AL3066S16-13 LED Driver IC Equivalent & Substitute Parts

Part Overview

The AL3066S16-13 is an active LED Driver IC manufactured by Diodes Incorporated, classified as a Power Management PMIC. This device functions as a 4-output DC-DC controller with step-up (boost) topology, delivering 250mA per channel output current with analog and PWM dimming capabilities for backlight applications. The part operates across a 4.5V to 33V supply range and produces 100V output voltage, housed in a 16-SO surface mount package.

Substitute parts are identified when equivalent functional performance can be achieved within the allowed electrical and mechanical parameters of the LED driver controller category, maintaining compatibility with backlight application requirements.

Substiute Parts

AL3066S16-13
Diodes IncorporatedIn Stock: 1179AL3066S16-13 Datasheet
AL3066S16-13
Current Part
ISL97687IBZ
Renesas Electronics CorporationIn Stock: 3782ISL97687IBZ Datasheet
ISL97687IBZ
MFR Recommended
MP3394SGF
Monolithic Power Systems Inc.In Stock: 11062MP3394SGF Datasheet
MP3394SGF
MFR Recommended

Key Parameters

Parameter AL3066S16-13
Manufacturer Diodes Incorporated
Category Power Management (PMIC)
Type DC DC Controller
Topology Step-Up (Boost)
Number of Outputs 4
Voltage Supply Range 4.5V to 33V
Output Voltage 100V
Current per Channel 250mA
Frequency 1MHz
Dimming Analog, PWM
Package 16-SOIC (0.154", 3.90mm Width)
Operating Temperature -40°C to 85°C (TA)
RoHS Status ROHS3 Compliant
Product Status Active

Substitute Part Grouping Explanation

Substitute parts for the AL3066S16-13 are qualified based on the following core parameters that define functional equivalence within the LED driver controller category:

  • Topology: Step-up (boost) DC-DC controller architecture
  • Output Configuration: 4-output channel design
  • Dimming Capability: Analog and/or PWM dimming support
  • Application: Backlight LED driver functionality
  • Supply Voltage Range: Minimum 4.5V input capability
  • Output Current: Minimum 160mA per channel (AL3066S16-13 specifies 250mA)
  • Compliance: ROHS3 compliant, active product status

The identified substitutes maintain these core functional parameters while operating within acceptable variations in frequency, package form factor, and temperature rating ranges.

Parameter Comparison

Parameter AL3066S16-13 ISL97687IBZ MP3394SGF
Manufacturer Diodes Incorporated Renesas Electronics Corporation Monolithic Power Systems Inc.
Category Power Management (PMIC) Power Management (PMIC) Power Management (PMIC)
Type DC DC Controller DC DC Controller DC DC Controller
Topology Step-Up (Boost) Step-Up (Boost) Step-Up (Boost)
Number of Outputs 4 4 4
Voltage Supply (Min) 4.5V 9V 5V
Voltage Supply (Max) 33V 32V 28V
Current per Channel 250mA 160mA 180mA
Frequency 1MHz 200kHz to 1.2MHz 670kHz
Dimming Analog, PWM Analog, PWM PWM
Operating Temperature -40°C to 85°C (TA) -40°C to 105°C (TA) -40°C to 125°C (TJ)
Package 16-SOIC (0.154", 3.90mm) 28-SOIC (0.295", 7.50mm) 16-TSSOP-EP (0.173", 4.40mm)
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Product Status Active Active Active

Engineering Selection Recommendations

ISL97687IBZ (Renesas Electronics Corporation)

The ISL97687IBZ maintains full functional equivalence as a 4-output step-up boost controller with analog and PWM dimming. This part operates within a 9V to 32V supply range, which overlaps the AL3066S16-13 operating window above 9V. Output current per channel is specified at 160mA, which is lower than the AL3066S16-13 at 250mA. The ISL97687IBZ is housed in a 28-SOIC package, requiring PCB layout modifications compared to the 16-SOIC footprint of the main part. Operating temperature range extends to 105°C, providing enhanced thermal performance. All parts maintain ROHS3 compliance and active product status.

MP3394SGF (Monolithic Power Systems Inc.)

The MP3394SGF functions as a 4-output step-up boost controller with PWM dimming capability. This part operates across a 5V to 28V supply range, providing compatibility with the AL3066S16-13 in applications requiring minimum 5V input. Output current per channel is 180mA, lower than the AL3066S16-13 specification. The MP3394SGF is packaged in a 16-TSSOP-EP format with exposed pad, maintaining a similar pin count to the main part but requiring different PCB footprint design. Operating temperature range reaches 125°C (junction temperature), exceeding the AL3066S16-13 thermal specification. This part supports PWM dimming only, without analog dimming capability. All parts maintain ROHS3 compliance and active product status.

Frequently Asked Questions (FAQ)

Q: Can ISL97687IBZ directly replace AL3066S16-13 in existing PCB designs?

A: Direct PCB replacement is not possible due to package differences. The ISL97687IBZ uses a 28-SOIC package versus the AL3066S16-13 16-SOIC package, requiring PCB layout redesign. Additionally, the ISL97687IBZ minimum supply voltage is 9V, which may limit compatibility in applications requiring 4.5V input operation.

Q: What is the primary limitation of MP3394SGF as a substitute?

A: The MP3394SGF supports PWM dimming only, whereas the AL3066S16-13 provides both analog and PWM dimming modes. Applications requiring analog dimming control cannot use this substitute without functional modification.

Q: How do output current specifications affect substitution decisions?

A: The AL3066S16-13 specifies 250mA per channel output current. Both ISL97687IBZ (160mA) and MP3394SGF (180mA) have lower per-channel current ratings. Substitution is valid only when application LED load current requirements do not exceed the substitute part's rated output current.

Q: Are all substitute parts compliant with the same regulatory standards?

A: Yes. The AL3066S16-13, ISL97687IBZ, and MP3394SGF are all ROHS3 compliant, REACH unaffected, and classified under ECCN EAR99 with HTSUS code 8542.39.0001. All parts maintain active product status.

Q: What package considerations apply when selecting a substitute?

A: The AL3066S16-13 uses 16-SOIC (0.154" width), ISL97687IBZ uses 28-SOIC (0.295" width), and MP3394SGF uses 16-TSSOP-EP (0.173" width). Package selection impacts PCB layout, thermal management, and board space allocation. Footprint compatibility must be verified during design phase.

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