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AS3PJ-M3/87A Equivalent & Substitute Parts
Part Overview
The AS3PJ-M3/87A is an avalanche diode manufactured by Vishay General Semiconductor - Diodes Division, rated for 600V DC reverse voltage with 2.1A average rectified current. This component operates in the eSMP® series and is classified as an active product with ROHS3 compliance. The device is packaged in TO-277A (SMPC) surface mount configuration and is suitable for applications requiring avalanche protection and standard recovery characteristics.
Equivalent and substitute parts are identified to provide design flexibility when the primary part number is unavailable, when alternative packaging configurations are preferred, or when supply chain optimization is required while maintaining functional compatibility within specified electrical parameters.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - DC Reverse (Vr) (Max) | 600 | V |
| Current - Average Rectified (Io) | 2.1 | A |
| Voltage - Forward (Vf) (Max) @ If | 920 mV @ 1.5 A | mV @ A |
| Reverse Recovery Time (trr) | 1.2 | µs |
| Current - Reverse Leakage @ Vr | 10 | µA @ 600 V |
| Operating Temperature - Junction | -55 to 175 | °C |
| Package / Case | TO-277, 3-PowerDFN | - |
| Mounting Type | Surface Mount | - |
| RoHS Status | ROHS3 Compliant | - |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | - |
Substitute Part Grouping Explanation
Substitution of the AS3PJ-M3/87A is determined by the following critical electrical and mechanical parameters:
Voltage Compatibility: The substitute part must maintain a DC reverse voltage rating of 600V or higher to ensure equivalent reverse bias protection.
Current Rating: The substitute part must support an average rectified current of 2.1A or greater to handle the intended load without thermal stress or performance degradation.
Forward Voltage Characteristics: Forward voltage drop must be compatible with circuit design requirements, particularly at the specified current levels.
Recovery Characteristics: Recovery speed classification (standard or fast recovery) affects switching performance and must be evaluated for the specific application context.
Package and Mounting: Surface mount configuration is required for PCB assembly compatibility. Package footprint differences may require board redesign.
Compliance and Environmental: RoHS3 compliance and MSL rating of 1 (Unlimited) are mandatory for supply chain and manufacturing process compatibility.
The STTH3R06U from STMicroelectronics meets these substitution criteria with equivalent voltage rating, higher current capacity, and compatible surface mount packaging, though with different package geometry (SMB versus TO-277A).
Parameter Comparison
| Parameter | AS3PJ-M3/87A (Vishay) | STTH3R06U (STMicroelectronics) | Unit |
|---|---|---|---|
| Voltage - DC Reverse (Vr) (Max) | 600 | 600 | V |
| Current - Average Rectified (Io) | 2.1 | 3 | A |
| Voltage - Forward (Vf) (Max) @ If | 920 mV @ 1.5 A | 1.7 V @ 3 A | mV @ A |
| Reverse Recovery Time (trr) | 1.2 | 0.035 | µs |
| Current - Reverse Leakage @ Vr | 10 | 3 | µA @ 600 V |
| Operating Temperature - Junction (Max) | 175 | 175 | °C |
| Mounting Type | Surface Mount | Surface Mount | - |
| Package / Case | TO-277, 3-PowerDFN | DO-214AA, SMB | - |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | - |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | - |
Engineering Selection Recommendations
AS3PJ-M3/87A Selection Criteria:
The AS3PJ-M3/87A is the primary specification when the TO-277A (SMPC) package footprint is required for existing PCB designs or when avalanche diode technology is specifically mandated. This part maintains active product status with ROHS3 compliance and unlimited moisture sensitivity rating, suitable for standard manufacturing environments.
STTH3R06U Selection Criteria:
The STTH3R06U serves as a functional substitute when higher current capacity (3A versus 2.1A) is acceptable and the SMB package footprint is compatible with board layout. This part offers superior reverse recovery characteristics (35ns versus 1.2µs) and lower reverse leakage current (3µA versus 10µA), making it suitable for applications where fast recovery performance is beneficial. Both parts maintain identical maximum junction temperature (175°C) and equivalent compliance certifications (ROHS3, MSL 1).
Package Consideration:
Direct pin-for-pin substitution is not possible due to different package geometries (TO-277A versus SMB). PCB layout modification is required when transitioning between these parts.
Frequently Asked Questions (FAQ)
Q: Can the STTH3R06U directly replace the AS3PJ-M3/87A without PCB modification?
A: No. The AS3PJ-M3/87A uses TO-277A (SMPC) packaging while the STTH3R06U uses SMB (DO-214AA) packaging. These packages have different footprints and pin configurations, requiring PCB redesign for physical mounting.
Q: What is the primary electrical difference between these two diodes?
A: Both parts share identical 600V reverse voltage ratings. The STTH3R06U provides higher current capacity (3A versus 2.1A), significantly faster reverse recovery time (35ns versus 1.2µs), and lower reverse leakage current (3µA versus 10µA). The AS3PJ-M3/87A is classified as an avalanche diode with standard recovery characteristics.
Q: Are both parts compliant with current environmental regulations?
A: Yes. Both the AS3PJ-M3/87A and STTH3R06U are ROHS3 compliant, REACH unaffected, and carry MSL rating of 1 (Unlimited), indicating compatibility with standard manufacturing and storage conditions without special moisture control requirements.
Q: Which part should be selected for new designs?
A: Selection depends on application requirements. If avalanche protection and standard recovery characteristics are specified, use AS3PJ-M3/87A. If fast recovery performance and higher current capacity are beneficial, use STTH3R06U. Both parts are active products with equivalent compliance certifications.
Q: What is the impact of different forward voltage characteristics?
A: The AS3PJ-M3/87A exhibits 920mV forward voltage at 1.5A, while the STTH3R06U exhibits 1.7V at 3A. Forward voltage drop affects power dissipation and heat generation in the circuit. Circuit design must account for these differences in thermal calculations and voltage budget analysis.
Q: Can these parts be used interchangeably in existing assemblies?
A: No. Physical package differences prevent direct substitution in existing PCB assemblies. Functional substitution requires board redesign and re-qualification of the modified assembly.
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