AT26DF081A-SSU Equivalent & Substitute Parts

Part Overview

The AT26DF081A-SSU is an 8Mbit SPI FLASH memory IC manufactured by Microchip Technology, designed for non-volatile data storage applications requiring serial peripheral interface communication. This part is discontinued at DiGi Electronics, necessitating identification of functionally equivalent alternatives that maintain compatibility with existing system designs while meeting current supply chain requirements.

Substiute Parts

AT26DF081A-SSU
Microchip TechnologyIn Stock: 24889AT26DF081A-SSU Datasheet
AT26DF081A-SSU
Current Part
SST25VF080B-50-4C-S2AF
Microchip TechnologyIn Stock: 2734SST25VF080B-50-4C-S2AF Datasheet
SST25VF080B-50-4C-S2AF
MFR Recommended
SST25VF080B-50-4C-S2AF-T
Microchip TechnologyIn Stock: 4472SST25VF080B-50-4C-S2AF-T Datasheet
SST25VF080B-50-4C-S2AF-T
MFR Recommended
SST25VF080B-50-4I-S2AF
Microchip TechnologyIn Stock: 19576SST25VF080B-50-4I-S2AF Datasheet
SST25VF080B-50-4I-S2AF
MFR Recommended
W25Q80DVSNIG
Winbond ElectronicsIn Stock: 103447W25Q80DVSNIG Datasheet
W25Q80DVSNIG
MFR Recommended

Key Parameters

Parameter Value
Memory Size 8Mbit
Memory Format FLASH
Memory Interface SPI
Clock Frequency 70 MHz
Voltage Supply Range 2.7V – 3.6V
Operating Temperature -40°C – 85°C
Package Type 8-SOIC
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the AT26DF081A-SSU is determined by the following critical parameters:

  • Memory Capacity: Must be 8Mbit to maintain data storage equivalence
  • Memory Type & Format: Must be non-volatile FLASH technology
  • Interface Protocol: Must support SPI communication for direct pin and protocol compatibility
  • Supply Voltage: Must operate within 2.7V – 3.6V range for power supply compatibility
  • Package & Pinout: Must use 8-SOIC package to ensure PCB footprint compatibility
  • Compliance: Must maintain ROHS3 compliance for regulatory alignment

The substitute parts listed below meet all core substitution criteria. Variations in clock frequency, write cycle time, and operating temperature ranges are secondary parameters that may affect performance characteristics but do not preclude functional substitution when system requirements permit.

Parameter Comparison

Parameter AT26DF081A-SSU SST25VF080B-50-4C-S2AF SST25VF080B-50-4C-S2AF-T SST25VF080B-50-4I-S2AF W25Q80DVSNIG
Manufacturer Microchip Technology Microchip Technology Microchip Technology Microchip Technology Winbond Electronics
Memory Size 8Mbit 8Mbit 8Mbit 8Mbit 8Mbit
Memory Format FLASH FLASH FLASH FLASH FLASH – NOR
Memory Interface SPI SPI SPI SPI SPI – Quad I/O
Clock Frequency 70 MHz 50 MHz 50 MHz 50 MHz 104 MHz
Voltage Supply 2.7V – 3.6V 2.7V – 3.6V 2.7V – 3.6V 2.7V – 3.6V 2.7V – 3.6V
Operating Temperature -40°C – 85°C 0°C – 70°C 0°C – 70°C -40°C – 85°C -40°C – 85°C
Package Type 8-SOIC (0.154", 3.90mm) 8-SOIC (0.209", 5.30mm) 8-SOIC (0.209", 5.30mm) 8-SOIC (0.209", 5.30mm) 8-SOIC (0.154", 3.90mm)
Product Status Discontinued Active Active Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

SST25VF080B-50-4I-S2AF is the primary substitute for applications requiring full temperature range operation (-40°C – 85°C). This part maintains Microchip Technology manufacturing continuity, operates within identical supply voltage specifications, and is actively produced with verified programmability. The 50 MHz clock frequency operates within acceptable margins for most SPI FLASH applications, and the extended temperature range matches the original part specification.

W25Q80DVSNIG serves as an alternative substitute for applications where higher clock frequency (104 MHz) provides performance benefits. This Winbond Electronics part maintains 8-SOIC package compatibility with the original AT26DF081A-SSU footprint (0.154", 3.90mm width), operates across the full -40°C – 85°C temperature range, and offers quad I/O capability for enhanced data throughput. Active production status and high inventory availability support supply chain continuity.

SST25VF080B-50-4C-S2AF and SST25VF080B-50-4C-S2AF-T are suitable for applications operating within the 0°C – 70°C temperature range. These parts differ from the primary recommendation only in operating temperature specification and packaging format (Tube vs. Cut Tape & Digi-Reel). Selection between these variants depends on procurement and assembly requirements rather than functional compatibility.

Frequently Asked Questions (FAQ)

Q: Can SST25VF080B series parts directly replace the AT26DF081A-SSU without PCB modifications?

A: SST25VF080B-50-4I-S2AF and SST25VF080B-50-4C-S2AF variants use 8-SOIC packages with 5.30mm width, differing from the original 3.90mm width. PCB footprint verification is required. The SST25VF080B-50-4I-S2AF maintains identical supply voltage and extended temperature range, ensuring functional compatibility when footprint accommodation is confirmed.

Q: What is the primary difference between SST25VF080B-50-4C-S2AF and SST25VF080B-50-4I-S2AF?

A: Both parts are functionally identical FLASH memory ICs with 8Mbit capacity and SPI interface. The primary difference is operating temperature range: SST25VF080B-50-4C-S2AF operates 0°C – 70°C, while SST25VF080B-50-4I-S2AF operates -40°C – 85°C. Selection depends on application temperature requirements.

Q: Is the W25Q80DVSNIG compatible with systems designed for the AT26DF081A-SSU?

A: The W25Q80DVSNIG maintains 8-SOIC package compatibility with the original 3.90mm width, identical supply voltage range (2.7V – 3.6V), and full temperature range (-40°C – 85°C). The SPI – Quad I/O interface is backward compatible with standard SPI operation. Firmware verification is recommended to confirm quad I/O command set compatibility if utilized.

Q: Why do SST25VF080B parts have different package widths than the original AT26DF081A-SSU?

A: The AT26DF081A-SSU uses a 0.154" (3.90mm) width 8-SOIC package, while SST25VF080B variants use 0.209" (5.30mm) width 8-SOIC packages. Both are standard 8-SOIC configurations with different body dimensions. PCB layout verification is necessary to confirm footprint compatibility before design implementation.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. All listed substitute parts—SST25VF080B-50-4C-S2AF, SST25VF080B-50-4C-S2AF-T, SST25VF080B-50-4I-S2AF, and W25Q80DVSNIG—maintain ROHS3 compliance, matching the original AT26DF081A-SSU regulatory status.

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