AISC-1210H-150K-T Equivalent & Substitute Parts

Part Overview

The AISC-1210H-150K-T is a 15 µH unshielded drum core, wirewound inductor manufactured by Abracon LLC, rated for 550 mA with a maximum DC resistance of 760mOhm. This component is packaged in the 1210 (3225 Metric) surface mount form factor and operates across the temperature range of -25°C to 85°C. The part is currently listed as obsolete, making identification of suitable substitute components essential for ongoing design support and production continuity.

Substiute Parts

AISC-1210H-150K-T

Abracon LLCIn Stock: 1107AISC-1210H-150K-T Datasheet

Current PartRFQ

NLCV32T-150K-EF

TDK CorporationIn Stock: 4391NLCV32T-150K-EF Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the AISC-1210H-150K-T is determined by the following critical parameters:

• Inductance Value: Must be 15 µH with ±10% tolerance
• Package / Case: Must be 1210 (3225 Metric) surface mount
• Core Type: Ferrite, unshielded drum core construction
• Current Rating: Substitute must support the application's current requirements
• DC Resistance: Must be compatible with circuit performance specifications
• Self Resonant Frequency: Must remain at or near 26 MHz
• Compliance: RoHS3 compliance and MSL 1 rating required

The NLCV32T-150K-EF from TDK Corporation meets these substitution criteria, offering the same inductance value, package form factor, and core material while maintaining equivalent electrical performance characteristics.

Parameter Comparison

Engineering Selection Recommendations

The NLCV32T-150K-EF is suitable as a substitute for the AISC-1210H-150K-T based on the following factors:

• Both components maintain identical inductance values and tolerances
• Both utilize ferrite, unshielded drum core construction in the 1210 (3225 Metric) package
• DC resistance values are comparable, with the TDK part offering slightly lower resistance (728mOhm vs 760mOhm)
• Self-resonant frequency remains constant at 26 MHz
• Both components are RoHS3 compliant with MSL 1 rating
• The TDK component is currently in active production status, ensuring long-term availability

The primary design consideration is the current rating differential: the NLCV32T-150K-EF is rated for 370 mA compared to the original part's 550 mA rating. Circuit designs operating at or below 370 mA can directly substitute this component. Applications requiring current levels between 370 mA and 550 mA require thermal and performance analysis to confirm suitability.

Frequently Asked Questions (FAQ)

Q: Can the NLCV32T-150K-EF directly replace the AISC-1210H-150K-T in all applications?

A: Direct substitution is valid for applications operating at or below 370 mA. The substitute part maintains identical inductance, package form factor, and core material. Applications requiring current levels above 370 mA require circuit-level evaluation.

Q: Are the physical dimensions compatible between these two parts?

A: Both components use the 1210 (3225 Metric) package. The AISC-1210H-150K-T measures 0.138" L x 0.098" W with a seated height of 0.098", while the NLCV32T-150K-EF measures 0.126" L x 0.098" W with a seated height of 0.094". These minor dimensional variations are within standard PCB layout tolerances for surface mount components.

Q: What is the difference in DC resistance between these parts?

A: The AISC-1210H-150K-T has a maximum DC resistance of 760mOhm, while the NLCV32T-150K-EF has a maximum of 728mOhm. The TDK substitute offers lower resistance, which may provide marginal improvements in power dissipation characteristics.

Q: Are both parts compliant with current regulatory standards?

A: Yes. Both the AISC-1210H-150K-T and NLCV32T-150K-EF are RoHS3 compliant, REACH unaffected, and classified as MSL 1 (unlimited moisture sensitivity level).

Q: What is the operating temperature range difference?

A: The original Abracon part operates from -25°C to 85°C, while the TDK substitute operates from -40°C to 105°C. The TDK component provides an extended temperature range, offering greater operational flexibility for temperature-sensitive applications.