ASPI-0315FS-330M-T2 Equivalent & Substitute Parts

Part Overview

The ASPI-0315FS-330M-T2 is a 33 µH shielded drum core wirewound inductor manufactured by Abracon LLC, designed for surface mount applications in compact 3.00mm x 3.00mm form factors. This component operates at 430 mA rated current with a maximum DC resistance of 1.066 Ohm and is classified as Active product status. Substitute parts are identified when equivalent inductance values, tolerance specifications, and mounting compatibility align with the original design requirements while maintaining functional performance within specified operating parameters.

Substiute Parts

ASPI-0315FS-330M-T2

Abracon LLCIn Stock: 1124ASPI-0315FS-330M-T2 Datasheet

Current PartRFQ

SRN3015C-330M

Bourns Inc.In Stock: 8688SRN3015C-330M Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the ASPI-0315FS-330M-T2 are identified based on the following critical parameters:

• Inductance Value: 33 µH with ±20% tolerance
• Mounting Configuration: Surface mount, nonstandard package
• Physical Dimensions: 3.00mm x 3.00mm footprint with maximum height of 1.50mm
• Core Material: Ferrite construction
• Regulatory Compliance: ROHS3 compliant, REACH unaffected status

The SRN3015C-330M from Bourns Inc. qualifies as a substitute based on matching inductance specification, identical package footprint, ferrite core material, and equivalent regulatory certifications. Differences in current rating, DC resistance, and shielding configuration are noted for engineering evaluation.

Parameter Comparison

Engineering Selection Recommendations

Both components maintain Active product status and ROHS3 compliance. The SRN3015C-330M provides higher current rating capacity (850 mA versus 430 mA) and lower DC resistance (940 mOhm versus 1.066 Ohm), resulting in reduced power dissipation. The extended operating temperature range (-55°C to 125°C versus -25°C to 120°C) offers broader environmental tolerance. The semi-shielded configuration of the substitute differs from the fully shielded original; this distinction requires evaluation based on electromagnetic interference requirements of the specific application. Both components share identical inductance values, tolerance specifications, package footprint, and regulatory certifications, supporting direct substitution in designs where the noted parameter differences are acceptable.

Frequently Asked Questions (FAQ)

Q: Can the SRN3015C-330M directly replace the ASPI-0315FS-330M-T2 in existing designs?

A: Direct substitution is supported for applications where the higher current rating (850 mA), lower DC resistance (940 mOhm), and semi-shielded configuration of the SRN3015C-330M are compatible with circuit requirements. The identical inductance value, tolerance, package footprint, and operating temperature range support mechanical and electrical compatibility.

Q: What is the significance of the shielding difference between these components?

A: The ASPI-0315FS-330M-T2 features full shielding, while the SRN3015C-330M is semi-shielded. Shielding reduces electromagnetic radiation and susceptibility to external fields. Applications requiring maximum EMI suppression should evaluate whether semi-shielded performance meets design specifications.

Q: Are both components suitable for the same PCB assembly process?

A: Yes. Both components are surface mount devices with identical package dimensions (3.00mm x 3.00mm x 1.50mm) and Moisture Sensitivity Level 1 (Unlimited), supporting equivalent reflow soldering and handling procedures.

Q: How do the current ratings affect component selection?

A: The SRN3015C-330M supports 850 mA rated current compared to 430 mA for the ASPI-0315FS-330M-T2. In applications operating below 430 mA, both components are suitable. For circuits requiring current between 430 mA and 850 mA, the SRN3015C-330M provides additional margin and reduced thermal stress.

Q: What compliance certifications apply to both components?

A: Both components are ROHS3 compliant and REACH unaffected, meeting current regulatory requirements for electronic component manufacturing and use in regulated markets.