AP7342D-1815FS6-7 Equivalent & Substitute Parts

Part Overview

The AP7342D-1815FS6-7 is a linear voltage regulator IC from Diodes Incorporated designed for power management applications. This dual-output positive fixed regulator delivers 150mA per channel with output voltages of 1.5V and 1.8V. The device is classified as Last Time Buy, indicating end-of-life status. Identifying qualified substitute parts is necessary to ensure design continuity and maintain supply chain reliability for applications currently utilizing this component.

Substiute Parts

AP7342D-1815FS6-7

Diodes IncorporatedIn Stock: 751AP7342D-1815FS6-7 Datasheet

Current PartRFQ

AP7345D-1815RH4-7

Diodes IncorporatedIn Stock: 896AP7345D-1815RH4-7 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the AP7342D-1815FS6-7 is determined by the following critical parameters:

• Dual-output configuration with positive fixed voltage regulation
• Output voltage levels: 1.5V and 1.8V
• Maximum input voltage: 5.25V
• Surface mount packaging with exposed pad design
• Operating temperature range: -40°C ~ 85°C
• RoHS3 compliance and REACH unaffected status

The AP7345D-1815RH4-7 qualifies as a manufacturer-recommended substitute. While this part increases output current capability to 300mA per channel and transitions to an 8-pin package, it maintains the core functional requirements: dual positive fixed outputs at 1.5V and 1.8V, identical maximum input voltage, equivalent operating temperature range, and matching regulatory compliance.

Parameter Comparison

Engineering Selection Recommendations

The AP7345D-1815RH4-7 is designated as the manufacturer-recommended substitute for the AP7342D-1815FS6-7. Selection of this substitute is supported by:

• Active product status, ensuring long-term availability and supply chain continuity
• Identical regulatory compliance: ROHS3 compliant and REACH unaffected
• Matching output voltage specifications and input voltage ratings
• Enhanced current delivery capability (300mA vs. 150mA per channel) providing design margin
• Equivalent thermal and electrical performance characteristics
• Same manufacturer lineage within the Diodes Incorporated product family

The transition from 6-pin to 8-pin packaging requires PCB layout modification. The increased quiescent current (140 µA vs. 100 µA) is negligible for most applications and is offset by improved current capacity and active product status.

Frequently Asked Questions (FAQ)

Q: Can the AP7345D-1815RH4-7 directly replace the AP7342D-1815FS6-7 without circuit modification?

A: The substitute part maintains identical output voltages (1.5V and 1.8V) and input voltage specifications. However, the package changes from 6-pin to 8-pin (6-XFDFN to 8-XFDFN), requiring PCB layout redesign. Pin assignments must be verified against the respective datasheets before implementation.

Q: What are the key differences between these two parts?

A: The primary differences are output current capacity (150mA vs. 300mA per channel), package pin count (6 vs. 8), quiescent current (100 µA vs. 140 µA), and product status (Last Time Buy vs. Active). Output voltages, input voltage ratings, operating temperature range, and regulatory compliance remain identical.

Q: Is the increased quiescent current of the substitute part a concern?

A: The quiescent current increase from 100 µA to 140 µA represents a 40 µA difference. For most applications, this is negligible and does not impact system power budget significantly.

Q: Why is the AP7345D-1815RH4-7 recommended over other alternatives?

A: This part is the manufacturer-recommended substitute from Diodes Incorporated, ensuring engineering validation, compatibility with the original design intent, and direct support from the component manufacturer.

Q: What is the impact of the package change on thermal performance?

A: The 8-XFDFN package provides an exposed pad design similar to the 6-XFDFN, maintaining equivalent thermal characteristics. The larger package footprint may provide marginal thermal improvement due to increased PCB contact area.