AT45DB021D-MH-Y Equivalent & Substitute Parts

Part Overview

The AT45DB021D-MH-Y is a 2Mbit Serial Peripheral Interface (SPI) FLASH memory IC manufactured by Renesas Electronics Corporation, packaged in an 8-UDFN (5x6) surface mount configuration. This device operates at 66 MHz and is designed for non-volatile data storage applications requiring SPI interface connectivity. The part is currently classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support, design updates, and procurement planning.

Substiute Parts

AT45DB021D-MH-Y
Renesas Electronics CorporationIn Stock: 817AT45DB021D-MH-Y Datasheet
AT45DB021D-MH-Y
Current Part
AT45DB021E-MHN-Y
Renesas Electronics CorporationIn Stock: 1561AT45DB021E-MHN-Y Datasheet
AT45DB021E-MHN-Y
MFR Recommended
AT45DB021E-MHN2B-T
Renesas Electronics CorporationIn Stock: 1981AT45DB021E-MHN2B-T Datasheet
AT45DB021E-MHN2B-T
MFR Recommended

Key Parameters

Parameter Value
Memory Size 2Mbit
Memory Format FLASH
Memory Interface SPI
Memory Organization 264 Bytes x 1024 pages
Clock Frequency 66 MHz
Voltage Supply Range 2.7V ~ 3.6V
Operating Temperature Range -40°C ~ 85°C
Package Type 8-UDFN Exposed Pad (5x6)
Mounting Type Surface Mount
Write Cycle Time (Page) 4ms

Substitute Part Grouping Explanation

Substitution of the AT45DB021D-MH-Y is determined by strict equivalence in the following critical parameters:

  • Memory Capacity: 2Mbit (non-negotiable)
  • Memory Organization: 264 Bytes x 1024 pages (architectural requirement)
  • Interface Protocol: SPI (system-level requirement)
  • Package Type: 8-UDFN Exposed Pad (5x6) (PCB layout compatibility)
  • Mounting Type: Surface Mount (assembly process compatibility)
  • Operating Temperature Range: -40°C ~ 85°C (environmental specification)
  • Base Product Number: AT45DB021 (product family designation)

The identified substitute parts AT45DB021E-MHN-Y and AT45DB021E-MHN2B-T maintain full equivalence across all critical parameters. Differences in clock frequency (70 MHz vs. 66 MHz), voltage supply range (1.65V ~ 3.6V vs. 2.7V ~ 3.6V), and packaging format (Tray vs. Tape & Reel) represent improvements or alternative delivery methods that do not compromise functional compatibility.

Parameter Comparison

Parameter AT45DB021D-MH-Y AT45DB021E-MHN-Y AT45DB021E-MHN2B-T
Manufacturer Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Memory Size 2Mbit 2Mbit 2Mbit
Memory Format FLASH FLASH FLASH
Memory Interface SPI SPI SPI
Memory Organization 264 Bytes x 1024 pages 264 Bytes x 1024 pages 264 Bytes x 1024 pages
Clock Frequency 66 MHz 70 MHz 70 MHz
Voltage Supply Range 2.7V ~ 3.6V 1.65V ~ 3.6V 1.65V ~ 3.6V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
Package / Case 8-UDFN Exposed Pad 8-UDFN Exposed Pad 8-UDFN Exposed Pad
Supplier Device Package 8-UDFN (5x6) 8-UDFN (5x6) 8-UDFN (5x6)
Mounting Type Surface Mount Surface Mount Surface Mount
Write Cycle Time (Page) 4ms 3ms 3ms
Product Status Obsolete Active Active
Packaging Format Not specified Tray Tape & Reel (TR)
RoHS Status Not specified ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours) 1 (Unlimited) 1 (Unlimited)

Engineering Selection Recommendations

Both AT45DB021E-MHN-Y and AT45DB021E-MHN2B-T are functionally equivalent substitutes for the obsolete AT45DB021D-MH-Y. Selection between these alternatives is based on procurement and assembly requirements:

AT45DB021E-MHN-Y is supplied in Tray packaging and is suitable for applications requiring standard component handling and storage procedures.

AT45DB021E-MHN2B-T is supplied in Tape & Reel (TR) format and is optimized for high-volume automated assembly operations where continuous reel feeding is required.

Both substitute parts offer improved specifications compared to the original part: higher clock frequency (70 MHz), extended voltage supply range (1.65V ~ 3.6V), faster page write cycle time (3ms), ROHS3 compliance, and superior moisture sensitivity rating (MSL 1 vs. MSL 3). These enhancements ensure superior reliability and regulatory compliance in modern applications.

Frequently Asked Questions (FAQ)

Q: Can AT45DB021E-MHN-Y or AT45DB021E-MHN2B-T be used as direct replacements for AT45DB021D-MH-Y?

A: Yes. Both parts maintain identical memory capacity (2Mbit), organization (264 Bytes x 1024 pages), SPI interface protocol, package type (8-UDFN 5x6), and operating temperature range (-40°C ~ 85°C). No circuit modifications are required for substitution.

Q: What is the difference between AT45DB021E-MHN-Y and AT45DB021E-MHN2B-T?

A: The primary difference is packaging format. AT45DB021E-MHN-Y is supplied in Tray format for standard component handling. AT45DB021E-MHN2B-T is supplied in Tape & Reel format for automated assembly lines. Electrical and functional specifications are identical.

Q: Are there any voltage compatibility concerns when substituting these parts?

A: No. The substitute parts support an extended voltage supply range (1.65V ~ 3.6V) compared to the original part (2.7V ~ 3.6V). Systems designed for the original part operate within the substitute parts' voltage range and require no modifications.

Q: Do the substitute parts meet current regulatory compliance standards?

A: Yes. Both AT45DB021E-MHN-Y and AT45DB021E-MHN2B-T are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements for electronic components.

Q: What is the significance of the improved write cycle time in the substitute parts?

A: The substitute parts feature a page write cycle time of 3ms compared to 4ms in the original part. This represents a 25% performance improvement in write operations, resulting in faster data storage operations without requiring any system-level modifications.

Q: How does the moisture sensitivity level (MSL) difference affect component handling?

A: The original part has MSL 3 (168-hour shelf life after moisture exposure). The substitute parts have MSL 1 (unlimited shelf life), indicating superior moisture resistance and more flexible storage and handling procedures without risk of moisture-induced failures.

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