AON7450 Equivalent & Substitute Parts

Part Overview

The AON7450 is an N-Channel MOSFET manufactured by Alpha & Omega Semiconductor Inc., rated for 100V drain-to-source voltage with continuous drain current of 5.6A at Ta and 21A at Tc. This device is packaged in an 8-DFN-EP (3x3) surface mount configuration and belongs to the SDMOS™ series. The AON7450 is classified as obsolete, making identification of functionally equivalent substitute components necessary for ongoing design support and procurement continuity.

Substiute Parts

AON7450

Alpha & Omega Semiconductor Inc.In Stock: 15928AON7450 Datasheet

Current PartRFQ

FDMC86102

onsemiIn Stock: 6967FDMC86102 Datasheet

MFR RecommendedRFQ

STL8N10LF3

STMicroelectronicsIn Stock: 1649STL8N10LF3 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the AON7450 is determined by strict equivalence across the following critical parameters:

Mandatory Matching Criteria:

• FET Type: N-Channel
• Drain to Source Voltage (Vdss): 100V
• Continuous Drain Current: Minimum 5.6A (Ta) and 21A (Tc)
• Mounting Type: Surface Mount
• Operating Temperature Range: Minimum -55°C to 150°C
• Gate Charge (Qg): Comparable performance at 10V gate drive
• On-Resistance (Rds On): Performance at or better than 48 mOhm @ 10V

The two substitute parts identified—FDMC86102 and STL8N10LF3—meet these electrical specifications while offering active product status and improved availability. Both devices maintain N-Channel topology, 100V Vdss rating, and surface mount configuration. Differences in package form factor and thermal performance characteristics are noted in the parameter comparison table below.

Parameter Comparison

Engineering Selection Recommendations

FDMC86102 (onsemi): This substitute offers active product status with ROHS3 compliance. The device provides superior on-resistance performance (24 mOhm vs. 48 mOhm) and lower gate charge (18 nC vs. 20 nC), resulting in improved switching efficiency. Continuous drain current at Tc is 20A, meeting the AON7450 specification of 21A. The Power33 package differs from the original 8-DFN-EP form factor and requires PCB layout modification. This option is suitable for applications where package footprint change is acceptable and switching efficiency gains are beneficial.

STL8N10LF3 (STMicroelectronics): This substitute provides active product status with ROHS3 compliance and AEC-Q101 automotive qualification. The device supports an extended operating temperature range to 175°C and delivers higher power dissipation capability at Tc (70W vs. 43W). On-resistance is 35 mOhm at 10V, intermediate between the original and FDMC86102. The PowerFlat™ (5x6) package is larger than the original 8-DFN-EP (3x3) and requires PCB layout modification. This option is suitable for automotive applications and designs requiring enhanced thermal performance.

Both substitutes maintain electrical compatibility across critical parameters (Vdss, Vgs, gate charge, and operating temperature minimum). Selection between them depends on specific application requirements regarding package constraints, thermal management, and regulatory compliance.

Frequently Asked Questions (FAQ)

Q: Can the FDMC86102 be used as a direct pin-for-pin replacement for the AON7450?

A: The FDMC86102 maintains electrical compatibility but uses a different package (Power33 vs. 8-DFN-EP). Pin-for-pin compatibility cannot be assumed. PCB layout modification is required. Verify pinout and thermal pad configuration against the original design before implementation.

Q: What is the primary advantage of the STL8N10LF3 over the FDMC86102?

A: The STL8N10LF3 offers higher power dissipation capability (70W at Tc vs. 41W) and extended operating temperature range to 175°C. It also carries AEC-Q101 automotive qualification. The FDMC86102 provides lower on-resistance (24 mOhm vs. 35 mOhm) and lower gate charge, favoring switching efficiency in non-automotive applications.

Q: Are both substitute parts RoHS compliant?

A: Yes. Both FDMC86102 and STL8N10LF3 are ROHS3 compliant. The original AON7450 RoHS status is not specified in the provided data.

Q: What is the impact of different package sizes on circuit design?

A: Package differences affect PCB footprint, thermal management, and parasitic inductance. The original 8-DFN-EP (3x3) is smaller than both Power33 and PowerFlat™ (5x6) packages. Thermal performance may improve with larger packages due to increased copper area for heat dissipation. Layout redesign is mandatory when changing packages.

Q: Can I use the STL8N10LF3 in a non-automotive application?

A: Yes. The STL8N10LF3 is qualified to AEC-Q101 automotive standards but is not restricted to automotive use. It functions in general-purpose applications and offers the benefit of higher reliability qualification and extended temperature range.

Q: How do gate charge differences affect circuit performance?

A: Gate charge (Qg) determines the energy required to switch the MOSFET. The AON7450 requires 20 nC, FDMC86102 requires 18 nC, and STL8N10LF3 requires 20.5 nC at 10V gate drive. Lower gate charge reduces driver power dissipation and enables faster switching. Differences of this magnitude typically have minimal impact on most applications but should be evaluated in high-frequency switching circuits.

Q: What does "Tc" and "Ta" mean in the current ratings?

A: Ta refers to continuous drain current at ambient temperature (typically 25°C). Tc refers to continuous drain current at case temperature (typically 25°C). Tc ratings are generally higher due to improved thermal conditions at the device case. Both ratings must be considered based on the thermal management approach in your application.

Q: Is the AON7450 still available for purchase?

A: The AON7450 is classified as obsolete. Inventory availability is limited (15,884 pcs reported in stock). For new designs or long-term production, transition to an active substitute part is recommended. FDMC86102 and STL8N10LF3 are both active products with established supply chains.