AT25DF512C-XMHNGU-B Equivalent & Substitute Parts

Part Overview

The AT25DF512C-XMHNGU-B is a 512Kbit SPI FLASH memory IC manufactured by Renesas Electronics Corporation in an 8-TSSOP surface mount package. This non-volatile memory device operates at 104 MHz with a supply voltage range of 1.65V to 3.6V and is rated for industrial temperature ranges (-40°C to 85°C). The part is currently in active production status with ROHS3 compliance and REACH unaffected classification.

Substitute parts are identified when equivalent electrical specifications and mechanical compatibility are maintained across the same memory category, interface protocol, and package form factor.

Key Parameters

Parameter	Value
Memory Size	512Kbit
Memory Organization	64K x 8
Memory Interface	SPI
Clock Frequency	104 MHz
Voltage Supply Range	1.65V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TC)
Package / Case	8-TSSOP (0.173", 4.40mm Width)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitute parts for the AT25DF512C-XMHNGU-B are qualified based on the following criteria:

Memory Capacity & Organization: 512Kbit capacity with 64K x 8 organization
Interface Protocol: SPI communication standard
Package Compatibility: 8-TSSOP form factor with identical 0.173" (4.40mm) width
Electrical Specifications: Supply voltage range 1.65V to 3.6V and operating temperature -40°C to 85°C
Compliance: ROHS3 compliant and REACH unaffected status
Mounting: Surface mount technology

The identified substitutes maintain these core parameters while differing in packaging format (Tape & Reel vs. Tube) and moisture sensitivity level specifications.

Parameter Comparison

Parameter	AT25DF512C-XMHNGU-B	AT25DF512C-XMHN-T	AT25XE512C-XMHN-T
Manufacturer	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Memory Size	512Kbit	512Kbit	512Kbit
Memory Organization	64K x 8	64K x 8	64K x 8
Memory Interface	SPI	SPI	SPI
Clock Frequency	104 MHz	104 MHz	104 MHz
Write Cycle Time - Word	8µs	8µs	12µs
Write Cycle Time - Page	4.6ms	4.6ms	3ms
Voltage - Supply	1.65V ~ 3.6V	1.65V ~ 3.6V	1.65V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TC)	-40°C ~ 85°C (TC)	-40°C ~ 85°C (TC)
Package / Case	8-TSSOP (0.173", 4.40mm Width)	8-TSSOP (0.173", 4.40mm Width)	8-TSSOP (0.173", 4.40mm Width)
Mounting Type	Surface Mount	Surface Mount	Surface Mount
Packaging Format	Tube	Tape & Reel (TR)	Tape & Reel (TR)
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)	1 (Unlimited)	1 (Unlimited)
Product Status	Active	Active	Active

Engineering Selection Recommendations

All three parts maintain active production status with ROHS3 compliance and REACH unaffected classification, qualifying them for equivalent application in 512Kbit SPI FLASH memory designs.

AT25DF512C-XMHN-T provides direct electrical and timing equivalence to the main part AT25DF512C-XMHNGU-B, with identical write cycle times (8µs word, 4.6ms page). The primary difference is packaging format (Tape & Reel vs. Tube) and improved moisture sensitivity level (MSL 1 vs. MSL 3).

AT25XE512C-XMHN-T maintains full electrical compatibility across supply voltage, operating temperature, and clock frequency specifications. Write cycle timing differs slightly (12µs word, 3ms page), representing a different memory variant within the same 512Kbit SPI FLASH category. This part also features MSL 1 moisture sensitivity and Tape & Reel packaging.

Selection between these parts depends on application-specific write cycle time requirements and packaging logistics. All three parts are suitable for industrial temperature range applications (-40°C to 85°C).

Frequently Asked Questions (FAQ)

Q: Can AT25DF512C-XMHN-T directly replace AT25DF512C-XMHNGU-B in production?

A: Yes. Both parts share identical electrical specifications, memory organization, SPI interface, clock frequency, supply voltage range, and operating temperature. The difference is packaging format (Tube vs. Tape & Reel) and moisture sensitivity level. Tape & Reel packaging (AT25DF512C-XMHN-T) offers improved MSL rating (1 vs. 3).

Q: What is the difference between AT25DF512C-XMHN-T and AT25XE512C-XMHN-T?

A: Both are 512Kbit SPI FLASH devices in 8-TSSOP packages with identical supply voltage and operating temperature ranges. The AT25XE512C-XMHN-T has different write cycle timing (12µs word vs. 8µs, 3ms page vs. 4.6ms). The base product numbers differ (AT25DF512 vs. AT25XE512), indicating distinct memory variants.

Q: Are all three parts compatible with the same PCB layout?

A: Yes. All three parts use the 8-TSSOP package with identical 0.173" (4.40mm) width and surface mount mounting type, ensuring mechanical and electrical pin compatibility on the same PCB footprint.

Q: What does MSL 3 (168 Hours) vs. MSL 1 (Unlimited) mean for component handling?

A: MSL (Moisture Sensitivity Level) indicates the maximum time a component can be exposed to ambient conditions before soldering. MSL 3 allows 168 hours of exposure; MSL 1 has no time restriction. AT25DF512C-XMHNGU-B requires stricter moisture control during storage and handling compared to the Tape & Reel variants.

Q: Can I use AT25XE512C-XMHN-T if my application requires 8µs word write cycle time?

A: No. AT25XE512C-XMHN-T specifies 12µs word write cycle time, which is slower than the 8µs requirement. Use AT25DF512C-XMHN-T or AT25DF512C-XMHNGU-B for 8µs write cycle specifications.

Q: Are all parts available in the same quantities?

A: Inventory levels differ. AT25DF512C-XMHNGU-B (Tube) has 953 pcs in stock, AT25DF512C-XMHN-T (Tape & Reel) has 8268 pcs, and AT25XE512C-XMHN-T (Tape & Reel) has 3485 pcs. Packaging format affects typical order quantities and availability.

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