AT25160B-XPDGV-T Equivalent & Substitute Parts

Part Overview

The AT25160B-XPDGV-T is a 16Kbit EEPROM memory IC manufactured by Microchip Technology, featuring SPI interface operation at 5 MHz with 8-TSSOP surface mount packaging. This non-volatile memory device is designed for applications requiring persistent data storage with automotive-grade qualification (AEC-Q100). The part is currently in active production status with 5200 units in stock.

Substitute parts are identified when equivalent memory capacity, interface protocol, package type, and electrical operating ranges are maintained within acceptable engineering tolerances for the application.

Substiute Parts

AT25160B-XPDGV-T
Microchip TechnologyIn Stock: 5288AT25160B-XPDGV-T Datasheet
AT25160B-XPDGV-T
Current Part
M95160-DFDW6TP
STMicroelectronicsIn Stock: 1157M95160-DFDW6TP Datasheet
M95160-DFDW6TP
MFR Recommended
R1EX25016ATA00I#S0
Renesas Electronics CorporationIn Stock: 4028R1EX25016ATA00I#S0 Datasheet
R1EX25016ATA00I#S0
MFR Recommended

Key Parameters

Parameter Value
Memory Size 16Kbit
Memory Organization 2K x 8
Memory Interface SPI
Clock Frequency 5 MHz
Package / Case 8-TSSOP (0.173", 4.40mm Width)
Voltage - Supply 2.5V ~ 5.5V
Operating Temperature -40°C ~ 125°C
Write Cycle Time 5ms
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution eligibility for the AT25160B-XPDGV-T is determined by the following critical parameters:

  • Memory Capacity: 16Kbit (2K x 8 organization) is mandatory
  • Interface Protocol: SPI interface required for pin-level compatibility
  • Package Type: 8-TSSOP surface mount package with 0.173" width (4.40mm) ensures PCB footprint compatibility
  • Supply Voltage Range: Must encompass or be contained within the application's operating voltage window
  • Write Cycle Time: 5ms specification must be met or exceeded
  • Temperature Range: Operating temperature capability must support the application environment

Two substitute parts meet these criteria with documented equivalence:

  1. M95160-DFDW6TP (STMicroelectronics) - Exceeds clock frequency specification (20 MHz vs. 5 MHz) while maintaining all other parameters
  2. R1EX25016ATA00I#S0 (Renesas Electronics Corporation) - Matches clock frequency specification (5 MHz) with identical memory organization and package

Parameter Comparison

Parameter AT25160B-XPDGV-T (Microchip) M95160-DFDW6TP (STMicroelectronics) R1EX25016ATA00I#S0 (Renesas)
Memory Size 16Kbit 16Kbit 16Kbit
Memory Organization 2K x 8 2K x 8 2K x 8
Memory Interface SPI SPI SPI
Clock Frequency 5 MHz 20 MHz 5 MHz
Write Cycle Time 5ms 5ms 5ms
Voltage - Supply 2.5V ~ 5.5V 1.7V ~ 5.5V 1.8V ~ 5.5V
Operating Temperature -40°C ~ 125°C -40°C ~ 85°C -40°C ~ 85°C
Package / Case 8-TSSOP (0.173", 4.40mm) 8-TSSOP (0.173", 4.40mm) 8-TSSOP (0.173", 4.40mm)
Mounting Type Surface Mount Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant

Engineering Selection Recommendations

AT25160B-XPDGV-T (Microchip Technology) - Primary selection for automotive applications requiring AEC-Q100 qualification. Supports extended operating temperature range (-40°C to 125°C). Active production status with 5200 units available.

R1EX25016ATA00I#S0 (Renesas Electronics Corporation) - Direct functional equivalent with matching 5 MHz clock frequency specification. Identical memory organization and package footprint. Operating temperature range limited to -40°C to 85°C. Active production status with 3922 units available.

M95160-DFDW6TP (STMicroelectronics) - Higher performance option with 20 MHz clock frequency capability, providing timing margin above the 5 MHz requirement. Identical memory organization and package footprint. Operating temperature range limited to -40°C to 85°C. Active production status with 1143 units available. Tape & Reel packaging.

Selection between substitute parts depends on application temperature requirements and clock frequency headroom needs. All three parts maintain ROHS3 compliance and identical memory capacity specifications.

Frequently Asked Questions (FAQ)

Q: Can M95160-DFDW6TP replace AT25160B-XPDGV-T in all applications?

A: M95160-DFDW6TP is functionally compatible for applications operating within -40°C to 85°C temperature range. The higher 20 MHz clock frequency is backward compatible with 5 MHz operation. Applications requiring extended temperature operation above 85°C must use AT25160B-XPDGV-T or equivalent parts rated to 125°C.

Q: Are the 8-TSSOP packages identical between all three parts?

A: Yes. All three parts use 8-TSSOP surface mount packages with 0.173" width (4.40mm). PCB footprints are identical, and parts are directly interchangeable at the board level.

Q: What is the significance of the voltage supply range differences?

A: AT25160B-XPDGV-T operates from 2.5V to 5.5V. M95160-DFDW6TP and R1EX25016ATA00I#S0 operate from lower minimum voltages (1.7V and 1.8V respectively). Applications using 2.5V or higher supply voltages can use any of the three parts. Applications using lower supply voltages (below 2.5V) require M95160-DFDW6TP or R1EX25016ATA00I#S0.

Q: Is AEC-Q100 qualification required for my application?

A: AEC-Q100 qualification is specified for AT25160B-XPDGV-T. If automotive-grade qualification is a design requirement, AT25160B-XPDGV-T is the appropriate selection. Substitute parts should be evaluated against specific application qualification requirements.

Q: What is the impact of 5 MHz versus 20 MHz clock frequency?

A: Both frequencies support SPI interface operation. The 5 MHz specification is the minimum required performance. M95160-DFDW6TP's 20 MHz capability provides additional timing margin and faster data transfer rates if the application controller supports higher clock speeds. Backward compatibility is maintained at lower clock frequencies.

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