AS6C2008-55STIN Equivalent & Substitute Parts

Part Overview

The AS6C2008-55STIN is a 2Mbit asynchronous SRAM memory IC manufactured by Alliance Memory, Inc., configured as 256K x 8 with parallel interface architecture. This component operates at 55 ns access and write cycle times, supporting supply voltages from 2.7V to 3.6V across the industrial temperature range of -40°C to 85°C. The device is housed in a 32-sTSOP surface mount package and maintains Active product status with full RoHS3 compliance. Equivalent and substitute parts are identified based on matching memory capacity, organization, interface type, timing specifications, and package compatibility to ensure functional interchangeability in system designs.

Key Parameters

Parameter	Specification
Memory Type	Volatile SRAM
Memory Format	SRAM - Asynchronous
Memory Size	2Mbit
Memory Organization	256K x 8
Memory Interface	Parallel
Access Time	55 ns
Write Cycle Time	55 ns
Voltage Supply Range	2.7V ~ 3.6V
Operating Temperature	-40°C ~ 85°C (TA)
Package Type	32-sTSOP
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
MSL Rating	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the AS6C2008-55STIN is determined by strict equivalence across the following critical parameters:

Memory capacity and organization (2Mbit, 256K x 8 configuration)
Interface architecture (parallel asynchronous SRAM)
Timing specifications (55 ns access and write cycle times)
Supply voltage compatibility (minimum 2.7V operation required)
Operating temperature range (-40°C to 85°C)
Surface mount package format (32-sTSOP or compatible 32-pin LFSOP/TFSOP variants)
Compliance certifications (RoHS3, REACH Unaffected)

The IS62WV2568BLL-55HLI meets all substitution criteria with identical memory specifications, timing performance, and environmental ratings. Minor voltage supply range variation (2.5V minimum vs. 2.7V minimum) does not restrict substitution in applications designed for the AS6C2008-55STIN, as the substitute operates across a broader lower voltage envelope.

Parameter Comparison

Parameter	AS6C2008-55STIN	IS62WV2568BLL-55HLI	Match Status
Manufacturer	Alliance Memory, Inc.	ISSI (Integrated Silicon Solution Inc)	Different
Memory Type	Volatile SRAM	Volatile SRAM	Equivalent
Memory Format	SRAM - Asynchronous	SRAM - Asynchronous	Equivalent
Memory Size	2Mbit	2Mbit	Equivalent
Memory Organization	256K x 8	256K x 8	Equivalent
Memory Interface	Parallel	Parallel	Equivalent
Access Time	55 ns	55 ns	Equivalent
Write Cycle Time	55 ns	55 ns	Equivalent
Voltage Supply Range	2.7V ~ 3.6V	2.5V ~ 3.6V	Compatible
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C	Equivalent
Package Type	32-LFSOP	32-TFSOP	Compatible
Mounting Type	Surface Mount	Surface Mount	Equivalent
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	Equivalent
MSL Rating	3 (168 Hours)	3 (168 Hours)	Equivalent
REACH Status	REACH Unaffected	REACH Unaffected	Equivalent
ECCN Classification	3A991B2A	3A991B2A	Equivalent
HTSUS Code	8542.32.0041	8542.32.0041	Equivalent

Engineering Selection Recommendations

The IS62WV2568BLL-55HLI is a direct functional equivalent to the AS6C2008-55STIN for applications requiring 2Mbit asynchronous parallel SRAM with 55 ns timing specifications. Both components maintain Active product status and full RoHS3 compliance, ensuring regulatory alignment for current and future manufacturing requirements. The substitute part operates across an extended lower voltage range (2.5V minimum), providing additional design flexibility without compromising performance in systems specified for 2.7V minimum operation. Package compatibility between 32-LFSOP and 32-TFSOP variants is maintained through standard surface mount footprint equivalence. Selection between these parts may be driven by inventory availability, lead time requirements, or supply chain considerations, as both components satisfy identical electrical and mechanical specifications for the intended application.

Frequently Asked Questions (FAQ)

Q: Can the IS62WV2568BLL-55HLI replace the AS6C2008-55STIN in existing designs without modification?

A: Yes. Both components share identical memory capacity (2Mbit, 256K x 8), interface architecture (parallel asynchronous), timing specifications (55 ns), operating temperature range (-40°C to 85°C), and surface mount package format (32-pin sTSOP). No design changes are required for functional substitution.

Q: What is the difference between the 32-LFSOP and 32-TFSOP packages?

A: Both are 32-pin surface mount packages with 0.465" width and 11.80mm body dimensions, classified as sTSOP variants. The LFSOP and TFSOP designations indicate minor footprint variations from different manufacturers. Standard PCB footprints accommodate both package types without modification.

Q: Does the extended voltage range of the IS62WV2568BLL-55HLI (2.5V minimum) affect compatibility?

A: No. The substitute part's broader voltage envelope (2.5V ~ 3.6V) is a superset of the original specification (2.7V ~ 3.6V). Applications designed for the AS6C2008-55STIN operate within the substitute's supported range without performance degradation.

Q: Are both parts RoHS3 compliant?

A: Yes. Both the AS6C2008-55STIN and IS62WV2568BLL-55HLI maintain ROHS3 compliance and REACH Unaffected status, meeting current environmental and regulatory requirements.

Q: What determines whether these parts are interchangeable?

A: Interchangeability is based on matching memory type (volatile SRAM), capacity (2Mbit), organization (256K x 8), interface (parallel asynchronous), access time (55 ns), write cycle time (55 ns), supply voltage compatibility, operating temperature range, package format, and compliance certifications. All criteria are met between these two components.

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