AON6404 N-Channel MOSFET 30V 25A/85A Equivalent & Substitute Parts

Part Overview

The AON6404 is an N-Channel MOSFET manufactured by Alpha & Omega Semiconductor Inc., rated for 30V drain-to-source voltage with continuous drain current of 25A at Ta and 85A at Tc. The device is housed in an 8-DFN (5x6) surface mount package and is designed for power switching applications requiring efficient thermal performance.

The AON6404 is classified as Obsolete. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production requirements for applications utilizing this component.

Substiute Parts

AON6404
Alpha & Omega Semiconductor Inc.In Stock: 12448AON6404 Datasheet
AON6404
Current Part
FDMS0306AS
onsemiIn Stock: 19445FDMS0306AS Datasheet
FDMS0306AS
MFR Recommended
PSMN2R5-30YL,115
Nexperia USA Inc.In Stock: 120432PSMN2R5-30YL,115 Datasheet
PSMN2R5-30YL,115
MFR Recommended
RJK0346DPA-01#J0B
Renesas Electronics CorporationIn Stock: 3413RJK0346DPA-01#J0B Datasheet
RJK0346DPA-01#J0B
MFR Recommended
TPN2R203NC,L1Q
Toshiba Semiconductor and StorageIn Stock: 15795TPN2R203NC,L1Q Datasheet
TPN2R203NC,L1Q
MFR Recommended

Key Parameters

Parameter Value Unit
Drain-to-Source Voltage (Vdss) 30 V
Continuous Drain Current @ 25°C (Ta) 25 A
Continuous Drain Current @ 25°C (Tc) 85 A
On-Resistance (Rds On) @ 20A, 10V 2.2 mOhm
Gate Threshold Voltage (Vgs(th)) @ 250µA 2 V
Gate Charge (Qg) @ 10V 155 nC
Input Capacitance (Ciss) @ 15V 9000 pF
Power Dissipation (Ta) 2.1 W
Power Dissipation (Tc) 83 W
Operating Temperature Range -55 to 150 °C
Package Type 8-DFN (5x6) Surface Mount
Moisture Sensitivity Level (MSL) 1 Unlimited

Substitute Part Grouping Explanation

Substitution of the AON6404 is determined by strict adherence to the following electrical and mechanical parameters:

Primary Substitution Criteria:

  • Drain-to-Source Voltage (Vdss): Must equal or exceed 30V
  • Continuous Drain Current: Must meet or exceed 25A at Ta or 85A at Tc
  • On-Resistance (Rds On): Must not exceed 2.2mOhm at specified gate voltage and current
  • Gate Threshold Voltage (Vgs(th)): Must fall within acceptable switching range
  • Gate Charge (Qg): Lower values indicate faster switching performance
  • Input Capacitance (Ciss): Lower values reduce gate drive requirements
  • Operating Temperature Range: Must support -55°C to 150°C minimum
  • Package Type: Surface mount packages with compatible footprints and thermal characteristics
  • Moisture Sensitivity Level: MSL 1 (Unlimited) preferred for manufacturing compatibility

Secondary Considerations:

  • Product Status: Active parts are preferred over Obsolete or Not For New Designs classifications
  • RoHS and REACH Compliance: Regulatory alignment with current standards
  • Thermal Performance: Power dissipation ratings at both Ta and Tc conditions

The substitute parts listed below satisfy the primary electrical criteria while offering varying package configurations and thermal performance characteristics suitable for different application requirements.

Parameter Comparison

Parameter AON6404 FDMS0306AS PSMN2R5-30YL,115 RJK0346DPA-01#J0B TPN2R203NC,L1Q
Manufacturer Alpha & Omega Semiconductor Inc. onsemi Nexperia USA Inc. Renesas Electronics Corporation Toshiba Semiconductor and Storage
Vdss (V) 30 30 30 30 30
Id @ Ta (A) 25 26 65
Id @ Tc (A) 85 49 100 45
Rds On (mOhm) 2.2 @ 20A, 10V 2.4 @ 26A, 10V 2.4 @ 15A, 10V 1.8 @ 25A, 10V 2.2 @ 22.5A, 10V
Vgs(th) (V) 2 @ 250µA 3 @ 1mA 2.15 @ 1mA 2.3 @ 500µA
Qg @ 10V (nC) 155 57 57 49 34
Ciss @ Vds (pF) 9000 @ 15V 3550 @ 15V 3468 @ 12V 7650 @ 10V 2230 @ 15V
Power Dissipation Ta (W) 2.1 2.5 0.7
Power Dissipation Tc (W) 83 59 88 65 42
Operating Temperature (°C) -55 to 150 -55 to 150 -55 to 175 150 150
Package Type 8-DFN (5x6) 8-PQFN (5x6) LFPAK56, Power-SO8 8-WPAK 8-TSON Advance (3.1x3.1)
Product Status Obsolete Active Not For New Designs Active Active
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant RoHS Compliant
MSL 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)

Engineering Selection Recommendations

FDMS0306AS (onsemi)

The FDMS0306AS is an Active product offering electrical parameters closely aligned with the AON6404. It provides 26A continuous drain current at Ta and 49A at Tc, with on-resistance of 2.4mOhm at 26A and 10V gate voltage. The device features significantly lower gate charge (57nC) and input capacitance (3550pF) compared to the AON6404, resulting in reduced gate drive power requirements and faster switching transitions. The 8-PQFN (5x6) package maintains the same footprint dimensions as the original part. ROHS3 compliance and unlimited MSL rating support current manufacturing standards. This part is suitable for applications where gate drive efficiency and switching speed are design priorities.

PSMN2R5-30YL,115 (Nexperia USA Inc.)

The PSMN2R5-30YL,115 is classified as Not For New Designs but remains available with 120,400 units in stock. This device delivers the highest continuous drain current rating at 100A (Tc) and 88W power dissipation, exceeding the AON6404 performance envelope. On-resistance of 2.4mOhm at 15A and 10V, combined with 57nC gate charge and 3468pF input capacitance, provides efficient switching characteristics. The LFPAK56 package offers enhanced thermal performance through a larger footprint (Power-SO8 form factor). Extended operating temperature range to 175°C provides additional thermal margin. ROHS3 compliance is confirmed. This part is applicable to high-current applications where thermal performance and current capacity are critical, though design migration to active alternatives is recommended for new projects.

RJK0346DPA-01#J0B (Renesas Electronics Corporation)

The RJK0346DPA-01#J0B is an Active product with the lowest on-resistance specification at 1.8mOhm at 25A and 10V gate voltage, delivering superior conduction efficiency. Continuous drain current of 65A at Ta exceeds the AON6404 rating. Gate charge of 49nC and input capacitance of 7650pF provide moderate switching characteristics. The 8-WPAK package (8-PowerWDFN) maintains compatibility with similar footprint dimensions. ROHS3 compliance is confirmed. This part is optimal for applications prioritizing conduction loss minimization and efficiency in moderate-current switching circuits.

TPN2R203NC,L1Q (Toshiba Semiconductor and Storage)

The TPN2R203NC,L1Q is an Active product featuring the lowest gate charge (34nC) and input capacitance (2230pF) among all substitute options, enabling minimal gate drive power and fastest switching response. Continuous drain current of 45A at Tc and on-resistance of 2.2mOhm at 22.5A and 10V provide performance comparable to the AON6404. The 8-TSON Advance (3.1x3.1) package offers a compact footprint with reduced board area requirements. RoHS compliance is confirmed. This part is suitable for applications requiring minimal gate drive circuitry and rapid switching transitions in space-constrained designs.

Frequently Asked Questions (FAQ)

Q: Can the FDMS0306AS directly replace the AON6404 without circuit modifications?

A: The FDMS0306AS shares the same 30V Vdss rating and comparable on-resistance characteristics. The 8-PQFN (5x6) package maintains identical footprint dimensions to the 8-DFN (5x6) original part, enabling direct PCB layout compatibility. However, the lower gate charge (57nC versus 155nC) and input capacitance (3550pF versus 9000pF) may require gate drive circuit optimization to prevent overshoot or ringing. Electrical verification of gate drive timing and voltage levels is necessary before production implementation.

Q: What is the primary advantage of the TPN2R203NC,L1Q over other substitutes?

A: The TPN2R203NC,L1Q provides the lowest gate charge (34nC) and input capacitance (2230pF) specifications, resulting in minimal gate drive power consumption and fastest switching transitions. This characteristic is advantageous in applications with limited gate drive current capacity or where switching frequency optimization is required. The compact 8-TSON Advance (3.1x3.1) package also reduces board area compared to larger alternatives.

Q: Is the PSMN2R5-30YL,115 suitable for new design implementations?

A: The PSMN2R5-30YL,115 carries a "Not For New Designs" product status classification. While the device remains available in high inventory quantities (120,400 units), Nexperia recommends alternative parts for new development projects. Existing designs currently utilizing this part may continue procurement; however, new applications should evaluate the FDMS0306AS, RJK0346DPA-01#J0B, or TPN2R203NC,L1Q as primary alternatives.

Q: How do package differences affect thermal performance?

A: The LFPAK56 package used in the PSMN2R5-30YL,115 provides larger surface area and enhanced thermal coupling to PCB ground planes compared to smaller DFN and TSON packages. This results in superior heat dissipation capability, reflected in the 88W power dissipation rating at Tc. Conversely, the compact 8-TSON Advance (3.1x3.1) package in the TPN2R203NC,L1Q prioritizes board space efficiency over thermal performance. Package selection depends on application thermal requirements and PCB layout constraints.

Q: What compliance certifications are common across all substitute parts?

A: All substitute parts maintain Moisture Sensitivity Level 1 (Unlimited) ratings, eliminating bake-out requirements during manufacturing. REACH compliance is confirmed for all devices. RoHS compliance is verified: FDMS0306AS, PSMN2R5-30YL,115, and RJK0346DPA-01#J0B carry ROHS3 certification; TPN2R203NC,L1Q carries RoHS Compliant status. All parts are classified under ECCN EAR99 and HTSUS 8541.29.0095 for export control and tariff purposes.

Q: Which substitute part offers the best on-resistance performance?

A: The RJK0346DPA-01#J0B delivers the lowest on-resistance specification at 1.8mOhm at 25A and 10V gate voltage, compared to 2.2mOhm for the AON6404. This 18% reduction in on-resistance directly translates to lower conduction losses and reduced heat generation during continuous operation. The RJK0346DPA-01#J0B is optimal for applications where efficiency and thermal management are primary design constraints.

Q: Are there package footprint compatibility concerns when substituting parts?

A: The FDMS0306AS (8-PQFN 5x6) maintains identical footprint dimensions to the AON6404 (8-DFN 5x6), enabling direct PCB layout reuse. The TPN2R203NC,L1Q (8-TSON Advance 3.1x3.1) uses a smaller footprint, requiring PCB layout modification but offering reduced board area. The RJK0346DPA-01#J0B (8-WPAK) and PSMN2R5-30YL,115 (LFPAK56) employ different package geometries requiring custom PCB layout design. Mechanical compatibility verification with PCB artwork and assembly equipment is mandatory before production transition.

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