AM3352ZCE27 Equivalent & Substitute Parts

Part Overview

The AM3352ZCE27 is an ARM® Cortex®-A8 Microprocessor IC from Texas Instruments' Sitara™ series, featuring a single 32-bit core operating at 275MHz in a 298-NFBGA (13x13) package. This embedded processor integrates multimedia acceleration with NEON™ SIMD capabilities, dual Gigabit Ethernet ports, USB 2.0 interfaces, and comprehensive memory controllers supporting LPDDR, DDR2, DDR3, and DDR3L standards.

The AM3352ZCE27 is classified as obsolete. Identifying equivalent substitute parts is necessary to maintain design continuity, ensure component availability, and support long-term production requirements for systems utilizing this processor architecture.

Substiute Parts

AM3352ZCE27

Texas InstrumentsIn Stock: 1108AM3352ZCE27 Datasheet

Current PartRFQ

AM3352BZCE30

Texas InstrumentsIn Stock: 1238AM3352BZCE30 Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the AM3352ZCE27 is determined by the following critical parameters:

• Core Architecture: ARM® Cortex®-A8 single-core, 32-bit processor
• Package Type: 298-NFBGA (13x13) surface mount
• I/O Voltage Compatibility: 1.8V and 3.3V support
• Operating Temperature Range: 0°C ~ 90°C (TJ)
• Regulatory Compliance: ROHS3 Compliant, MSL 3 (168 Hours)
• Base Product Series: AM3352 Sitara™ family

The AM3352BZCE30 qualifies as a direct substitute based on identical core architecture, package footprint, voltage specifications, temperature range, and regulatory compliance. The primary differentiation is the increased processor speed (300MHz versus 275MHz), which represents an enhancement rather than a limitation for compatibility purposes.

Parameter Comparison

Engineering Selection Recommendations

The AM3352BZCE30 is a qualified substitute for the AM3352ZCE27 based on the following engineering criteria:

Regulatory and Compliance Alignment: Both parts maintain ROHS3 compliance and identical MSL 3 (168 Hours) moisture sensitivity specifications, ensuring equivalent handling and storage requirements throughout the supply chain.

Product Status Consideration: The AM3352ZCE27 is classified as obsolete, while the AM3352BZCE30 maintains active product status with Texas Instruments. This status difference ensures continued availability, technical support, and manufacturing continuity for the substitute part.

Electrical and Functional Equivalence: Identical core architecture, package footprint, I/O voltage specifications, operating temperature range, and peripheral interface configurations provide direct functional compatibility at the system level.

Performance Enhancement: The AM3352BZCE30 operates at 300MHz compared to the 275MHz specification of the AM3352ZCE27. This represents a performance increase that does not introduce compatibility constraints for designs originally specified for the lower-speed variant.

Frequently Asked Questions (FAQ)

Q: Can the AM3352BZCE30 be used as a direct replacement for the AM3352ZCE27 in existing PCB designs?

A: Yes. Both parts share identical package geometry (298-NFBGA 13x13), pinout configuration, I/O voltage levels (1.8V, 3.3V), and operating temperature range (0°C ~ 90°C TJ). No PCB redesign or layout modifications are required.

Q: What is the primary difference between these two parts?

A: The AM3352BZCE30 operates at 300MHz, while the AM3352ZCE27 operates at 275MHz. All other functional parameters, peripheral interfaces, and electrical specifications are identical.

Q: Are there any compliance or certification differences between the two parts?

A: No. Both parts maintain ROHS3 compliance and MSL 3 (168 Hours) moisture sensitivity specifications. Regulatory and environmental certifications are equivalent.

Q: Why is the AM3352ZCE27 classified as obsolete?

A: The AM3352ZCE27 has reached end-of-life status with Texas Instruments. The AM3352BZCE30 represents the active product continuation within the AM3352 Sitara™ family.

Q: Are there any thermal or power consumption differences that would affect system design?

A: The provided specifications do not include thermal or power consumption data for either part. System-level thermal analysis should reference the complete device datasheets from Texas Instruments.

Q: What packaging options are available for the AM3352BZCE30?

A: The AM3352BZCE30 is supplied in Tray packaging. The AM3352ZCE27 packaging specification was not provided in the available data.