AMC11MMSD Card Edge Connector Equivalent & Substitute Parts

Part Overview

The AMC11MMSD is a 22-position male card edge connector manufactured by Sullins Connector Solutions, designed to interface with female edgecards at 0.100" (2.54mm) pitch. This connector features dual read-out configuration with gold-plated beryllium copper contacts and operates across -65°C to 200°C. The AMC11MMSD is classified as obsolete, necessitating identification of active equivalent parts to maintain design continuity and ensure component availability for new production and field service applications.

Substiute Parts

AMC11MMSD
Sullins Connector SolutionsIn Stock: 1026AMC11MMSD Datasheet
AMC11MMSD
Current Part
RMC11MMSD
Sullins Connector SolutionsIn Stock: 718RMC11MMSD Datasheet
RMC11MMSD
Direct

Key Parameters

Parameter Value
Number of Positions 22
Number of Rows 2
Pitch 0.100" (2.54mm)
Gender Male
Card Type Fits Female Edgecards
Read Out Dual
Termination Solder
Contact Finish Gold
Operating Temperature Range -65°C ~ 200°C
Insulation Material Polyphenylene Sulfide (PPS)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the obsolete AMC11MMSD with the active RMC11MMSD is based on functional equivalence across critical electrical and mechanical parameters. Both connectors maintain identical specifications for the following substitution-determining criteria:

  • 22-position configuration with dual read-out
  • 0.100" (2.54mm) pitch spacing
  • Male gender for female edgecard interface
  • Solder termination method
  • Gold contact finish at 30.0µin thickness
  • Operating temperature range of -65°C to 200°C
  • Polyphenylene Sulfide insulation material
  • ROHS3 compliance and MSL 1 rating

The RMC11MMSD represents the direct active replacement within the Sullins connector family, offering continued design compatibility while providing current manufacturing status and supply chain availability.

Parameter Comparison

Parameter AMC11MMSD (Main Part) RMC11MMSD (Substitute)
Manufacturer Sullins Connector Solutions Sullins Connector Solutions
Category Card Edge Connectors Card Edge Connectors
Number of Positions 22 22
Number of Rows 2 2
Pitch 0.100" (2.54mm) 0.100" (2.54mm)
Gender Male Male
Card Type Fits Female Edgecards Fits Female Edgecards
Read Out Dual Dual
Termination Solder Solder
Contact Finish Gold Gold
Contact Finish Thickness 30.0µin (0.76µm) 30.0µin (0.76µm)
Operating Temperature -65°C ~ 200°C -65°C ~ 200°C
Insulation Material Polyphenylene Sulfide (PPS) Polyphenylene Sulfide (PPS)
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited) 1 (Unlimited)
Product Status Obsolete Active
Contact Material Beryllium Copper Phosphor Bronze
Color Not specified Black
Card Thickness Not specified 0.062" (1.57mm)
Mounting Type Not specified Through Hole
Flange Feature Flush Mount, Side Opening, Unthreaded, 0.125" (3.18mm) Dia Flush Mount, Top Opening, Unthreaded, 0.125" (3.18mm) Dia

Engineering Selection Recommendations

The RMC11MMSD is the direct active equivalent for the obsolete AMC11MMSD. Selection of the RMC11MMSD is supported by:

Product Status: The RMC11MMSD maintains active manufacturing status, ensuring long-term component availability and supply chain continuity compared to the obsolete AMC11MMSD.

Compliance Certifications: Both parts maintain identical ROHS3 compliance and MSL 1 ratings, confirming equivalent environmental and regulatory standing.

Electrical and Mechanical Compatibility: The RMC11MMSD preserves all critical functional parameters including 22-position configuration, 0.100" pitch, dual read-out, solder termination, gold contact finish, and -65°C to 200°C operating range.

Contact Material Variation: The RMC11MMSD employs phosphor bronze contacts in place of beryllium copper. Both materials provide equivalent electrical performance and gold plating thickness (30.0µin) for the specified application.

Physical Configuration Differences: The RMC11MMSD specifies 0.062" card thickness and top opening flange orientation, compared to the AMC11MMSD side opening configuration. These mechanical differences require verification against specific board design requirements during integration.

Frequently Asked Questions (FAQ)

Q: Can the RMC11MMSD directly replace the AMC11MMSD in existing designs?

A: The RMC11MMSD provides functional equivalence for the 22-position, 0.100" pitch male card edge connector application. Physical integration requires confirmation that the 0.062" card thickness specification and top opening flange orientation are compatible with the target edgecard design.

Q: What is the difference between beryllium copper and phosphor bronze contacts?

A: Both contact materials provide equivalent electrical conductivity and mechanical performance for card edge connector applications. The phosphor bronze contacts in the RMC11MMSD deliver the same gold plating thickness (30.0µin) and operating temperature range (-65°C to 200°C) as the beryllium copper contacts in the AMC11MMSD.

Q: Are there compliance differences between the two parts?

A: Both the AMC11MMSD and RMC11MMSD maintain ROHS3 compliance and MSL 1 (Unlimited) ratings. The RMC11MMSD carries ECCN EAR99 classification and HTSUS code 8536.69.4040 for export and tariff purposes.

Q: What does "dual read-out" mean for this connector?

A: Dual read-out indicates the connector supports simultaneous contact engagement on both sides of the edgecard, enabling full electrical connectivity across the 22-position configuration.

Q: Is the black color of the RMC11MMSD a functional difference?

A: The black color is a cosmetic specification and does not affect electrical or mechanical performance. Color selection is determined by manufacturing process and does not impact substitution compatibility.

Q: What is the significance of the flange opening orientation difference?

A: The AMC11MMSD features side opening while the RMC11MMSD features top opening. This mechanical difference affects card insertion direction and board layout considerations. Verification against specific PCB design is required during component integration.

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