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AM26C31IDB Equivalent & Substitute Parts
Part Overview
The AM26C31IDB is a 4-channel driver interface circuit manufactured by Texas Instruments, designed for RS422 communication protocols. This Surface Mount device operates within the 4.5V to 5.5V supply voltage range and supports data rates up to 10Mbps. The part is classified as Last Time Buy, indicating discontinued production status. Identifying equivalent and substitute parts is necessary to ensure design continuity, maintain supply chain flexibility, and support long-term product availability for applications requiring RS422 driver functionality.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | AM26C31IDB |
| Manufacturer | Texas Instruments |
| Category | Interface |
| Type | Driver |
| Protocol | RS422 |
| Number of Drivers/Receivers | 4/0 |
| Data Rate | 10Mbps |
| Voltage - Supply | 4.5V ~ 5.5V |
| Operating Temperature | -40°C ~ 85°C |
| Mounting Type | Surface Mount |
| Package / Case | 16-SSOP (0.209", 5.30mm Width) |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Product Status | Last Time Buy |
Substitute Part Grouping Explanation
Substitution eligibility for the AM26C31IDB is determined by the following critical parameters:
Primary Compatibility Criteria:
- Number of Drivers/Receivers: 4/0 configuration
- Voltage Supply Range: 4.5V ~ 5.5V
- Operating Temperature Range: -40°C ~ 85°C
- Mounting Type: Surface Mount
- RoHS Compliance: ROHS3 Compliant
- Moisture Sensitivity Level: 1 (Unlimited)
Secondary Considerations:
- Protocol support (RS422 or compatible protocols)
- Package form factor (SSOP or SOIC variants)
- Data rate capability (minimum 10Mbps)
The substitute parts identified maintain electrical compatibility through matching supply voltage specifications, operating temperature ranges, and driver/receiver channel configuration. Package variations between SSOP and SOIC formats are acceptable substitutes provided PCB layout accommodates the dimensional differences.
Parameter Comparison
| Parameter | AM26C31IDB (Main) | AM26C31IDBR (MFR Recommended) | DS26C31TM/NOPB (Similar) |
|---|---|---|---|
| Manufacturer | Texas Instruments | Texas Instruments | Texas Instruments |
| Category | Interface | Interface | Interface |
| Type | Driver | Driver | Driver |
| Number of Drivers/Receivers | 4/0 | 4/0 | 4/0 |
| Voltage - Supply | 4.5V ~ 5.5V | 4.5V ~ 5.5V | 4.5V ~ 5.5V |
| Operating Temperature | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 85°C |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | 16-SSOP (0.209", 5.30mm Width) | 16-SSOP (0.209", 5.30mm Width) | 16-SOIC (0.154", 3.90mm Width) |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
| Product Status | Last Time Buy | Active | Active |
Engineering Selection Recommendations
AM26C31IDBR (MFR Recommended Substitute): This part is the primary substitute for the AM26C31IDB. Both devices share identical electrical specifications, package dimensions, and form factor. The AM26C31IDBR maintains Active product status, ensuring continued availability and supply chain support. This part is available in Cut Tape and Digi-Reel packaging options. Selection of AM26C31IDBR requires no PCB redesign and provides direct functional equivalence.
DS26C31TM/NOPB (Similar Substitute): This part provides functional substitution with the following considerations: it maintains identical electrical parameters (voltage supply, operating temperature, driver/receiver configuration) and RoHS compliance. The primary difference is the package format: 16-SOIC versus 16-SSOP. The DS26C31TM/NOPB supports both RS422 and RS485 protocols, providing extended protocol compatibility. PCB layout modification is required to accommodate the different package footprint (0.154" versus 0.209" width). This part is supplied in Tube packaging and maintains Active product status.
Both substitute parts are manufactured by Texas Instruments and comply with ROHS3 standards and REACH regulations.
Frequently Asked Questions (FAQ)
Q: Can AM26C31IDBR be used as a direct replacement for AM26C31IDB?
A: Yes. The AM26C31IDBR is electrically and mechanically identical to the AM26C31IDB. Both use the 16-SSOP package with identical pin configuration, supply voltage range (4.5V ~ 5.5V), operating temperature range (-40°C ~ 85°C), and driver/receiver configuration (4/0). No circuit modifications or PCB redesign is required.
Q: What is the primary difference between AM26C31IDBR and DS26C31TM/NOPB?
A: The primary difference is the package format. AM26C31IDBR uses 16-SSOP (0.209" width), while DS26C31TM/NOPB uses 16-SOIC (0.154" width). Both maintain identical electrical specifications and operating parameters. DS26C31TM/NOPB additionally supports RS485 protocol in addition to RS422. PCB layout modification is necessary when switching between these package types.
Q: Are all three parts RoHS compliant?
A: Yes. AM26C31IDB, AM26C31IDBR, and DS26C31TM/NOPB are all ROHS3 compliant with Moisture Sensitivity Level 1 (Unlimited). All parts are REACH unaffected and classified under ECCN EAR99.
Q: What is the significance of "Last Time Buy" status for AM26C31IDB?
A: Last Time Buy status indicates that the AM26C31IDB is no longer in active production. Existing inventory is available, but no future manufacturing runs are planned. For new designs or long-term supply requirements, AM26C31IDBR or DS26C31TM/NOPB should be selected, as both maintain Active product status.
Q: Can DS26C31TM/NOPB be used in applications requiring only RS422 protocol?
A: Yes. DS26C31TM/NOPB supports both RS422 and RS485 protocols. Applications requiring only RS422 functionality can use this part without restriction. The dual-protocol capability does not affect RS422-only operation.
Q: What packaging options are available for each substitute part?
A: AM26C31IDB is supplied in standard packaging (not specified). AM26C31IDBR is available in Cut Tape (CT) and Digi-Reel packaging. DS26C31TM/NOPB is supplied in Tube packaging. Packaging selection depends on assembly process requirements and volume specifications.
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