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AM3352ZCED50 Equivalent & Substitute Parts
Part Overview
The AM3352ZCED50 is an ARM® Cortex®-A8 Microprocessor IC from Texas Instruments' Sitara™ series, featuring a single 32-bit core operating at 500MHz in a 298-NFBGA (13x13) package. This embedded processor integrates multimedia co-processing with NEON™ SIMD capabilities, dual Gigabit Ethernet interfaces, USB 2.0 connectivity, and comprehensive display controllers for LCD and touchscreen applications.
The AM3352ZCED50 is classified as Obsolete. Identifying equivalent and substitute parts is necessary to maintain design continuity, ensure supply chain availability, and support ongoing production or system upgrades where this processor is specified.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Series | Sitara™ |
| Core Processor | ARM® Cortex®-A8 |
| Number of Cores/Bus Width | 1 Core, 32-Bit |
| Speed | 500MHz |
| Package / Case | 298-NFBGA (13x13) |
| Voltage - I/O | 1.8V, 3.3V |
| Operating Temperature | -40°C ~ 90°C (TJ) |
| RoHS Status | ROHS3 Compliant |
| Product Status | Obsolete |
Substitute Part Grouping Explanation
Substitute parts for the AM3352ZCED50 are identified based on strict electrical and mechanical compatibility within the Sitara™ AM3352 family. The following parameters determine valid substitution:
Core Compatibility Parameters:
- Manufacturer: Texas Instruments (required)
- Series: Sitara™ (required)
- Core Processor: ARM® Cortex®-A8 (required)
- Number of Cores/Bus Width: 1 Core, 32-Bit (required)
- Package / Case: 298-NFBGA (13x13) (required)
- Voltage - I/O: 1.8V, 3.3V (required)
- Operating Temperature Range: Must encompass or match the original specification (required)
Variable Parameters (Allowed to Differ):
- Speed: Processor frequency may vary within the AM3352 family
- Product Status: Active variants are preferred for new designs
- Packaging Format: Tray packaging is acceptable as a substitute for the original packaging
The AM3352BZCED60 and AM3352BZCE30 are valid substitutes as they maintain identical core architecture, package geometry, voltage specifications, and interface capabilities while differing only in clock speed and product lifecycle status.
Parameter Comparison
| Parameter | AM3352ZCED50 (Main) | AM3352BZCED60 (Substitute) | AM3352BZCE30 (Substitute) |
|---|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments | Texas Instruments |
| Series | Sitara™ | Sitara™ | Sitara™ |
| Core Processor | ARM® Cortex®-A8 | ARM® Cortex®-A8 | ARM® Cortex®-A8 |
| Number of Cores/Bus Width | 1 Core, 32-Bit | 1 Core, 32-Bit | 1 Core, 32-Bit |
| Speed | 500MHz | 600MHz | 300MHz |
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Multimedia; NEON™ SIMD | Multimedia; NEON™ SIMD |
| RAM Controllers | LPDDR, DDR2, DDR3, DDR3L | LPDDR, DDR2, DDR3, DDR3L | LPDDR, DDR2, DDR3, DDR3L |
| Graphics Acceleration | Yes | Yes | Yes |
| Display & Interface Controllers | LCD, Touchscreen | LCD, Touchscreen | LCD, Touchscreen |
| Ethernet | 10/100/1000Mbps (2) | 10/100/1000Mbps (2) | 10/100/1000Mbps (2) |
| USB | USB 2.0 + PHY (2) | USB 2.0 + PHY (2) | USB 2.0 + PHY (2) |
| Voltage - I/O | 1.8V, 3.3V | 1.8V, 3.3V | 1.8V, 3.3V |
| Operating Temperature | -40°C ~ 90°C (TJ) | -40°C ~ 90°C (TJ) | 0°C ~ 90°C (TJ) |
| Security Features | Cryptography, Random Number Generator | Cryptography, Random Number Generator | Cryptography, Random Number Generator |
| Package / Case | 298-NFBGA (13x13) | 298-NFBGA (13x13) | 298-NFBGA (13x13) |
| Additional Interfaces | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART | CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) | 3 (168 Hours) |
| Product Status | Obsolete | Active | Active |
Engineering Selection Recommendations
AM3352BZCED60 (600MHz Variant)
This substitute is recommended as the primary alternative to the AM3352ZCED50. The AM3352BZCED60 maintains full electrical and mechanical compatibility while offering increased processor speed at 600MHz. The part is classified as Active, ensuring long-term availability and supply chain support. All compliance certifications including ROHS3 and moisture sensitivity specifications are identical. This variant is suitable for applications where the higher clock speed provides performance headroom without requiring design modifications.
AM3352BZCE30 (300MHz Variant)
This substitute is applicable for applications where the original 500MHz specification exceeds performance requirements. The AM3352BZCE30 operates at 300MHz and is classified as Active. The operating temperature range is 0°C ~ 90°C (TJ), which is narrower than the original -40°C ~ 90°C specification. This variant is suitable only for designs where the reduced temperature range is acceptable. All other electrical, mechanical, and interface specifications remain identical to the main part.
Both substitutes are ROHS3 compliant and maintain the same package geometry, voltage specifications, and peripheral interface set as the AM3352ZCED50.
Frequently Asked Questions (FAQ)
Q: Can the AM3352BZCED60 be used as a direct replacement for the AM3352ZCED50?
A: Yes. The AM3352BZCED60 is electrically and mechanically compatible with the AM3352ZCED50. Both parts share identical core architecture, package dimensions (298-NFBGA 13x13), voltage specifications (1.8V, 3.3V I/O), operating temperature range (-40°C ~ 90°C), and peripheral interfaces. The primary difference is the increased clock speed (600MHz vs. 500MHz). No PCB redesign or firmware modification is required for substitution.
Q: What is the difference between the AM3352BZCED60 and AM3352BZCE30?
A: Both parts are functionally equivalent to the AM3352ZCED50 in terms of core architecture and interfaces. The AM3352BZCED60 operates at 600MHz, while the AM3352BZCE30 operates at 300MHz. Additionally, the AM3352BZCE30 has a narrower operating temperature range (0°C ~ 90°C) compared to the original part (-40°C ~ 90°C). Select the AM3352BZCE30 only if your application does not require the extended low-temperature specification.
Q: Why is the AM3352ZCED50 classified as Obsolete?
A: The AM3352ZCED50 has reached end-of-life status within Texas Instruments' product portfolio. The Active variants AM3352BZCED60 and AM3352BZCE30 are the current supported options within the Sitara™ AM3352 family and are recommended for new designs and ongoing production.
Q: Are there any compliance or certification differences between the substitutes?
A: All three parts maintain ROHS3 compliance and identical moisture sensitivity levels (MSL 3, 168 Hours). The AM3352BZCED60 and AM3352BZCE30 are both suitable for applications requiring regulatory compliance equivalent to the original AM3352ZCED50.
Q: What packaging formats are available for the substitute parts?
A: The AM3352BZCED60 and AM3352BZCE30 are supplied in Tray packaging. Both maintain the same 298-NFBGA (13x13) package geometry as the original part, ensuring compatibility with existing PCB designs and assembly processes.
Q: Can I use the AM3352BZCE30 in applications requiring the full -40°C ~ 90°C temperature range?
A: No. The AM3352BZCE30 is specified for 0°C ~ 90°C operation only. If your application requires operation below 0°C, the AM3352BZCED60 is the appropriate substitute, as it maintains the full -40°C ~ 90°C temperature specification of the original part.
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