AT25DF512C-XMHNGU-T Equivalent & Substitute Parts

Part Overview

The AT25DF512C-XMHNGU-T is a 512Kbit SPI FLASH memory IC manufactured by Renesas Electronics Corporation in an 8-TSSOP surface mount package. This non-volatile memory device operates at 104 MHz with a supply voltage range of 1.65V to 3.6V and is rated for industrial temperature applications (-40°C to 85°C). The part is currently in active production status with ROHS3 compliance and REACH unaffected classification. Substitute parts are identified when equivalent electrical specifications, memory organization, interface protocol, and package form factor are maintained across the product line.

Substiute Parts

AT25DF512C-XMHNGU-T
Renesas Electronics CorporationIn Stock: 862AT25DF512C-XMHNGU-T Datasheet
AT25DF512C-XMHNGU-T
Current Part
AT25DF512C-XMHN-T
Renesas Electronics CorporationIn Stock: 8329AT25DF512C-XMHN-T Datasheet
AT25DF512C-XMHN-T
MFR Recommended
AT25XE512C-XMHN-T
Renesas Electronics CorporationIn Stock: 3539AT25XE512C-XMHN-T Datasheet
AT25XE512C-XMHN-T
MFR Recommended

Key Parameters

Parameter Value
Memory Size 512Kbit
Memory Organization 64K x 8
Memory Interface SPI
Clock Frequency 104 MHz
Voltage Supply Range 1.65V ~ 3.6V
Operating Temperature -40°C ~ 85°C
Package Type 8-TSSOP (0.173", 4.40mm Width)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitute parts for the AT25DF512C-XMHNGU-T are qualified based on the following criteria:

Electrical Compatibility Requirements:

  • Memory capacity: 512Kbit
  • Memory organization: 64K x 8
  • Interface protocol: SPI
  • Supply voltage range: 1.65V ~ 3.6V
  • Operating temperature range: -40°C ~ 85°C
  • Clock frequency: 104 MHz

Mechanical Compatibility Requirements:

  • Package type: 8-TSSOP
  • Package dimensions: 0.173" × 4.40mm width
  • Mounting type: Surface Mount

Compliance Requirements:

  • RoHS3 compliance
  • REACH unaffected status
  • Active product status

Parts meeting all electrical, mechanical, and compliance criteria are classified as direct substitutes. Variations in write cycle timing and moisture sensitivity level do not preclude substitution when all primary parameters align.

Parameter Comparison

Parameter AT25DF512C-XMHNGU-T AT25DF512C-XMHN-T AT25XE512C-XMHN-T
Manufacturer Renesas Electronics Renesas Electronics Renesas Electronics
Memory Size 512Kbit 512Kbit 512Kbit
Memory Organization 64K x 8 64K x 8 64K x 8
Memory Interface SPI SPI SPI
Clock Frequency 104 MHz 104 MHz 104 MHz
Write Cycle Time - Word 8µs 8µs 12µs
Write Cycle Time - Page 4.6ms 4.6ms 3ms
Voltage Supply 1.65V ~ 3.6V 1.65V ~ 3.6V 1.65V ~ 3.6V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C -40°C ~ 85°C
Package Type 8-TSSOP 8-TSSOP 8-TSSOP
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Product Status Active Active Active
Moisture Sensitivity Level 3 (168 Hours) 1 (Unlimited) 1 (Unlimited)

Engineering Selection Recommendations

Both AT25DF512C-XMHN-T and AT25XE512C-XMHN-T are qualified substitutes for the AT25DF512C-XMHNGU-T based on matching electrical specifications, package form factor, and compliance certifications.

AT25DF512C-XMHN-T maintains identical write cycle timing (8µs word, 4.6ms page) and differs only in moisture sensitivity level (MSL 1 versus MSL 3). This part is recommended for applications where extended shelf life or reduced moisture sensitivity requirements are beneficial.

AT25XE512C-XMHN-T operates within the same electrical envelope but exhibits different write cycle characteristics (12µs word, 3ms page). This part is suitable for applications where write cycle timing variations are acceptable within system design parameters. The MSL 1 rating provides improved moisture handling characteristics.

All three parts maintain active production status, ROHS3 compliance, and REACH unaffected classification, ensuring long-term availability and regulatory alignment.

Frequently Asked Questions (FAQ)

Q: Can AT25DF512C-XMHN-T be used as a direct replacement for AT25DF512C-XMHNGU-T?

A: Yes. Both parts share identical memory capacity (512Kbit), organization (64K x 8), SPI interface, clock frequency (104 MHz), voltage range (1.65V ~ 3.6V), operating temperature (-40°C ~ 85°C), and 8-TSSOP package. The difference in moisture sensitivity level (MSL 1 versus MSL 3) does not affect electrical compatibility.

Q: What are the differences between AT25DF512C-XMHN-T and AT25XE512C-XMHN-T?

A: Both parts are electrically compatible with identical memory specifications and SPI interface. The AT25XE512C-XMHN-T exhibits different write cycle timing: 12µs word write versus 8µs, and 3ms page write versus 4.6ms. Both maintain 104 MHz clock frequency and identical voltage/temperature ratings. Selection depends on whether write cycle timing variations are acceptable for the target application.

Q: Are all three parts available in the same package?

A: Yes. All three parts use the 8-TSSOP surface mount package with identical dimensions (0.173" × 4.40mm width), ensuring mechanical compatibility in PCB layouts.

Q: Do all substitute parts meet the same compliance standards?

A: Yes. All three parts are ROHS3 compliant, REACH unaffected, and maintain active production status with identical ECCN (EAR99) and HTSUS (8542.32.0071) classifications.

Q: Which part should be selected for moisture-sensitive applications?

A: Both AT25DF512C-XMHN-T and AT25XE512C-XMHN-T carry MSL 1 (Unlimited) ratings, providing superior moisture handling compared to the AT25DF512C-XMHNGU-T (MSL 3, 168 Hours). Either substitute is suitable for applications requiring extended moisture protection.

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