AR1335CSSM11SMKA0-CP1 Equivalent & Substitute Parts

Part Overview

The AR1335CSSM11SMKA0-CP1 is a 13-megapixel CMOS image sensor manufactured by onsemi, designed for 1/3-inch optical format applications. This sensor features a 4208H x 3120V active pixel array with 1.1µm x 1.1µm pixel dimensions and operates at 30 frames per second. The device is packaged in a 63-pin ODCSP (6.29x5.69mm) ball grid array configuration.

The AR1335CSSM11SMKA0-CP1 carries an obsolete product status, necessitating identification of functionally equivalent alternatives for ongoing design support and procurement. Substitute parts must maintain identical electrical performance characteristics, pixel architecture, and mechanical compatibility to ensure direct replacement capability without design modification.

Substiute Parts

AR1335CSSM11SMKA0-CP1

onsemiIn Stock: 1169AR1335CSSM11SMKA0-CP1 Datasheet

Current PartRFQ

AR1335CSSM11SMKA0-CP

onsemiIn Stock: 3715AR1335CSSM11SMKA0-CP Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the AR1335CSSM11SMKA0-CP1 is determined by strict equivalence across the following critical parameters:

Electrical Equivalence Criteria:

• CMOS image sensor type
• 13-megapixel resolution (4208H x 3120V active pixel array)
• 1.1µm x 1.1µm pixel dimensions
• 30 frames per second operational capability
• 1.2V supply voltage requirement

Mechanical Equivalence Criteria:

• 63-pin ball grid array package configuration
• 63-ODCSP (6.29x5.69mm) physical dimensions
• 63-WFBGA and CSPBGA package classifications

Compliance Equivalence Criteria:

• ROHS3 compliance certification
• REACH unaffected status
• Moisture Sensitivity Level 4 (72-hour rating)

Substitute parts must satisfy all three equivalence categories to ensure direct replacement without circuit redesign or layout modification.

Parameter Comparison

Engineering Selection Recommendations

The AR1335CSSM11SMKA0-CP serves as the direct substitute for the obsolete AR1335CSSM11SMKA0-CP1. Both devices are manufactured by onsemi and maintain identical electrical and mechanical specifications across all critical parameters.

Primary Selection Basis:

The AR1335CSSM11SMKA0-CP is classified as an active product, ensuring ongoing availability and manufacturing support. This substitute maintains full compatibility with existing designs utilizing the AR1335CSSM11SMKA0-CP1, as both devices share identical pixel architecture, frame rate performance, and package geometry.

Compliance Alignment:

Both parts satisfy ROHS3 compliance requirements and maintain REACH unaffected status, supporting regulatory requirements for current and future applications. Moisture sensitivity specifications remain consistent at Level 4 (72-hour rating), preserving handling and storage protocol compatibility.

Packaging Consideration:

The substitute part is supplied in tray packaging format, which may differ from the original part's packaging specification. Tray packaging is standard for active production components and does not affect electrical or mechanical performance.

Frequently Asked Questions (FAQ)

Q: Can the AR1335CSSM11SMKA0-CP directly replace the AR1335CSSM11SMKA0-CP1 without circuit modification?

A: Yes. Both devices are electrically and mechanically identical across all specified parameters. The 63-ODCSP package geometry, pin configuration, and electrical interface are equivalent, enabling direct substitution without PCB redesign or firmware modification.

Q: What is the primary difference between these two part numbers?

A: The AR1335CSSM11SMKA0-CP1 is classified as obsolete, while the AR1335CSSM11SMKA0-CP maintains active product status. The substitute part is supplied in tray packaging rather than the original packaging format. All electrical and mechanical specifications remain identical.

Q: Are the pixel specifications identical between both parts?

A: Yes. Both the AR1335CSSM11SMKA0-CP1 and AR1335CSSM11SMKA0-CP feature a 4208H x 3120V active pixel array with 1.1µm x 1.1µm pixel dimensions, delivering 13-megapixel resolution at 30 frames per second.

Q: Do both parts meet the same compliance standards?

A: Yes. Both devices are ROHS3 compliant and maintain REACH unaffected status. Moisture sensitivity specifications are identical at Level 4 (72-hour rating), ensuring equivalent handling and storage requirements.

Q: What is the significance of the 63-ODCSP package designation?

A: The 63-ODCSP (6.29x5.69mm) designation specifies a 63-pin organic dual-column stacked package in ball grid array format. This package type is classified as both 63-WFBGA and CSPBGA, indicating wafer-level and chip-scale packaging technology. The physical dimensions and pin count are identical between both parts.

Q: Is the tray packaging format compatible with existing assembly processes?

A: Tray packaging is a standard format for active production components and is compatible with automated pick-and-place assembly equipment. Tray format does not affect electrical performance or mechanical compatibility with existing PCB designs.

Q: Can I use the AR1335CSSM11SMKA0-CP in new designs?

A: Yes. The active product status of the AR1335CSSM11SMKA0-CP ensures ongoing manufacturing support and availability. This part is suitable for both replacement applications and new design implementations.