Equivalent & Substitute Parts Reference: AT26DF161-MU

Part Overview

The AT26DF161-MU is a 16Mbit non-volatile FLASH memory IC manufactured by Microchip Technology. It features a SPI interface, 66 MHz clock frequency, and is housed in an 8-VDFN (6x5 mm) surface mount package. The device is currently listed as obsolete, necessitating identification of suitable substitute models with strictly matching key electrical, mechanical, and environmental parameters. Selecting an alternative is essential for ensuring supply continuity in new and legacy designs.

Substiute Parts

AT26DF161-MU
Microchip TechnologyIn Stock: 1632AT26DF161-MU Datasheet
AT26DF161-MU
Current Part
W25Q16JVZPIQ
Winbond ElectronicsIn Stock: 18525W25Q16JVZPIQ Datasheet
W25Q16JVZPIQ
MFR Recommended

Key Parameters

Manufacturer Part NumberMemory SizeMemory TypeTechnologyMemory FormatMemory OrganizationMemory InterfaceClock FrequencyWrite Cycle Time - Word, PageVoltage - SupplyOperating TemperatureMounting TypePackage / CaseSupplier Device PackageRoHS StatusMoisture Sensitivity Level (MSL)
AT26DF161-MU16MbitNon-VolatileFLASHFLASH256 Bytes x 8192 pagesSPI66 MHz5ms2.7V ~ 3.6V-40°C ~ 85°C (TC)Surface Mount8-VDFN Exposed Pad8-VDFN (6x5)ROHS3 Compliant3 (168 Hours)
W25Q16JVZPIQ16MbitNon-VolatileFLASH - NORFLASH2M x 8SPI - Quad I/O133 MHz3ms2.7V ~ 3.6V-40°C ~ 85°C (TA)Surface Mount8-WDFN Exposed Pad8-WSON (6x5)ROHS3 Compliant3 (168 Hours)

Substitute Part Grouping Explanation

Substitute memory ICs are selected strictly based on identical key electrical and mechanical parameters: memory size, memory type, technology, memory format, interface type, clock frequency, write cycle time, supply voltage, operating temperature range, mounting type, and package dimensions. Only parts matching these criteria and compliance certifications are included. The W25Q16JVZPIQ is grouped as a substitute due to meeting all required specifications.

Parameter Comparison

Manufacturer Part NumberManufacturerMemory SizeMemory TypeTechnologyMemory FormatMemory OrganizationMemory InterfaceClock FrequencyWrite Cycle Time - Word, PageVoltage - SupplyOperating TemperatureMounting TypePackage / CaseSupplier Device PackageRoHS StatusMoisture Sensitivity Level (MSL)
AT26DF161-MUMicrochip Technology16MbitNon-VolatileFLASHFLASH256 Bytes x 8192 pagesSPI66 MHz5ms2.7V ~ 3.6V-40°C ~ 85°C (TC)Surface Mount8-VDFN Exposed Pad8-VDFN (6x5)ROHS3 Compliant3 (168 Hours)
W25Q16JVZPIQWinbond Electronics16MbitNon-VolatileFLASH - NORFLASH2M x 8SPI - Quad I/O133 MHz3ms2.7V ~ 3.6V-40°C ~ 85°C (TA)Surface Mount8-WDFN Exposed Pad8-WSON (6x5)ROHS3 Compliant3 (168 Hours)

Engineering Selection Recommendations

The AT26DF161-MU is obsolete, whereas the W25Q16JVZPIQ is active. Both parts meet ROHS3 compliance, REACH status, and contain matching Moisture Sensitivity Levels (MSL). Selection is based strictly on product status and provided compliance certifications.

Frequently Asked Questions (FAQ)

Q: What key criteria are used to select an equivalent FLASH memory IC?
A: Selection is based strictly on memory size, memory type, technology, interface, voltage range, clock frequency, write cycle time, operating temperature, mounting type, package/case, supplier device package, and compliance certifications.

Q: Are the packages and mounting types identical for both AT26DF161-MU and W25Q16JVZPIQ?
A: Both are surface mount ICs in 8-pad exposed pad packages with a 6x5 mm footprint.

Q: Is the voltage range identical for both parts?
A: Both ICs operate at a supply voltage range of 2.7V to 3.6V.

Q: Does the substitute part W25Q16JVZPIQ meet the same compliance certifications as AT26DF161-MU?
A: Both are listed as ROHS3 compliant and unaffected by REACH, with a Moisture Sensitivity Level of 3 (168 Hours).

Q: Is the memory organization identical between the main and substitute part?
A: The memory organization differs; AT26DF161-MU is specified as 256 Bytes x 8192 pages, while W25Q16JVZPIQ is specified as 2M x 8. Other key electrical and mechanical parameters are matched.

Q: Why is it necessary to substitute the AT26DF161-MU?
A: The part is obsolete, requiring an alternative for continued production and design maintenance.

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