AP2810CMM-G1 Equivalent & Substitute Parts

Part Overview

The AP2810CMM-G1 is a Power Management IC (PMIC) manufactured by Diodes Incorporated, functioning as a USB power switch with N-channel high-side output configuration. This device is classified as obsolete, making identification of functionally equivalent substitute parts essential for ongoing design support, production continuity, and component sourcing.

The AP2810CMM-G1 operates as a 1:1 power switch/driver rated for 1A maximum output current with integrated fault protection including current limiting, over-temperature shutdown, reverse current blocking, and under-voltage lockout (UVLO). The device is surface-mounted in an 8-MSOP package and complies with RoHS3 and REACH regulations.

Substiute Parts

AP2810CMM-G1

Diodes IncorporatedIn Stock: 1111AP2810CMM-G1 Datasheet

Current PartRFQ

BD2061AFJ-E2

ROHM SemiconductorIn Stock: 6574BD2061AFJ-E2 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the AP2810CMM-G1 is determined by strict equivalence across the following critical parameters:

• Switch Configuration: High-side N-channel output with 1:1 input-to-output ratio
• Electrical Performance: 1A maximum output current, 2.7V–5.5V load voltage range, on/off interface control
• Fault Protection: Current limiting, over-temperature protection, reverse current blocking, and UVLO functionality
• Operating Environment: -40°C to 85°C temperature range
• Regulatory Compliance: RoHS3 and REACH compliance
• Mounting Standard: Surface-mount technology with 8-pin package configuration

The BD2061AFJ-E2 manufactured by ROHM Semiconductor meets all these criteria. While the Rds On specification differs (80mOhm vs. 60mOhm), both values fall within acceptable operating margins for USB power switch applications at 1A load current. Package footprint compatibility requires verification during PCB layout transition, as the AP2810CMM-G1 uses 8-MSOP while the BD2061AFJ-E2 uses 8-SOP-J.

Parameter Comparison

Engineering Selection Recommendations

The BD2061AFJ-E2 is a direct functional equivalent for the obsolete AP2810CMM-G1 based on matching electrical specifications, fault protection architecture, and regulatory compliance status. Both devices are RoHS3 compliant and carry unlimited moisture sensitivity level ratings, ensuring equivalent environmental durability.

The primary design consideration is package footprint transition. The AP2810CMM-G1 occupies a smaller 8-MSOP footprint (3.00mm width) compared to the BD2061AFJ-E2 8-SOP-J package (3.90mm width). PCB layout modifications are required to accommodate the larger package dimensions. Pin-to-pin electrical compatibility is maintained, allowing direct signal routing without circuit topology changes.

The 20mOhm increase in Rds On (from 60mOhm to 80mOhm) results in marginally higher on-state power dissipation at maximum 1A load current. At 1A, this represents an additional 20mW of heat generation (ΔP = I²ΔR = 1² × 0.020 = 0.020W). This difference is negligible in typical USB power switch applications and does not require thermal management redesign.

Both devices maintain identical operating temperature ranges, supply voltage requirements, and fault protection mechanisms, confirming functional interchangeability for production and field replacement scenarios.

Frequently Asked Questions (FAQ)

Q: Can the BD2061AFJ-E2 be used as a direct pin-for-pin replacement for the AP2810CMM-G1?

A: Electrical pin functionality is identical between the two devices. However, physical package dimensions differ (8-MSOP vs. 8-SOP-J), requiring PCB footprint modification. Pin assignments and signal levels are compatible without circuit changes.

Q: What is the impact of the higher Rds On specification in the BD2061AFJ-E2?

A: The BD2061AFJ-E2 specifies 80mOhm typical on-state resistance compared to 60mOhm for the AP2810CMM-G1. At 1A maximum load current, this produces an additional 20mW of power dissipation. This difference is within acceptable margins for USB power switch applications and does not necessitate thermal redesign.

Q: Are both devices compliant with current regulatory standards?

A: Yes. Both the AP2810CMM-G1 and BD2061AFJ-E2 are RoHS3 compliant and REACH unaffected. Both carry MSL-1 (unlimited) moisture sensitivity ratings, confirming equivalent environmental and regulatory status.

Q: What package considerations apply when transitioning from AP2810CMM-G1 to BD2061AFJ-E2?

A: The AP2810CMM-G1 uses an 8-MSOP package with 3.00mm width, while the BD2061AFJ-E2 uses an 8-SOP-J package with 3.90mm width. PCB layout must be updated to accommodate the larger footprint. Verify clearance with adjacent components and signal routing before production implementation.

Q: Do both devices provide identical fault protection?

A: Both devices include current limiting (fixed), over-temperature protection, reverse current blocking, and under-voltage lockout (UVLO). The BD2061AFJ-E2 omits the load discharge feature present in the AP2810CMM-G1. Evaluate circuit requirements for load discharge functionality during design transition.

Q: What is the inventory status for these components?

A: The AP2810CMM-G1 is classified as obsolete with 1,074 pieces available in current inventory. The BD2061AFJ-E2 is also obsolete but maintains higher inventory availability at 6,485 pieces, supporting extended production runs and field replacement requirements.