AT25XE512C-SSHN-B Equivalent & Substitute Parts

Part Overview

The AT25XE512C-SSHN-B is a 512Kbit FLASH memory IC with SPI interface manufactured by Renesas Electronics Corporation. This non-volatile memory device operates at 104 MHz and is packaged in 8-SOIC surface mount configuration. The part is currently in active production status with full RoHS3 compliance and unlimited moisture sensitivity rating. Substitute parts are identified when packaging format changes are required or when alternative memory variants with compatible electrical specifications are needed for procurement flexibility.

Substiute Parts

AT25XE512C-SSHN-B

Renesas Electronics CorporationIn Stock: 3954AT25XE512C-SSHN-B Datasheet

Current PartRFQ

AT25DF512C-SSHN-T

Renesas Electronics CorporationIn Stock: 4491AT25DF512C-SSHN-T Datasheet

MFR RecommendedRFQ

AT25XE512C-SSHN-T

Renesas Electronics CorporationIn Stock: 5037AT25XE512C-SSHN-T Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the AT25XE512C-SSHN-B are qualified based on the following critical parameters that determine functional and mechanical compatibility:

Electrical Compatibility Parameters:

• Memory Size: 512Kbit (64K x 8 organization)
• Memory Interface: SPI protocol
• Clock Frequency: 104 MHz
• Voltage Supply Range: 1.65V ~ 3.6V
• Operating Temperature Range: -40°C ~ 85°C (TC)

Mechanical Compatibility Parameters:

• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Mounting Type: Surface Mount

Compliance Parameters:

• RoHS3 Compliant
• Moisture Sensitivity Level: 1 (Unlimited)

The identified substitutes maintain identical electrical and mechanical specifications while differing in packaging format (Tube vs. Tape & Reel) and memory variant designation (XE vs. DF series). Both substitute parts are manufactured by Renesas Electronics Corporation and are in active production status.

Parameter Comparison

Engineering Selection Recommendations

AT25XE512C-SSHN-T (Tape & Reel Format): This substitute maintains identical electrical and mechanical specifications to the main part. The primary difference is packaging format change from Tube to Tape & Reel. Selection is appropriate when automated assembly processes require tape and reel packaging. Both parts carry identical product status (Active) and compliance certifications.

AT25DF512C-SSHN-T (DF Series Variant): This substitute provides equivalent 512Kbit SPI FLASH memory with identical core electrical parameters and package specifications. The DF series variant exhibits improved write cycle performance (8µs word write vs. 12µs) and slightly extended page write cycle (4.6ms vs. 3ms). This part is supplied in Tape & Reel format and carries verified programmability status. Selection is appropriate when write performance optimization or verified programmability certification is required.

All three parts maintain active production status, full RoHS3 compliance, and unlimited moisture sensitivity rating, ensuring long-term availability and environmental regulatory compliance.

Frequently Asked Questions (FAQ)

Q: Can AT25XE512C-SSHN-T be used as a direct replacement for AT25XE512C-SSHN-B?

A: Yes. Both parts are electrically and mechanically identical. The only difference is packaging format: the main part uses Tube packaging while the substitute uses Tape & Reel format. PCB footprint and electrical performance are identical.

Q: What is the difference between AT25XE512C-SSHN-T and AT25DF512C-SSHN-T?

A: Both parts are 512Kbit SPI FLASH memory in 8-SOIC packages with identical supply voltage and operating temperature ranges. The DF variant offers faster word write cycle time (8µs vs. 12µs) and carries verified programmability certification. Page write cycle time is slightly longer (4.6ms vs. 3ms).

Q: Are all three parts RoHS3 compliant?

A: Yes. AT25XE512C-SSHN-B, AT25XE512C-SSHN-T, and AT25DF512C-SSHN-T all carry ROHS3 Compliant status with unlimited moisture sensitivity rating (MSL 1).

Q: Which substitute should be selected for high-volume automated assembly?

A: Both AT25XE512C-SSHN-T and AT25DF512C-SSHN-T are supplied in Tape & Reel format, which is standard for automated pick-and-place assembly processes. The main part (Tube packaging) is typically used for manual assembly or lower-volume applications.

Q: Is the DF series variant pin-compatible with the XE series?

A: Yes. Both AT25XE512C-SSHN-T and AT25DF512C-SSHN-T use identical 8-SOIC package dimensions (0.154", 3.90mm Width) and SPI interface protocol, ensuring pin-level compatibility.

Q: What is the significance of the -SSHN suffix?

A: The -SSHN suffix indicates the specific package variant and lead finish specification for the 8-SOIC package. This designation is consistent across all three parts, confirming mechanical and thermal compatibility.