AT25DF512C-XMHN-B Equivalent & Substitute Parts

Part Overview

The AT25DF512C-XMHN-B is a 512Kbit FLASH memory IC manufactured by Renesas Electronics Corporation, designed for SPI serial interface applications. This non-volatile memory device operates at 104 MHz with a supply voltage range of 1.65V to 3.6V and is housed in an 8-TSSOP surface mount package. The part is currently in active production status and ROHS3 compliant.

Substitute parts are identified when equivalent electrical and mechanical specifications are maintained across the same memory category, interface protocol, and package form factor. The primary distinction between the main part and substitutes lies in packaging configuration (Tube versus Tape & Reel) and moisture sensitivity level ratings.

Key Parameters

Parameter	Specification
Memory Type	Non-Volatile FLASH
Memory Size	512Kbit
Memory Organization	64K x 8
Memory Interface	SPI
Clock Frequency	104 MHz
Supply Voltage	1.65V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TC)
Package / Case	8-TSSOP (0.173", 4.40mm Width)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the AT25DF512C-XMHN-B is determined by the following critical parameters:

Memory Capacity & Organization: 512Kbit, 64K x 8 configuration
Interface Protocol: SPI serial interface
Clock Frequency: 104 MHz operation
Supply Voltage Range: 1.65V ~ 3.6V
Package Type: 8-TSSOP surface mount
Operating Temperature Range: -40°C ~ 85°C (TC)
Compliance: ROHS3 and REACH Unaffected status

The identified substitutes maintain all critical electrical parameters. Variations in packaging configuration (Tube versus Tape & Reel) and moisture sensitivity level (MSL) do not affect functional equivalence in circuit design but impact procurement and storage requirements.

Parameter Comparison

Parameter	AT25DF512C-XMHN-B (Main)	AT25DF512C-XMHN-T (Substitute)	AT25XE512C-XMHN-T (Substitute)
Manufacturer	Renesas Electronics Corporation	Renesas Electronics Corporation	Renesas Electronics Corporation
Memory Size	512Kbit	512Kbit	512Kbit
Memory Organization	64K x 8	64K x 8	64K x 8
Memory Interface	SPI	SPI	SPI
Clock Frequency	104 MHz	104 MHz	104 MHz
Write Cycle Time - Word	8µs	8µs	12µs
Write Cycle Time - Page	4.6ms	4.6ms	3ms
Supply Voltage	1.65V ~ 3.6V	1.65V ~ 3.6V	1.65V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TC)	-40°C ~ 85°C (TC)	-40°C ~ 85°C (TC)
Package / Case	8-TSSOP (0.173", 4.40mm Width)	8-TSSOP (0.173", 4.40mm Width)	8-TSSOP (0.173", 4.40mm Width)
Mounting Type	Surface Mount	Surface Mount	Surface Mount
Packaging	Tube	Tape & Reel (TR)	Tape & Reel (TR)
MSL Rating	3 (168 Hours)	1 (Unlimited)	1 (Unlimited)
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
REACH Status	REACH Unaffected	REACH Unaffected	REACH Unaffected

Engineering Selection Recommendations

AT25DF512C-XMHN-T is functionally equivalent to the main part AT25DF512C-XMHN-B. Both devices share identical electrical specifications, clock frequency, and write cycle timing. The primary difference is packaging format: Tape & Reel versus Tube. This substitute is suitable for high-volume production environments where automated component handling is standard. The MSL rating of 1 (Unlimited) provides superior moisture protection compared to the main part's MSL 3 rating.

AT25XE512C-XMHN-T maintains core memory capacity, organization, interface protocol, and voltage specifications. Write cycle timing differs: word write time is 12µs (versus 8µs) and page write time is 3ms (versus 4.6ms). This device is suitable for applications where write performance variations are acceptable within the specified operating parameters. Like AT25DF512C-XMHN-T, it is supplied in Tape & Reel packaging with MSL 1 rating.

Both substitutes carry active product status, ROHS3 compliance, and REACH Unaffected designation, matching the regulatory and compliance profile of the main part.

Frequently Asked Questions (FAQ)

Q: Can AT25DF512C-XMHN-T be used as a direct replacement for AT25DF512C-XMHN-B in circuit design?

A: Yes. Both parts are electrically identical with matching memory capacity (512Kbit), interface (SPI), clock frequency (104 MHz), supply voltage (1.65V ~ 3.6V), and operating temperature range (-40°C ~ 85°C). The difference is packaging format: Tube versus Tape & Reel. Circuit-level functionality is unchanged.

Q: What is the significance of the MSL rating difference?

A: MSL (Moisture Sensitivity Level) indicates the maximum time a component can be exposed to ambient conditions before soldering. AT25DF512C-XMHN-B has MSL 3 (168 hours maximum), while AT25DF512C-XMHN-T has MSL 1 (unlimited). Higher MSL ratings require baking before reflow soldering if storage time is exceeded. MSL 1 components have no time restriction.

Q: Are there functional differences between AT25XE512C-XMHN-T and the main part?

A: Write cycle timing differs. AT25XE512C-XMHN-T has a word write time of 12µs (versus 8µs) and page write time of 3ms (versus 4.6ms). All other electrical parameters, memory capacity, interface protocol, and voltage specifications are identical. Applications requiring specific write performance should verify compatibility with these timing specifications.

Q: Can these parts be used interchangeably in production?

A: AT25DF512C-XMHN-T is a direct functional equivalent and can be used interchangeably. AT25XE512C-XMHN-T requires verification that the write cycle timing variations do not impact application performance. Both substitutes are suitable for production use with ROHS3 compliance and active product status.

Q: What packaging format should be selected for automated assembly?

A: Tape & Reel (TR) packaging is standard for automated pick-and-place assembly. Both AT25DF512C-XMHN-T and AT25XE512C-XMHN-T are supplied in Tape & Reel format. Tube packaging (main part) is typically used for manual assembly or lower-volume applications.

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