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AM3354ZCED50 Equivalent & Substitute Parts
Part Overview
The AM3354ZCED50 is an ARM® Cortex®-A8 Microprocessor IC from Texas Instruments' Sitara™ series, featuring a single 32-bit core operating at 500MHz in a 298-NFBGA (13x13) package. This embedded processor integrates multimedia and NEON™ SIMD co-processors, graphics acceleration, dual Gigabit Ethernet interfaces, and comprehensive memory controllers supporting LPDDR, DDR2, DDR3, and DDR3L standards.
The AM3354ZCED50 is classified as Obsolete. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support long-term product lifecycle management for systems currently deployed with this processor.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Core Processor | ARM® Cortex®-A8 |
| Number of Cores / Bus Width | 1 Core, 32-Bit |
| Speed | 500MHz |
| Co-Processors / DSP | Multimedia, NEON™ SIMD |
| RAM Controllers | LPDDR, DDR2, DDR3, DDR3L |
| Graphics Acceleration | Yes |
| Display & Interface Controllers | LCD, Touchscreen |
| Ethernet | 10/100/1000Mbps (2) |
| USB | USB 2.0 + PHY (2) |
| Voltage - I/O | 1.8V, 3.3V |
| Operating Temperature | 0°C ~ 90°C (TJ) |
| Security Features | Cryptography, Random Number Generator |
| Mounting Type | Surface Mount |
| Package / Case | 298-LFBGA |
| Supplier Device Package | 298-NFBGA (13x13) |
| Additional Interfaces | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitute parts for the AM3354ZCED50 are identified based on strict electrical and mechanical compatibility criteria within the Sitara™ ARM® Cortex®-A8 processor family. The following parameters determine substitution eligibility:
Core Compatibility Parameters:
- Processor Architecture: ARM® Cortex®-A8 (mandatory)
- Co-Processor Support: Multimedia and NEON™ SIMD (mandatory)
- Memory Controller Support: LPDDR, DDR2, DDR3, DDR3L (mandatory)
- Package Type: 298-NFBGA (13x13) (mandatory)
- I/O Voltage Levels: 1.8V, 3.3V (mandatory)
- Interface Set: CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART (mandatory)
Variable Parameters (Allowed Substitution Range):
- Operating Frequency: 300MHz to 600MHz
- Operating Temperature Range: 0°C ~ 90°C or -40°C ~ 90°C
- Product Status: Active or Obsolete
- Packaging Format: Tray or alternative approved formats
The identified substitutes maintain full architectural compatibility while offering performance and temperature range variations suitable for different application requirements.
Parameter Comparison
| Parameter | AM3354ZCED50 (Main) | AM3354BZCED60 (Substitute) | AM3352BZCE30 (Substitute) |
|---|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments | Texas Instruments |
| Series | Sitara™ | Sitara™ | Sitara™ |
| Core Processor | ARM® Cortex®-A8 | ARM® Cortex®-A8 | ARM® Cortex®-A8 |
| Number of Cores / Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit | 1 Core, 32-Bit |
| Speed | 500MHz | 600MHz | 300MHz |
| Co-Processors / DSP | Multimedia, NEON™ SIMD | Multimedia, NEON™ SIMD | Multimedia, NEON™ SIMD |
| RAM Controllers | LPDDR, DDR2, DDR3, DDR3L | LPDDR, DDR2, DDR3, DDR3L | LPDDR, DDR2, DDR3, DDR3L |
| Graphics Acceleration | Yes | Yes | Yes |
| Display & Interface Controllers | LCD, Touchscreen | LCD, Touchscreen | LCD, Touchscreen |
| Ethernet | 10/100/1000Mbps (2) | 10/100/1000Mbps (2) | 10/100/1000Mbps (2) |
| USB | USB 2.0 + PHY (2) | USB 2.0 + PHY (2) | USB 2.0 + PHY (2) |
| Voltage - I/O | 1.8V, 3.3V | 1.8V, 3.3V | 1.8V, 3.3V |
| Operating Temperature | 0°C ~ 90°C (TJ) | -40°C ~ 90°C (TJ) | 0°C ~ 90°C (TJ) |
| Security Features | Cryptography, Random Number Generator | Cryptography, Random Number Generator | Cryptography, Random Number Generator |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | 298-LFBGA | 298-LFBGA | 298-LFBGA |
| Supplier Device Package | 298-NFBGA (13x13) | 298-NFBGA (13x13) | 298-NFBGA (13x13) |
| Additional Interfaces | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) | 3 (168 Hours) |
| Product Status | Obsolete | Active | Active |
Engineering Selection Recommendations
AM3354BZCED60 (600MHz Variant)
The AM3354BZCED60 is classified as Active and offers the highest operating frequency at 600MHz within the substitute group. This variant extends the operating temperature range to -40°C ~ 90°C (TJ), providing enhanced thermal performance for demanding industrial and extended-temperature applications. The higher clock speed supports increased computational throughput while maintaining full architectural compatibility with the AM3354ZCED50. ROHS3 compliance and identical MSL rating ensure equivalent environmental and regulatory standing.
AM3352BZCE30 (300MHz Variant)
The AM3352BZCE30 is classified as Active and operates at 300MHz, representing a lower-frequency alternative within the Sitara™ family. This variant maintains the standard operating temperature range of 0°C ~ 90°C (TJ) and is suitable for applications where reduced power consumption and thermal dissipation are prioritized over maximum computational performance. Full architectural compatibility and ROHS3 compliance are maintained. The AM3352 base product number indicates a distinct SKU within the Sitara™ portfolio while preserving all core functional interfaces and memory controller support.
Both substitutes maintain ROHS3 compliance, identical MSL ratings, and full compatibility with the core interface set, memory controllers, and security features of the original AM3354ZCED50.
Frequently Asked Questions (FAQ)
Q: Can the AM3354BZCED60 be used as a direct replacement for the AM3354ZCED50?
A: The AM3354BZCED60 maintains full architectural compatibility with the AM3354ZCED50, including identical core processor type, co-processor support, memory controllers, and interface set. The primary difference is the increased operating frequency (600MHz vs. 500MHz) and extended temperature range (-40°C ~ 90°C vs. 0°C ~ 90°C). Direct substitution is permissible in applications where the higher frequency and extended temperature capability do not introduce thermal or power delivery constraints.
Q: What are the key differences between the AM3354BZCED60 and AM3352BZCE30?
A: Both parts share the ARM® Cortex®-A8 architecture, identical interface set, and memory controller support. The AM3354BZCED60 operates at 600MHz, while the AM3352BZCE30 operates at 300MHz. The AM3352BZCE30 represents a lower-performance variant suitable for power-constrained or thermally-limited applications. The AM3352 base product number indicates a distinct device family within Sitara™, though functional compatibility is maintained.
Q: Are the package dimensions identical across all three parts?
A: Yes. All three parts use the 298-NFBGA (13x13) package format with identical 298-LFBGA case designation. PCB footprint, solder ball pitch, and mounting requirements are identical, enabling direct physical substitution without board redesign.
Q: What is the significance of the Obsolete status for the AM3354ZCED50?
A: The Obsolete status indicates that the AM3354ZCED50 is no longer in active production. Both substitute parts (AM3354BZCED60 and AM3352BZCE30) are classified as Active, ensuring continued availability and supply chain support for new designs and replacement inventory.
Q: Do all three parts meet the same compliance standards?
A: Yes. All three parts are ROHS3 compliant, carry identical Moisture Sensitivity Level (MSL) ratings of 3 (168 Hours), and are REACH Unaffected. Environmental and regulatory compliance is equivalent across the group.
Q: Which substitute should be selected for a new design?
A: Selection depends on application requirements. The AM3354BZCED60 is recommended for applications requiring maximum computational performance and extended temperature operation. The AM3352BZCE30 is suitable for applications prioritizing power efficiency and thermal management. Both are Active products with full supply chain support.
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