH-T uses an 8-SOIC package for conventional surface mount assembly. All electrical specifications, compliance certifications, and functional parameters are identical.

Q: Are both parts RoHS3 compliant?

A: Yes. Both AT88SC0204CA-MJTG and AT88SC0204CA-SH-T are ROHS3 compliant and REACH unaffected, meeting current environmental regulations.

Q: What is the significance of the MSL 3 rating?

A: MSL 3 (Moisture Sensitivity Level 3) indicates a maximum floor life of 168 hours at 30°C and 60% relative humidity before reflow soldering. Both parts require identical moisture control and handling procedures during manufacturing.

Q: How do the packaging options affect procurement?

A: AT88SC0204CA-SH-T is available in Cut Tape (CT) and Digi-Reel® packaging formats, offering flexibility in order quantities and handling methods. Package selection should align with production volume requirements and assembly line capabilities.

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