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AON6400 MOSFET N-Channel 30V Equivalent & Substitute Parts
Part Overview
The AON6400 is an N-Channel MOSFET rated for 30V drain-to-source voltage with continuous drain current of 31A at Ta and 85A at Tc. The device is housed in a surface mount 8-DFN (5x6) package and is classified as obsolete. Due to its obsolete status, equivalent and substitute parts are necessary to maintain design continuity and ensure component availability for new production and repair applications.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Drain to Source Voltage (Vdss) | 30 | V |
| Continuous Drain Current @ 25°C (Ta) | 31 | A |
| Continuous Drain Current @ 25°C (Tc) | 85 | A |
| Rds On (Max) @ 20A, 10V | 1.4 | mOhm |
| Gate Threshold Voltage (Vgs(th)) @ 250µA | 2.2 | V |
| Gate Charge (Qg) @ 10V | 170 | nC |
| Input Capacitance (Ciss) @ 15V | 8300 | pF |
| Operating Temperature Range | -55 to 150 | °C |
| Package Type | 8-DFN (5x6) | Surface Mount |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitution of the AON6400 is determined by the following critical parameters:
Electrical Compatibility Requirements:
- Drain to Source Voltage (Vdss) must equal or exceed 30V
- Continuous drain current must meet or exceed 31A at Ta and 85A at Tc
- On-resistance (Rds On) must not exceed 1.4 mOhm at specified conditions
- Gate threshold voltage must be compatible with 10V drive voltage
- Operating temperature range must encompass -55°C to 150°C
Mechanical Compatibility Requirements:
- Surface mount package with 5x6mm footprint
- 8-pin configuration
- Flat lead design
Compliance Requirements:
- REACH Unaffected status
- EAR99 classification
- Moisture Sensitivity Level 1 (Unlimited)
The substitute parts listed below satisfy these electrical and mechanical parameters while offering active product status and improved availability.
Parameter Comparison
| Parameter | AON6400 | AON6500 | CSD17312Q5 | IRFH5300TRPBF |
|---|---|---|---|---|
| Manufacturer | Alpha & Omega Semiconductor | Alpha & Omega Semiconductor | Texas Instruments | Infineon Technologies |
| Vdss (V) | 30 | 30 | 30 | 30 |
| Id @ Ta (A) | 31 | 71 | 38 | 40 |
| Id @ Tc (A) | 85 | 200 | 100 | 100 |
| Rds On (Max) (mOhm) | 1.4 @ 20A, 10V | 0.95 @ 20A, 10V | 1.5 @ 35A, 8V | 1.4 @ 50A, 10V |
| Vgs(th) (Max) (V) | 2.2 @ 250µA | 2.0 @ 250µA | 1.5 @ 250µA | 2.35 @ 150µA |
| Gate Charge (Qg) (nC) | 170 @ 10V | 145 @ 10V | 36 @ 4.5V | 120 @ 10V |
| Ciss (pF) | 8300 @ 15V | 7036 @ 15V | 5240 @ 15V | 7200 @ 15V |
| Operating Temperature (°C) | -55 to 150 | -55 to 150 | -55 to 150 | -55 to 150 |
| Package | 8-DFN (5x6) | 8-DFN (5x6) | 8-VSON-CLIP (5x6) | 8-PQFN (5x6) |
| Product Status | Obsolete | Active | Active | Active |
| RoHS Status | Not specified | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
Engineering Selection Recommendations
AON6500 (Alpha & Omega Semiconductor)
The AON6500 is the manufacturer-recommended substitute for the AON6400. Both devices share identical voltage ratings (30V Vdss) and the same 8-DFN (5x6) package footprint. The AON6500 provides superior electrical performance with lower on-resistance (0.95 mOhm vs. 1.4 mOhm) and higher continuous drain current capability (71A at Ta, 200A at Tc). The device is active in production status with ROHS3 compliance and REACH Unaffected designation. This substitute offers direct form-fit-function compatibility with minimal design modification.
CSD17312Q5 (Texas Instruments NexFET™ Series)
The CSD17312Q5 meets the 30V voltage requirement and exceeds the continuous drain current specification (38A at Ta, 100A at Tc). The device features a 5x6mm footprint in 8-VSON-CLIP package configuration. On-resistance is 1.5 mOhm at 35A and 8V, which is within acceptable tolerance of the AON6400 specification. Gate charge is significantly lower at 36 nC, resulting in reduced switching losses. The device is active in production with ROHS3 compliance. Package pinout verification is required prior to implementation due to different package designation (8-VSON-CLIP vs. 8-DFN).
IRFH5300TRPBF (Infineon Technologies HEXFET® Series)
The IRFH5300TRPBF satisfies the 30V Vdss requirement with continuous drain current of 40A at Ta and 100A at Tc. The device is housed in an 8-PQFN (5x6) surface mount package. On-resistance is 1.4 mOhm at 50A and 10V, matching the AON6400 specification. Gate charge is 120 nC at 10V, providing moderate switching performance. The device is active in production with ROHS3 compliance and REACH Unaffected status. Package pinout verification is required prior to implementation due to different package designation (8-PQFN vs. 8-DFN).
All three substitute parts maintain the -55°C to 150°C operating temperature range and are classified as REACH Unaffected with EAR99 designation.
Frequently Asked Questions (FAQ)
Q: Can the AON6500 be used as a direct replacement for the AON6400?
A: The AON6500 is the manufacturer-recommended substitute and shares the identical 8-DFN (5x6) package footprint with the AON6400. Both devices have 30V Vdss ratings and compatible gate drive voltage requirements. The AON6500 provides improved electrical performance with lower on-resistance and higher current capability. Direct PCB-level substitution is supported without layout modification.
Q: What are the key differences between the CSD17312Q5 and the AON6400?
A: The CSD17312Q5 uses an 8-VSON-CLIP package instead of the 8-DFN package. While both packages share a 5x6mm footprint, the pinout and lead configuration differ. The CSD17312Q5 features significantly lower gate charge (36 nC vs. 170 nC), which reduces switching losses and improves efficiency. Pinout verification and PCB layout assessment are required before substitution.
Q: Is the IRFH5300TRPBF compatible with the AON6400 footprint?
A: The IRFH5300TRPBF uses an 8-PQFN package with a 5x6mm footprint, which differs from the AON6400's 8-DFN package. Although both packages have the same physical dimensions, the pinout and lead configuration are different. PCB layout modification and pinout verification are necessary before implementation.
Q: What is the significance of the lower gate charge in the CSD17312Q5?
A: Gate charge (Qg) determines the energy required to switch the MOSFET on and off. The CSD17312Q5's gate charge of 36 nC at 4.5V is substantially lower than the AON6400's 170 nC at 10V. Lower gate charge reduces switching losses, improves switching speed, and decreases driver power dissipation. This characteristic is beneficial in high-frequency switching applications.
Q: Are all substitute parts RoHS compliant?
A: The AON6500, CSD17312Q5, and IRFH5300TRPBF are all ROHS3 compliant. The AON6400 RoHS status is not specified in the provided documentation. All substitute parts are REACH Unaffected and carry EAR99 classification, matching the AON6400's regulatory status.
Q: What is the impact of different on-resistance values among the substitutes?
A: On-resistance (Rds On) directly affects power dissipation and heat generation. The AON6500 offers the lowest on-resistance at 0.95 mOhm, resulting in reduced power loss compared to the AON6400 (1.4 mOhm). The CSD17312Q5 and IRFH5300TRPBF have on-resistance values of 1.5 mOhm and 1.4 mOhm respectively, which are comparable to or slightly higher than the AON6400. Lower on-resistance improves thermal performance and efficiency.
Q: Can the substitute parts handle the same continuous drain current as the AON6400?
A: All substitute parts exceed the AON6400's continuous drain current specification. The AON6400 is rated for 31A at Ta and 85A at Tc. The AON6500 provides 71A at Ta and 200A at Tc; the CSD17312Q5 provides 38A at Ta and 100A at Tc; the IRFH5300TRPBF provides 40A at Ta and 100A at Tc. All substitutes support higher current levels, providing design margin and improved reliability.
Q: What package considerations are important for substitution?
A: The AON6500 shares the identical 8-DFN (5x6) package with the AON6400, enabling direct PCB substitution. The CSD17312Q5 (8-VSON-CLIP) and IRFH5300TRPBF (8-PQFN) have different package designations despite sharing the 5x6mm footprint. Pinout diagrams must be compared and PCB layout verified before using these alternatives. Lead configuration, solder pad placement, and thermal via positioning may differ between package types.
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