AT25DF256-XMHNGU-B Equivalent & Substitute Parts

Part Overview

The AT25DF256-XMHNGU-B is a 256Kbit SPI FLASH memory IC manufactured by Renesas Electronics Corporation in an 8-TSSOP surface mount package. This non-volatile memory device operates at 104 MHz with a supply voltage range of 1.65V to 3.6V and supports industrial temperature ranges from -40°C to 85°C. The part is currently in active production status with ROHS3 compliance and is suitable for embedded systems requiring reliable serial peripheral interface memory storage.

Substitute parts are necessary when the original packaging format (Tube) is unavailable or when alternative moisture sensitivity specifications better match production requirements.

Substiute Parts

AT25DF256-XMHNGU-B
Renesas Electronics CorporationIn Stock: 857AT25DF256-XMHNGU-B Datasheet
AT25DF256-XMHNGU-B
Current Part
AT25DF256-XMHN-T
Renesas Electronics CorporationIn Stock: 11661AT25DF256-XMHN-T Datasheet
AT25DF256-XMHN-T
MFR Recommended

Key Parameters

Parameter Value
Memory Size 256Kbit
Memory Organization 32K x 8
Memory Interface SPI
Clock Frequency 104 MHz
Write Cycle Time - Word 8µs
Write Cycle Time - Page 2.5ms
Voltage Supply Range 1.65V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TC)
Package / Case 8-TSSOP (0.173", 4.40mm Width)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

The AT25DF256-XMHN-T qualifies as a direct substitute based on the following critical parameters:

  • Identical memory capacity: 256Kbit with 32K x 8 organization
  • Matching memory interface: SPI protocol
  • Identical clock frequency: 104 MHz
  • Identical electrical specifications: 1.65V ~ 3.6V supply voltage
  • Identical thermal range: -40°C ~ 85°C operating temperature
  • Identical package: 8-TSSOP surface mount configuration
  • Same manufacturer: Renesas Electronics Corporation
  • Same product status: Active

The primary difference between these parts is the packaging format: AT25DF256-XMHNGU-B is supplied in Tube packaging with MSL 3 (168 Hours), while AT25DF256-XMHN-T is supplied in Tape & Reel (TR) packaging with MSL 1 (Unlimited). Both parts share identical electrical and mechanical characteristics, making them functionally interchangeable in circuit design.

Parameter Comparison

Parameter AT25DF256-XMHNGU-B AT25DF256-XMHN-T
Manufacturer Renesas Electronics Corporation Renesas Electronics Corporation
Memory Size 256Kbit 256Kbit
Memory Organization 32K x 8 32K x 8
Memory Interface SPI SPI
Clock Frequency 104 MHz 104 MHz
Write Cycle Time - Word 8µs 8µs
Write Cycle Time - Page 2.5ms 2.5ms
Voltage Supply 1.65V ~ 3.6V 1.65V ~ 3.6V
Operating Temperature -40°C ~ 85°C (TC) -40°C ~ 85°C (TC)
Package / Case 8-TSSOP (0.173", 4.40mm Width) 8-TSSOP (0.173", 4.40mm Width)
Mounting Type Surface Mount Surface Mount
Product Status Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant
Packaging Format Tube Tape & Reel (TR)
Moisture Sensitivity Level MSL 3 (168 Hours) MSL 1 (Unlimited)

Engineering Selection Recommendations

Both AT25DF256-XMHNGU-B and AT25DF256-XMHN-T are active production parts from Renesas Electronics Corporation with ROHS3 compliance and REACH unaffected status. Selection between these parts should be based on packaging and handling requirements:

  • Select AT25DF256-XMHNGU-B when Tube packaging is specified or preferred for manual assembly operations.
  • Select AT25DF256-XMHN-T when Tape & Reel packaging is required for automated pick-and-place assembly or when higher moisture tolerance (MSL 1) is necessary for extended storage or humid environment handling.

Both parts maintain identical electrical performance and thermal specifications, ensuring circuit-level compatibility without design modifications.

Frequently Asked Questions (FAQ)

Q: Are AT25DF256-XMHNGU-B and AT25DF256-XMHN-T electrically identical?

A: Yes. Both parts share identical memory capacity (256Kbit), interface protocol (SPI), clock frequency (104 MHz), supply voltage range (1.65V ~ 3.6V), operating temperature range (-40°C ~ 85°C), and package dimensions (8-TSSOP). They are functionally interchangeable at the circuit level.

Q: What is the difference between these substitute parts?

A: The primary differences are packaging format and moisture sensitivity level. AT25DF256-XMHNGU-B uses Tube packaging with MSL 3 rating, while AT25DF256-XMHN-T uses Tape & Reel packaging with MSL 1 rating. These differences affect handling, storage, and assembly processes but not electrical performance.

Q: Can I use AT25DF256-XMHN-T as a direct replacement for AT25DF256-XMHNGU-B in production?

A: Yes, provided your assembly process accommodates Tape & Reel packaging. The electrical and mechanical specifications are identical, making substitution straightforward from a design perspective. Verify that your pick-and-place equipment and storage conditions are compatible with the TR packaging format.

Q: What does MSL 3 versus MSL 1 mean for component handling?

A: MSL (Moisture Sensitivity Level) indicates how long a component can be exposed to moisture before soldering. MSL 3 allows 168 hours of exposure, while MSL 1 allows unlimited exposure. MSL 1 components are more tolerant of humid storage conditions and longer shelf life without baking.

Q: Are both parts currently in stock?

A: AT25DF256-XMHNGU-B has 779 pieces in stock, while AT25DF256-XMHN-T has 11,570 pieces in stock. Availability may vary; consult your supplier for current inventory status.

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