AT25DF256-XMHNGU-T Equivalent & Substitute Parts

Part Overview

The AT25DF256-XMHNGU-T is a 256Kbit SPI FLASH memory IC manufactured by Renesas Electronics Corporation in an 8-TSSOP surface mount package. This non-volatile memory device operates at 104 MHz with a supply voltage range of 1.65V to 3.6V and is rated for industrial temperature applications (-40°C to 85°C). The part is currently in active production status with 873 units available in new original stock. Substitute parts are identified when equivalent electrical specifications, memory organization, interface protocol, and package dimensions are maintained across alternative part numbers or packaging configurations.

Substiute Parts

AT25DF256-XMHNGU-T

Renesas Electronics CorporationIn Stock: 936AT25DF256-XMHNGU-T Datasheet

Current PartRFQ

AT25DF256-XMHN-T

Renesas Electronics CorporationIn Stock: 11661AT25DF256-XMHN-T Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the AT25DF256-XMHNGU-T is determined by strict equivalence in the following parameters:

• Memory capacity: 256Kbit
• Memory organization: 32K x 8 bit configuration
• Interface protocol: SPI (Serial Peripheral Interface)
• Clock frequency: 104 MHz maximum
• Supply voltage range: 1.65V to 3.6V
• Operating temperature range: -40°C to 85°C
• Package type: 8-TSSOP with 0.173" width and 4.40mm dimensions
• Mounting technology: Surface mount

The AT25DF256-XMHN-T qualifies as a direct substitute based on identical electrical specifications and package dimensions. The primary difference is packaging configuration: the main part (AT25DF256-XMHNGU-T) is supplied in tube packaging, while the substitute (AT25DF256-XMHN-T) is supplied in Tape & Reel (TR) format.

Parameter Comparison

Engineering Selection Recommendations

Both the AT25DF256-XMHNGU-T and AT25DF256-XMHN-T are active production parts from Renesas Electronics Corporation with identical electrical and mechanical specifications. Selection between these parts is determined by packaging and supply chain requirements rather than functional capability.

The AT25DF256-XMHNGU-T in tube packaging is suitable for low-volume applications, prototyping, and manual assembly processes. The AT25DF256-XMHN-T in Tape & Reel format is optimized for high-volume automated manufacturing and pick-and-place assembly operations. Both parts maintain ROHS3 compliance and REACH unaffected status, meeting environmental regulatory requirements.

Frequently Asked Questions (FAQ)

Q: Are AT25DF256-XMHNGU-T and AT25DF256-XMHN-T electrically interchangeable?

A: Yes. Both parts are electrically identical with matching memory capacity (256Kbit), interface protocol (SPI), clock frequency (104 MHz), supply voltage range (1.65V to 3.6V), and operating temperature range (-40°C to 85°C). They use the same 8-TSSOP package with identical pin configuration and dimensions.

Q: What is the difference between tube and Tape & Reel packaging?

A: Tube packaging supplies individual components in a plastic tube, suitable for manual handling and low-volume assembly. Tape & Reel packaging places components on a continuous carrier tape wound on a reel, designed for automated pick-and-place assembly equipment in high-volume production environments.

Q: Can I use AT25DF256-XMHN-T as a direct replacement for AT25DF256-XMHNGU-T?

A: Yes, provided your assembly process supports Tape & Reel format. The electrical and mechanical specifications are identical, and both parts are from the same manufacturer with active production status.

Q: Are there any compliance differences between these parts?

A: No. Both parts carry identical RoHS3 compliance and REACH unaffected status. Environmental and regulatory certifications are equivalent.

Q: What determines if a part can substitute for the AT25DF256-XMHNGU-T?

A: Substitution requires matching specifications in memory capacity (256Kbit), memory organization (32K x 8), interface type (SPI), clock frequency (104 MHz), supply voltage (1.65V to 3.6V), operating temperature (-40°C to 85°C), and package type (8-TSSOP surface mount). Packaging format (tube vs. Tape & Reel) does not affect functional substitution.