AT25DF256-XMHN-B Equivalent & Substitute Parts

Part Overview

The AT25DF256-XMHN-B is a 256Kbit SPI FLASH memory IC manufactured by Renesas Electronics Corporation in 8-TSSOP surface mount packaging. This non-volatile memory device operates at 104 MHz with a supply voltage range of 1.65V to 3.6V and supports industrial temperature ranges from -40°C to 85°C. The part is currently in active production status with ROHS3 compliance and REACH unaffected classification. Substitute parts are identified based on identical electrical specifications, memory organization, and interface characteristics while accommodating different packaging formats and moisture sensitivity levels.

Key Parameters

Parameter	Value
Memory Size	256Kbit
Memory Organization	32K x 8
Memory Interface	SPI
Clock Frequency	104 MHz
Write Cycle Time - Word	8µs
Write Cycle Time - Page	2.5ms
Voltage Supply Range	1.65V ~ 3.6V
Operating Temperature	-40°C ~ 85°C
Package / Case	8-TSSOP (0.173", 4.40mm Width)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the AT25DF256-XMHN-B is determined by matching the following critical parameters: memory size (256Kbit), memory organization (32K x 8), SPI interface protocol, clock frequency (104 MHz), write cycle timing (8µs word, 2.5ms page), supply voltage range (1.65V ~ 3.6V), operating temperature range (-40°C ~ 85°C), and physical package specification (8-TSSOP). The primary difference between the main part and its substitute is the packaging format: the AT25DF256-XMHN-B is supplied in Tube packaging, while the substitute AT25DF256-XMHN-T is supplied in Tape & Reel format. Both parts share identical base product number (AT25DF256) and electrical characteristics, making them functionally interchangeable at the circuit level. Moisture sensitivity level differs between the two variants due to packaging differences.

Parameter Comparison

Parameter	AT25DF256-XMHN-B (Main)	AT25DF256-XMHN-T (Substitute)
Manufacturer	Renesas Electronics Corporation	Renesas Electronics Corporation
Memory Size	256Kbit	256Kbit
Memory Organization	32K x 8	32K x 8
Memory Interface	SPI	SPI
Clock Frequency	104 MHz	104 MHz
Write Cycle Time - Word	8µs	8µs
Write Cycle Time - Page	2.5ms	2.5ms
Voltage Supply Range	1.65V ~ 3.6V	1.65V ~ 3.6V
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C
Package / Case	8-TSSOP (0.173", 4.40mm Width)	8-TSSOP (0.173", 4.40mm Width)
Mounting Type	Surface Mount	Surface Mount
Packaging Format	Tube	Tape & Reel (TR)
Product Status	Active	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant
REACH Status	REACH Unaffected	REACH Unaffected
Moisture Sensitivity Level (MSL)	3 (168 Hours)	1 (Unlimited)

Engineering Selection Recommendations

Both AT25DF256-XMHN-B and AT25DF256-XMHN-T are active production parts from Renesas Electronics Corporation with identical ROHS3 compliance and REACH unaffected status. Selection between these parts should be based on procurement and assembly requirements. The AT25DF256-XMHN-B in Tube packaging is suitable for lower-volume applications or manual assembly processes. The AT25DF256-XMHN-T in Tape & Reel format is optimized for high-volume automated pick-and-place assembly operations. The moisture sensitivity level difference (MSL 3 versus MSL 1) reflects packaging protection characteristics; the Tape & Reel variant provides superior moisture protection during storage and handling. Both parts deliver identical electrical performance and are pin-compatible within the 8-TSSOP footprint.

Frequently Asked Questions (FAQ)

Q: Are AT25DF256-XMHN-B and AT25DF256-XMHN-T electrically identical?

A: Yes. Both parts share identical memory capacity (256Kbit), organization (32K x 8), SPI interface, clock frequency (104 MHz), write cycle timing, supply voltage range (1.65V ~ 3.6V), and operating temperature range (-40°C ~ 85°C). They are functionally interchangeable at the circuit level.

Q: What is the primary difference between these two parts?

A: The primary difference is packaging format. AT25DF256-XMHN-B is supplied in Tube packaging, while AT25DF256-XMHN-T is supplied in Tape & Reel format. This affects assembly process compatibility and moisture sensitivity levels.

Q: Can I use AT25DF256-XMHN-T as a direct replacement for AT25DF256-XMHN-B?

A: Yes, provided your assembly process accommodates Tape & Reel packaging. The physical footprint (8-TSSOP) and pin configuration are identical, and all electrical specifications match.

Q: Why do the moisture sensitivity levels differ?

A: Moisture sensitivity level (MSL) is determined by packaging format. Tube packaging (MSL 3) provides 168 hours of protection, while Tape & Reel packaging (MSL 1) provides unlimited protection due to superior moisture barrier characteristics.

Q: Are both parts suitable for industrial temperature applications?

A: Yes. Both parts operate across the industrial temperature range of -40°C to 85°C and maintain identical performance specifications throughout this range.

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