AT25DL161-MHN-T Equivalent & Substitute Parts

Part Overview

The AT25DL161-MHN-T is a 16Mbit SPI FLASH memory IC manufactured by Renesas Electronics Corporation, designed for non-volatile data storage applications requiring high-speed serial interface access. This device operates at 100 MHz clock frequency with a supply voltage range of 1.65V to 1.95V, housed in an 8-UDFN (5x6) surface mount package with exposed pad. The part maintains Active product status and is ROHS3 compliant. Substitute parts are identified when packaging or inventory availability differs while maintaining identical electrical and mechanical specifications.

Substiute Parts

AT25DL161-MHN-T

Renesas Electronics CorporationIn Stock: 1027AT25DL161-MHN-T Datasheet

Current PartRFQ

AT25DL161-MHN-Y

Renesas Electronics CorporationIn Stock: 29486AT25DL161-MHN-Y Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the AT25DL161-MHN-T is determined by strict equivalence across all electrical and mechanical parameters. The primary substitution criterion is packaging format, where the Tape & Reel (TR) packaging of the main part may be substituted with Tray packaging when the following conditions are met:

• Identical memory capacity: 16Mbit
• Identical memory interface: SPI
• Identical clock frequency: 100 MHz
• Identical memory organization: 256 Bytes x 8192 pages
• Identical write cycle times: 8µs (word), 3ms (page)
• Identical supply voltage range: 1.65V ~ 1.95V
• Identical operating temperature range: -40°C ~ 85°C (TC)
• Identical physical package: 8-UDFN Exposed Pad (5x6)
• Identical compliance certifications: ROHS3, REACH Unaffected

The AT25DL161-MHN-Y qualifies as a direct substitute based on these parameters, with the only difference being the packaging format (Tray versus Tape & Reel).

Parameter Comparison

Engineering Selection Recommendations

Both AT25DL161-MHN-T and AT25DL161-MHN-Y maintain Active product status from Renesas Electronics Corporation, ensuring continued manufacturing support and availability. Both parts carry identical ROHS3 compliance and REACH Unaffected status, meeting regulatory requirements for industrial and commercial applications.

Selection between these parts is determined by supply chain requirements and assembly process specifications. The AT25DL161-MHN-T in Tape & Reel packaging is suitable for high-volume automated pick-and-place assembly operations. The AT25DL161-MHN-Y in Tray packaging accommodates alternative handling and storage protocols. Electrical performance, thermal characteristics, and functional specifications remain identical across both packaging formats.

Frequently Asked Questions (FAQ)

Q: Can AT25DL161-MHN-Y replace AT25DL161-MHN-T in production?

A: Yes. Both parts are electrically and mechanically identical. The only difference is packaging format (Tray versus Tape & Reel). Substitution is valid provided assembly equipment and handling procedures accommodate Tray packaging.

Q: Are there any performance differences between these parts?

A: No. Memory capacity, speed, interface protocol, voltage specifications, and temperature range are identical. Both parts deliver 16Mbit SPI FLASH memory at 100 MHz operation.

Q: What is the significance of the packaging difference?

A: Tape & Reel (TR) packaging is optimized for automated high-speed assembly lines with reel-fed pick-and-place equipment. Tray packaging is used for manual assembly, lower-volume production, or alternative handling systems. The die and electrical characteristics are unchanged.

Q: Are both parts ROHS3 compliant?

A: Yes. Both AT25DL161-MHN-T and AT25DL161-MHN-Y are ROHS3 compliant and REACH unaffected, meeting environmental and regulatory standards.

Q: What is the moisture sensitivity level for these parts?

A: Both parts have Moisture Sensitivity Level (MSL) 1, indicating unlimited shelf life without moisture control requirements.

Q: Can these parts be used interchangeably in the same PCB design?

A: Yes. Both parts use the identical 8-UDFN (5x6) surface mount package with exposed pad. PCB footprints, solder reflow profiles, and thermal management requirements are identical.