AT25DF512C-SSHN-B Equivalent & Substitute Parts

Part Overview

The AT25DF512C-SSHN-B is a 512Kbit FLASH memory IC with SPI interface manufactured by Renesas Electronics Corporation. This non-volatile memory device operates at 104 MHz and is packaged in 8-SOIC surface mount configuration. The part is currently in active production status with RoHS3 compliance and unlimited moisture sensitivity level rating. Substitute parts are identified when equivalent electrical specifications and mechanical compatibility allow direct replacement in circuit applications.

Substiute Parts

AT25DF512C-SSHN-B

Renesas Electronics CorporationIn Stock: 760AT25DF512C-SSHN-B Datasheet

Current PartRFQ

AT25DF512C-SSHN-T

Renesas Electronics CorporationIn Stock: 4491AT25DF512C-SSHN-T Datasheet

MFR RecommendedRFQ

AT25XE512C-SSHN-T

Renesas Electronics CorporationIn Stock: 5037AT25XE512C-SSHN-T Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the AT25DF512C-SSHN-B is determined by the following critical parameters:

• Memory capacity: 512Kbit
• Memory organization: 64K x 8
• Interface protocol: SPI
• Package type: 8-SOIC with identical physical dimensions
• Supply voltage compatibility: 1.65V ~ 3.6V
• Operating temperature range: -40°C ~ 85°C
• RoHS3 compliance status
• MSL rating: 1 (Unlimited)

The identified substitute parts maintain these core electrical and mechanical specifications, enabling functional equivalence in circuit designs. Variations in write cycle timing and programmable verification status are noted but do not preclude substitution when application requirements permit.

Parameter Comparison

Engineering Selection Recommendations

AT25DF512C-SSHN-T is the primary substitute for AT25DF512C-SSHN-B. Both parts are manufactured by Renesas Electronics Corporation with identical electrical specifications and mechanical compatibility. The difference in packaging format (Tape & Reel versus bulk) does not affect functional performance. Both parts maintain active product status and ROHS3 compliance.

AT25XE512C-SSHN-T is an alternative substitute with equivalent core specifications. This part differs in write cycle timing (12µs word, 3ms page versus 8µs word, 4.6ms page) and carries unverified programmable status through DiGi-Electronics. Selection of this part requires confirmation that application timing requirements accommodate the extended write cycle parameters.

Frequently Asked Questions (FAQ)

Q: Can AT25DF512C-SSHN-T directly replace AT25DF512C-SSHN-B?

A: Yes. Both parts share identical electrical specifications, memory organization, SPI interface, voltage range, temperature rating, and 8-SOIC package dimensions. The packaging format difference (Tape & Reel versus bulk) does not affect circuit functionality.

Q: What is the difference between AT25DF512C-SSHN-B and AT25DF512C-SSHN-T?

A: The primary difference is packaging format. AT25DF512C-SSHN-B is supplied in bulk packaging, while AT25DF512C-SSHN-T is supplied in Tape & Reel format. Electrical and mechanical specifications are identical.

Q: Can AT25XE512C-SSHN-T replace AT25DF512C-SSHN-B?

A: AT25XE512C-SSHN-T is functionally compatible with identical memory capacity, organization, interface, voltage range, temperature rating, and package type. However, write cycle timing differs: AT25XE512C-SSHN-T requires 12µs for word writes and 3ms for page writes compared to 8µs and 4.6ms respectively for AT25DF512C-SSHN-B. Substitution is valid when application timing requirements accommodate these extended write cycles.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. AT25DF512C-SSHN-T and AT25XE512C-SSHN-T both carry ROHS3 compliance status matching the original part.

Q: What does MSL 1 (Unlimited) rating mean for substitution?

A: MSL 1 rating indicates unlimited shelf life without moisture bake-out requirements. All listed parts share this rating, ensuring equivalent moisture sensitivity handling and storage conditions.

Q: Does the 8-SOIC package dimension match across all parts?

A: Yes. All parts use 8-SOIC packaging with 0.154" width and 3.90mm physical dimensions, ensuring mechanical compatibility in PCB layouts and sockets.