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AFBR-59F1Z Equivalent & Substitute Parts
Part Overview
The AFBR-59F1Z is a transceiver module manufactured by Broadcom Limited, designed for general data transfer applications. This Surface Mount component operates at 125MBd data rate with 650nm wavelength and 3.3V supply voltage. The product is currently classified as Obsolete, making identification of compatible substitute parts essential for system maintenance and redesign efforts.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | AFBR-59F1Z |
| Manufacturer | Broadcom Limited |
| Data Rate | 125MBd |
| Wavelength | 650nm |
| Voltage - Supply | 3.3V |
| Mounting Type | Surface Mount |
| Applications | General Data Transfer |
| Product Status | Obsolete |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level | 2A (4 Weeks) |
Substitute Part Grouping Explanation
Substitution eligibility for the AFBR-59F1Z is determined by the following critical parameters:
- Wavelength: 650nm (must match)
- Supply Voltage: 3.3V (must match)
- Application Category: General Data Transfer (must match)
- Manufacturer: Broadcom Limited (same manufacturer ensures design compatibility)
- RoHS & REACH Compliance: ROHS3 Compliant, REACH Unaffected (regulatory alignment)
The AFBR-59F2Z qualifies as a substitute despite differences in data rate (250MBd vs. 125MBd) and mounting type (Through Hole vs. Surface Mount) because it maintains identical wavelength, supply voltage, application category, and regulatory compliance. The higher data rate of the substitute provides backward compatibility for lower-speed applications.
Parameter Comparison
| Parameter | AFBR-59F1Z (Main Part) | AFBR-59F2Z (Substitute) |
|---|---|---|
| Manufacturer | Broadcom Limited | Broadcom Limited |
| Data Rate | 125MBd | 250MBd |
| Wavelength | 650nm | 650nm |
| Voltage - Supply | 3.3V | 3.3V |
| Mounting Type | Surface Mount | Through Hole |
| Applications | General Data Transfer | General Data Transfer |
| Product Status | Obsolete | Active |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level | 2A (4 Weeks) | 2A (4 Weeks) |
Engineering Selection Recommendations
The AFBR-59F2Z is the designated substitute for the obsolete AFBR-59F1Z. Selection of this substitute is supported by:
- Product Status Alignment: The substitute is Active, ensuring continued availability and manufacturing support.
- Regulatory Compliance: Both parts maintain ROHS3 Compliant and REACH Unaffected status, satisfying environmental and safety requirements.
- Electrical Compatibility: Identical supply voltage (3.3V) and wavelength (650nm) ensure functional compatibility in general data transfer circuits.
- Performance Capability: The higher data rate (250MBd) of the substitute accommodates the original 125MBd requirement with performance margin.
Frequently Asked Questions (FAQ)
Q: Can the AFBR-59F2Z directly replace the AFBR-59F1Z in existing designs?
A: The AFBR-59F2Z is electrically compatible as a substitute. However, the mounting type differs (Through Hole vs. Surface Mount), requiring PCB layout modification. The higher data rate of the substitute is backward compatible with 125MBd applications.
Q: What are the critical parameters that must match for substitution?
A: Wavelength (650nm), supply voltage (3.3V), and application category (General Data Transfer) must remain constant. These parameters define the functional role of the transceiver module in the circuit.
Q: Why is the AFBR-59F1Z classified as Obsolete?
A: Obsolete status indicates the manufacturer has discontinued production. The AFBR-59F2Z represents the active product line continuation from Broadcom Limited for this transceiver family.
Q: Are there any compliance concerns with using the substitute?
A: No. Both parts maintain identical RoHS3 Compliance and REACH Unaffected status. Moisture sensitivity levels are also identical (2A, 4 Weeks), ensuring equivalent handling and storage requirements.
Q: What design considerations apply to the mounting type change?
A: The transition from Surface Mount to Through Hole requires PCB redesign. Through Hole mounting provides different mechanical stability and thermal characteristics compared to surface mount technology.
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