AK6480AF EEPROM Memory IC Equivalent & Substitute Parts

Part Overview

The AK6480AF is an 8Kbit EEPROM memory IC manufactured by Asahi Kasei Microdevices (AKM) in an 8-SOP package. This device features SPI interface operation at 1 MHz with supply voltage range of 1.8V to 5.5V and operating temperature range of -40°C to 85°C. The AK6480AF is classified as obsolete, making identification of functionally equivalent substitute components necessary for ongoing system support and new design alternatives.

Substiute Parts

AK6480AF

Asahi Kasei Microdevices/AKMIn Stock: 2607AK6480AF Datasheet

Current PartRFQ

BR93L76RFJ-WE2

Rohm SemiconductorIn Stock: 16266BR93L76RFJ-WE2 Datasheet

MFR RecommendedRFQ

S-93C76ADFJ-TB-U

ABLIC Inc.In Stock: 8918S-93C76ADFJ-TB-U Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the AK6480AF are selected based on the following critical parameters that determine functional equivalence:

• Memory capacity: 8Kbit minimum
• Memory organization: 512 x 16 configuration
• Package compatibility: 8-SOIC (0.154", 3.90mm Width)
• Supply voltage range: 1.8V ~ 5.5V minimum coverage
• Operating temperature range: -40°C ~ 85°C minimum coverage
• Mounting type: Surface Mount
• Moisture sensitivity: MSL 1 or better

The identified substitute parts maintain these core electrical and mechanical parameters. Interface differences (SPI versus Microwire) and clock frequency variations are noted as design considerations but do not preclude functional substitution where protocol compatibility exists in the target application.

Parameter Comparison

Engineering Selection Recommendations

BR93L76RFJ-WE2 (Rohm Semiconductor) is the primary substitute option. This part maintains all critical electrical and mechanical parameters while offering active product status and verified RoHS3 compliance. The device operates at 2 MHz clock frequency, providing enhanced performance margin over the original 1 MHz specification. Microwire interface compatibility must be confirmed in the target application design.

S-93C76ADFJ-TB-U (ABLIC Inc.) is a secondary substitute option. This part meets all core electrical and mechanical requirements with RoHS3 compliance. However, the product status is classified as "Not For New Designs," limiting its suitability for new development initiatives. The 10ms write cycle time specification differs from the BR93L76RFJ-WE2 (5ms), which may impact system timing requirements.

Frequently Asked Questions (FAQ)

Q: Can BR93L76RFJ-WE2 directly replace AK6480AF in existing designs?

A: Direct replacement requires confirmation of Microwire protocol compatibility in the application firmware and hardware interface. Both parts share identical memory capacity (8Kbit), organization (512 x 16), package (8-SOIC), voltage range (1.8V ~ 5.5V), and temperature range (-40°C ~ 85°C). The interface protocol difference (SPI versus Microwire) is the primary design consideration.

Q: What is the significance of the 2 MHz clock frequency in BR93L76RFJ-WE2 versus 1 MHz in AK6480AF?

A: The higher clock frequency in BR93L76RFJ-WE2 provides operational headroom and does not create incompatibility with systems designed for 1 MHz operation. The substitute part operates at a faster speed, which is backward-compatible with lower-frequency system designs.

Q: Why is S-93C76ADFJ-TB-U marked "Not For New Designs"?

A: This product status designation indicates the manufacturer does not recommend this part for new design initiatives. While the part meets electrical and mechanical specifications, BR93L76RFJ-WE2 with "Active" status is the preferred choice for new applications.

Q: Are all three parts RoHS compliant?

A: BR93L76RFJ-WE2 and S-93C76ADFJ-TB-U are both ROHS3 compliant. RoHS status for the original AK6480AF is not specified in the provided data.

Q: What is the packaging difference between CT (Cut Tape) and TR (Tape & Reel)?

A: Cut Tape (CT) and Tape & Reel (TR) are supply formats only and do not affect electrical or mechanical compatibility. Both formats contain identical components in the same 8-SOIC package. Selection depends on procurement volume and assembly process requirements.