AT80C32X2-SLSUM Equivalent & Substitute Parts

Part Overview

The AT80C32X2-SLSUM is an 8-bit microcontroller from Microchip Technology's 80C series, featuring a ROMless architecture with 40/20MHz dual-speed operation. This device is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and new design implementations. The ROMless configuration requires external program memory, distinguishing it from ROM-based variants and limiting direct substitution to architecturally similar devices.

Substiute Parts

AT80C32X2-SLSUM
Microchip TechnologyIn Stock: 1258AT80C32X2-SLSUM Datasheet
AT80C32X2-SLSUM
Current Part
AT80C51RD2-SLSUM
Microchip TechnologyIn Stock: 1281AT80C51RD2-SLSUM Datasheet
AT80C51RD2-SLSUM
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number AT80C32X2-SLSUM
Core Processor 80C51
Core Size 8-Bit
Speed 40/20MHz
Program Memory Type ROMless
RAM Size 256 x 8
Voltage Supply (Vcc/Vdd) 4.5V ~ 5.5V
Number of I/O 32
Package 44-PLCC (16.6x16.6)
Operating Temperature -40°C ~ 85°C (TA)
Product Status Obsolete
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the AT80C32X2-SLSUM is determined by the following critical parameters:

Core Architecture Compatibility: Both the main part and substitute must utilize the 80C51 core processor with 8-bit architecture to ensure instruction set compatibility and firmware portability.

Memory Configuration: ROMless architecture is mandatory. The substitute must support external program memory interfacing without embedded ROM, maintaining the same memory access protocol.

Package Compatibility: The 44-PLCC (16.6x16.6) package specification must be preserved to ensure PCB layout compatibility and pin-to-pin correspondence.

Electrical Specifications: Operating voltage range, I/O count (32 pins), and temperature range (-40°C ~ 85°C) define the operational envelope. Substitutes must meet or exceed these specifications.

Connectivity & Peripherals: UART/USART connectivity is required. Additional peripherals in the substitute do not disqualify compatibility but represent functional enhancements.

The AT80C51RD2-SLSUM qualifies as a direct substitute based on these criteria.

Parameter Comparison

Parameter AT80C32X2-SLSUM (Main) AT80C51RD2-SLSUM (Substitute)
Manufacturer Microchip Technology Microchip Technology
Core Processor 80C51 80C51
Core Size 8-Bit 8-Bit
Speed 40/20MHz 40MHz
Program Memory Type ROMless ROMless
RAM Size 256 x 8 1K x 8
Voltage Supply (Vcc/Vdd) 4.5V ~ 5.5V 2.7V ~ 5.5V
Number of I/O 32 32
Connectivity UART/USART UART/USART
Peripherals POR POR, PWM, WDT
Package 44-PLCC (16.6x16.6) 44-PLCC (16.6x16.6)
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Product Status Obsolete Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
REACH Status REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

The AT80C51RD2-SLSUM is the manufacturer-recommended substitute for the obsolete AT80C32X2-SLSUM. Selection of this substitute is justified on the following grounds:

Product Status: The AT80C51RD2-SLSUM maintains active product status with Microchip Technology, ensuring continued availability and supply chain reliability compared to the obsolete main part.

Regulatory Compliance: Both devices maintain ROHS3 compliance and REACH unaffected status, satisfying environmental and regulatory requirements without modification to system design or certification documentation.

Functional Equivalence: Identical core processor (80C51), package (44-PLCC), I/O configuration (32 pins), and connectivity (UART/USART) ensure firmware compatibility and PCB layout preservation.

Enhanced Specifications: The substitute provides expanded RAM (1K x 8 versus 256 x 8), extended voltage tolerance (2.7V ~ 5.5V versus 4.5V ~ 5.5V), and additional peripherals (PWM, WDT), representing functional improvements without introducing incompatibility.

Speed Consideration: The main part supports dual-speed operation (40/20MHz), while the substitute operates at 40MHz fixed. Applications requiring 20MHz operation must validate timing requirements against the 40MHz fixed clock.

Frequently Asked Questions (FAQ)

Q: Can the AT80C51RD2-SLSUM directly replace the AT80C32X2-SLSUM without PCB modifications?

A: Yes. Both devices use identical 44-PLCC packaging with matching pin assignments, I/O count, and connectivity specifications. No PCB layout changes are required.

Q: What is the primary difference between these two parts?

A: The AT80C32X2-SLSUM is obsolete, while the AT80C51RD2-SLSUM is active. The substitute offers increased RAM (1K x 8 versus 256 x 8), wider voltage range (2.7V ~ 5.5V), and additional peripherals (PWM, WDT).

Q: Will existing firmware require modification for the substitute?

A: No. Both devices implement the 80C51 instruction set architecture. Firmware compiled for the AT80C32X2-SLSUM executes identically on the AT80C51RD2-SLSUM without recompilation or modification.

Q: Does the substitute support the dual-speed (40/20MHz) operation of the main part?

A: The AT80C51RD2-SLSUM operates at 40MHz fixed frequency. Applications dependent on 20MHz operation must verify timing compatibility with the fixed 40MHz clock or implement software-based clock division if required.

Q: Are there voltage supply considerations when substituting?

A: The main part requires 4.5V ~ 5.5V operation. The substitute accepts 2.7V ~ 5.5V, providing broader voltage tolerance. Existing 5V supply designs require no modification.

Q: What is the significance of ROMless architecture for substitution?

A: ROMless devices require external program memory (typically EPROM or Flash). Both the main part and substitute maintain this architecture, ensuring compatibility with existing external memory interfaces and boot loader configurations.

Q: Are package and moisture sensitivity considerations relevant for substitution?

A: Package compatibility is confirmed (44-PLCC). Moisture sensitivity differs (MSL 2 for main part, MSL 3 for substitute), requiring adherence to respective storage and handling protocols during component procurement and assembly.

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