AS4C64M16D3LA-12BCN Equivalent & Substitute Parts

Part Overview

The AS4C64M16D3LA-12BCN is a 1Gbit DDR3L SDRAM memory IC manufactured by Alliance Memory, Inc., configured as 64M x 16 with parallel interface operation at 800 MHz. This component is discontinued at DiGi Electronics, making equivalent and substitute parts necessary for ongoing system support and new design implementations. The part is housed in a 96-FBGA (8x13) package and operates within the 1.283V to 1.45V supply voltage range across the 0°C to 95°C temperature range.

Key Parameters

Parameter	Value
Memory Type	Volatile DRAM
Technology	SDRAM - DDR3L
Memory Size	1Gbit
Memory Organization	64M x 16
Memory Interface	Parallel
Clock Frequency	800 MHz
Access Time	20 ns
Write Cycle Time	15 ns
Voltage Supply Range	1.283V ~ 1.45V
Operating Temperature	0°C ~ 95°C
Mounting Type	Surface Mount
Package Type	96-FBGA
RoHS Status	ROHS3 Compliant
MSL Rating	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the AS4C64M16D3LA-12BCN is determined by strict equivalence in the following critical parameters: memory technology (SDRAM - DDR3L), total memory capacity (1Gbit), clock frequency (800 MHz), access time (20 ns), write cycle time (15 ns), voltage supply range (1.283V ~ 1.45V), operating temperature range (0°C ~ 95°C), and compliance certifications (ROHS3, REACH Unaffected).

Substitute parts are grouped into two categories:

Direct Substitutes (Pin-Compatible): Parts maintaining identical memory organization (64M x 16) and package footprint compatibility within the 96-FBGA family.

Parametric Equivalents (Functional Equivalents): Parts with different memory organization (128M x 8) or different FBGA package dimensions but identical electrical performance characteristics and total capacity.

Parameter Comparison

Parameter	AS4C64M16D3LA-12BCN	AS4C64M16D3LB-12BCN	AS4C64M16D3LC-12BCN	AS4C128M8D3LB-12BCN	AS4C128M8D3LC-12BCN
Memory Organization	64M x 16	64M x 16	64M x 16	128M x 8	128M x 8
Memory Size	1Gbit	1Gbit	1Gbit	1Gbit	1Gbit
Clock Frequency	800 MHz	800 MHz	800 MHz	800 MHz	800 MHz
Access Time	20 ns	20 ns	20 ns	20 ns	20 ns
Write Cycle Time	15 ns	15 ns	15 ns	15 ns	15 ns
Voltage Supply	1.283V ~ 1.45V	1.283V ~ 1.45V	1.283V ~ 1.45V	1.283V ~ 1.45V	1.283V ~ 1.45V
Operating Temperature	0°C ~ 95°C	0°C ~ 95°C	0°C ~ 95°C	0°C ~ 95°C	0°C ~ 95°C
Package Type	96-FBGA (8x13)	96-FBGA (9x13)	96-FBGA (7.5x13)	78-FBGA (8x10.5)	78-FBGA (7.5x10.5)
Product Status	Discontinued	Active	Active	Active	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
MSL Rating	3 (168 Hours)	3 (168 Hours)	3 (168 Hours)	3 (168 Hours)	3 (168 Hours)

Engineering Selection Recommendations

AS4C64M16D3LB-12BCN is the primary direct substitute for the discontinued AS4C64M16D3LA-12BCN. This part maintains identical memory organization (64M x 16), electrical specifications, and thermal characteristics. The package footprint differs slightly (96-FBGA 9x13 versus 8x13), requiring PCB layout verification. Product status is Active with full availability.

AS4C64M16D3LC-12BCN provides an alternative direct substitute with the same memory organization and electrical performance. The package footprint is 96-FBGA (7.5x13), requiring PCB layout assessment. Product status is Active.

AS4C128M8D3LB-12BCN and AS4C128M8D3LC-12BCN are parametric equivalents suitable when memory organization flexibility exists in system design. These parts deliver identical electrical performance and total capacity but use different memory organization (128M x 8) and smaller package footprint (78-FBGA). Selection requires confirmation that the system controller supports 128M x 8 configuration and that the reduced package size accommodates PCB layout constraints.

All substitute parts maintain ROHS3 compliance, REACH Unaffected status, and identical MSL ratings, ensuring regulatory and environmental compatibility with the original specification.

Frequently Asked Questions (FAQ)

Q: Can AS4C64M16D3LB-12BCN directly replace AS4C64M16D3LA-12BCN without PCB modification?

A: Both parts share identical electrical specifications and memory organization (64M x 16). However, the package footprint differs (96-FBGA 9x13 versus 8x13). PCB layout verification is required to confirm ball grid array positioning compatibility with existing trace routing and via placement.

Q: What is the difference between direct substitutes and parametric equivalents?

A: Direct substitutes (AS4C64M16D3LB-12BCN and AS4C64M16D3LC-12BCN) maintain the same memory organization (64M x 16) and are suitable for direct replacement with package footprint verification. Parametric equivalents (AS4C128M8D3LB-12BCN and AS4C128M8D3LC-12BCN) have different memory organization (128M x 8) and require system controller compatibility confirmation.

Q: Are all substitute parts currently available?

A: Yes. AS4C64M16D3LB-12BCN, AS4C64M16D3LC-12BCN, AS4C128M8D3LB-12BCN, and AS4C128M8D3LC-12BCN all have Active product status with inventory available.

Q: Do the substitute parts meet the same compliance requirements?

A: All substitute parts are ROHS3 Compliant, REACH Unaffected, and carry identical MSL ratings (3, 168 Hours), matching the original part's regulatory and environmental specifications.

Q: What is the impact of different FBGA package dimensions?

A: FBGA package dimension variations (8x13, 9x13, 7.5x13 for 96-FBGA; 8x10.5, 7.5x10.5 for 78-FBGA) affect PCB footprint size and ball grid positioning. Smaller packages reduce board space but require verification that existing PCB layouts can accommodate the new dimensions. Larger packages may require PCB redesign if space constraints exist.

Q: Can parametric equivalents with 128M x 8 organization be used in systems designed for 64M x 16?

A: Parametric equivalents require system controller support for 128M x 8 memory organization. Direct substitution is not possible without firmware or hardware modifications to address decoding and timing control. Consult system documentation and controller specifications before selection.

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