AS4C64M16D3LA-12BIN Equivalent & Substitute Parts

Part Overview

The AS4C64M16D3LA-12BIN is a 1Gbit DDR3L SDRAM memory IC manufactured by Alliance Memory, Inc., configured as 64M x 16 with parallel interface operation at 800 MHz. This component is discontinued at DiGi Electronics, necessitating identification of functionally equivalent alternatives for ongoing system support and new designs. Substitute parts maintain identical electrical performance and memory capacity while offering variations in physical package dimensions and current product availability.

Key Parameters

Parameter	Value
Memory Type	Volatile DRAM
Technology	SDRAM - DDR3L
Memory Size	1Gbit
Memory Organization	64M x 16
Memory Interface	Parallel
Clock Frequency	800 MHz
Access Time	20 ns
Write Cycle Time	15 ns
Voltage Supply Range	1.283V ~ 1.45V
Operating Temperature	-40°C ~ 95°C (TC)
Mounting Type	Surface Mount
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility is determined by strict equivalence across the following critical parameters: memory type (Volatile DRAM), technology (SDRAM - DDR3L), total memory capacity (1Gbit), clock frequency (800 MHz), access time (20 ns), write cycle time (15 ns), voltage supply range (1.283V ~ 1.45V), operating temperature range (-40°C ~ 95°C), mounting type (Surface Mount), and compliance certifications (ROHS3, REACH Unaffected, EAR99).

Substitute parts are grouped into two categories:

Direct Pin-Compatible Substitutes: Parts maintaining identical memory organization (64M x 16) and package footprint dimensions, differing only in packaging type or minor physical variations.

Parametric Equivalents with Organization Variance: Parts maintaining all electrical specifications and total capacity (1Gbit) but with different memory organization (128M x 8 instead of 64M x 16) or package dimensions. These require PCB layout verification for physical fit.

Parameter Comparison

Part Number	Manufacturer	Memory Organization	Package / Case	Supplier Device Package	Product Status	Inventory (Pcs)	Clock Frequency	Access Time	Voltage Supply
AS4C64M16D3LA-12BIN	Alliance Memory, Inc.	64M x 16	96-VFBGA	96-FBGA (8x13)	Discontinued	756	800 MHz	20 ns	1.283V ~ 1.45V
AS4C64M16D3LB-12BIN	Alliance Memory, Inc.	64M x 16	96-TFBGA	96-FBGA (9x13)	Active	1192	800 MHz	20 ns	1.283V ~ 1.45V
AS4C64M16D3LC-12BIN	Alliance Memory, Inc.	64M x 16	96-VFBGA	96-FBGA (7.5x13)	Active	1329	800 MHz	20 ns	1.283V ~ 1.45V
AS4C128M8D3LB-12BIN	Alliance Memory, Inc.	128M x 8	78-VFBGA	78-FBGA (8x10.5)	Active	932	800 MHz	20 ns	1.283V ~ 1.45V
AS4C128M8D3LC-12BIN	Alliance Memory, Inc.	128M x 8	78-VFBGA	78-FBGA (7.5x10.5)	Active	1335	800 MHz	20 ns	1.283V ~ 1.45V
NDL16PFJ-8KIT	Insignis Technology Corporation	64M x 16	96-VFBGA	96-FBGA (8x13)	Active	1034	800 MHz	20 ns	1.283V ~ 1.45V

Engineering Selection Recommendations

For Direct Replacement (No PCB Modification Required):

AS4C64M16D3LC-12BIN is the primary substitute, maintaining identical memory organization (64M x 16), electrical specifications, and compliance certifications. This part is currently active with 1329 units in stock. The package dimension variance (7.5x13 versus 8x13) is within standard FBGA tolerance ranges and does not require PCB layout changes.

AS4C64M16D3LB-12BIN provides an alternative with active status and higher inventory (1192 units). Package dimension difference (9x13) requires PCB footprint verification before implementation.

NDL16PFJ-8KIT from Insignis Technology Corporation matches the original footprint (96-FBGA 8x13) and memory organization. This part is active with 1034 units available and maintains all electrical and compliance specifications.

For Parametric Equivalence (PCB Layout Verification Required):

AS4C128M8D3LB-12BIN and AS4C128M8D3LC-12BIN maintain identical electrical performance and 1Gbit capacity but differ in memory organization (128M x 8 versus 64M x 16) and package footprint (78-FBGA versus 96-FBGA). These substitutes require verification of address line mapping, control signal routing, and physical PCB space availability. Both parts are active with substantial inventory (932 and 1335 units respectively).

All substitute parts maintain ROHS3 compliance, REACH Unaffected status, and identical voltage supply ranges and operating temperature specifications.

Frequently Asked Questions (FAQ)

Q: Can AS4C64M16D3LC-12BIN directly replace AS4C64M16D3LA-12BIN without PCB modification?

A: Yes. Both parts share identical memory organization (64M x 16), electrical specifications, and compliance certifications. The package dimension difference (7.5x13 mm versus 8x13 mm) falls within standard FBGA manufacturing tolerances and does not require PCB layout changes.

Q: What is the difference between the 64M x 16 and 128M x 8 memory organizations?

A: Both configurations provide 1Gbit total capacity. The 64M x 16 organization uses 16-bit data width with 26 address lines, while 128M x 8 uses 8-bit data width with 27 address lines. Substitution between these organizations requires verification of address line availability and control signal routing on the target PCB.

Q: Why does NDL16PFJ-8KIT from Insignis Technology Corporation appear as a substitute?

A: NDL16PFJ-8KIT maintains identical memory capacity (1Gbit), organization (64M x 16), electrical specifications (800 MHz, 20 ns access time, 1.283V ~ 1.45V supply), and package footprint (96-FBGA 8x13). It is functionally equivalent and currently active with available inventory.

Q: Are all substitute parts ROHS3 compliant?

A: Yes. All listed substitute parts maintain ROHS3 compliance and REACH Unaffected status, matching the original part's environmental certifications.

Q: What is the significance of package dimension variations (8x13, 9x13, 7.5x13)?

A: Package dimensions affect PCB footprint and solder pad layout. Variations within the FBGA standard (such as 8x13 versus 7.5x13) typically do not require PCB redesign, as they fall within manufacturing tolerance ranges. However, the 9x13 variant (AS4C64M16D3LB-12BIN) should be verified against the original PCB layout to confirm compatibility.

Q: What is Moisture Sensitivity Level (MSL) 3, and does it affect substitution?

A: MSL 3 indicates the component requires controlled humidity storage and handling for up to 168 hours before soldering. All substitute parts share this specification, so handling and storage procedures remain unchanged.

Q: Can I use AS4C128M8D3LB-12BIN as a drop-in replacement?

A: No. While electrically equivalent, this part differs in memory organization (128M x 8 versus 64M x 16) and package size (78-FBGA versus 96-FBGA). Substitution requires PCB redesign, address line remapping, and physical space verification. This option is suitable only for new designs or systems undergoing significant modification.

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