AT25DF512C-SSHNGU-B Equivalent & Substitute Parts

Part Overview

The AT25DF512C-SSHNGU-B is a 512Kbit Serial Peripheral Interface (SPI) FLASH memory IC manufactured by Renesas Electronics Corporation. This non-volatile memory device operates at 104 MHz with a supply voltage range of 1.65V to 3.6V and is housed in an 8-SOIC surface mount package. The part is currently in active production status and ROHS3 compliant. Substitute parts are identified when packaging format or specific performance characteristics require alternative sourcing while maintaining functional equivalence.

Substiute Parts

AT25DF512C-SSHNGU-B
Renesas Electronics CorporationIn Stock: 1082AT25DF512C-SSHNGU-B Datasheet
AT25DF512C-SSHNGU-B
Current Part
AT25DF512C-SSHN-T
Renesas Electronics CorporationIn Stock: 4491AT25DF512C-SSHN-T Datasheet
AT25DF512C-SSHN-T
MFR Recommended
AT25XE512C-SSHN-T
Renesas Electronics CorporationIn Stock: 5037AT25XE512C-SSHN-T Datasheet
AT25XE512C-SSHN-T
MFR Recommended

Key Parameters

Parameter Value
Memory Size 512Kbit
Memory Organization 64K x 8
Memory Interface SPI
Clock Frequency 104 MHz
Voltage Supply Range 1.65V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TC)
Package Type 8-SOIC (0.154", 3.90mm Width)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Product Status Active

Substitute Part Grouping Explanation

Substitute parts for the AT25DF512C-SSHNGU-B are qualified based on the following criteria:

Electrical Equivalence Requirements:

  • Memory Size: 512Kbit
  • Memory Organization: 64K x 8
  • Memory Interface: SPI
  • Clock Frequency: 104 MHz
  • Voltage Supply Range: 1.65V ~ 3.6V
  • Operating Temperature: -40°C ~ 85°C (TC)
  • Package Type: 8-SOIC (0.154", 3.90mm Width)

Packaging Format Variation: The main part (AT25DF512C-SSHNGU-B) is supplied in Tube packaging. Substitute parts may be supplied in Tape & Reel (TR) format, which represents a packaging variation rather than a functional change. Both packaging formats contain identical die and electrical specifications.

Identified Substitutes:

  • AT25DF512C-SSHN-T (Tape & Reel packaging)
  • AT25XE512C-SSHN-T (Tape & Reel packaging, with write cycle time variation)

Parameter Comparison

Parameter AT25DF512C-SSHNGU-B (Main) AT25DF512C-SSHN-T (Substitute) AT25XE512C-SSHN-T (Substitute)
Manufacturer Renesas Electronics Corporation Renesas Electronics Corporation Renesas Electronics Corporation
Memory Size 512Kbit 512Kbit 512Kbit
Memory Organization 64K x 8 64K x 8 64K x 8
Memory Interface SPI SPI SPI
Clock Frequency 104 MHz 104 MHz 104 MHz
Write Cycle Time - Word 8µs 8µs 12µs
Write Cycle Time - Page 4.6ms 4.6ms 3ms
Voltage Supply Range 1.65V ~ 3.6V 1.65V ~ 3.6V 1.65V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TC) -40°C ~ 85°C (TC) -40°C ~ 85°C (TC)
Package Type 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width)
Mounting Type Surface Mount Surface Mount Surface Mount
Packaging Format Tube Tape & Reel (TR) Tape & Reel (TR)
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Product Status Active Active Active

Engineering Selection Recommendations

AT25DF512C-SSHN-T is the primary substitute for AT25DF512C-SSHNGU-B. Both parts share identical electrical specifications, memory organization, and performance characteristics. The difference is packaging format: Tube versus Tape & Reel. This substitute is verified as DiGi-Electronics Programmable and maintains full ROHS3 compliance and active product status.

AT25XE512C-SSHN-T is an alternative substitute with the same memory capacity, interface, and voltage specifications. This part exhibits different write cycle timing: 12µs word write time (versus 8µs) and 3ms page write time (versus 4.6ms). Selection of this part depends on application write performance requirements. This substitute is not verified as DiGi-Electronics Programmable but maintains ROHS3 compliance and active product status.

All three parts are manufactured by Renesas Electronics Corporation, operate within identical voltage and temperature ranges, and use the same 8-SOIC package footprint. Selection between substitutes should be based on packaging availability, write cycle time requirements, and programmability verification status.

Frequently Asked Questions (FAQ)

Q: Can AT25DF512C-SSHN-T be used as a direct replacement for AT25DF512C-SSHNGU-B?

A: Yes. Both parts have identical electrical specifications, memory capacity (512Kbit), interface (SPI), clock frequency (104 MHz), voltage range (1.65V ~ 3.6V), and package footprint (8-SOIC). The only difference is packaging format: Tube versus Tape & Reel. PCB layout and electrical connections remain unchanged.

Q: What is the difference between AT25DF512C-SSHN-T and AT25XE512C-SSHN-T?

A: Both parts are 512Kbit SPI FLASH memory devices in 8-SOIC packages with identical voltage and temperature specifications. The primary difference is write cycle timing: AT25DF512C-SSHN-T has 8µs word write and 4.6ms page write times, while AT25XE512C-SSHN-T has 12µs word write and 3ms page write times. Applications requiring faster word-level writes should use AT25DF512C-SSHN-T.

Q: Are all three parts ROHS3 compliant?

A: Yes. AT25DF512C-SSHNGU-B, AT25DF512C-SSHN-T, and AT25XE512C-SSHN-T are all ROHS3 compliant and REACH unaffected.

Q: What does "DiGi-Electronics Programmable" mean?

A: This indicates verification status for programming compatibility with DiGi-Electronics tools and equipment. AT25DF512C-SSHN-T is verified programmable. AT25DF512C-SSHNGU-B and AT25XE512C-SSHN-T are not verified for this specific compatibility.

Q: Can I use Tape & Reel packaged parts in place of Tube packaged parts?

A: Yes, from an electrical and functional standpoint. Tape & Reel packaging is standard for high-volume production and automated assembly. The die and electrical specifications are identical. Packaging format selection depends on assembly process requirements and inventory management practices.

Q: Do all parts operate at the same clock frequency?

A: Yes. All three parts operate at 104 MHz maximum clock frequency and support the same SPI interface protocol.

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