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ADSP-21991BBCZ Equivalent & Substitute Parts
Part Overview
The ADSP-21991BBCZ is a 16-bit fixed-point digital signal processor controller manufactured by Analog Devices Inc., designed for embedded applications requiring real-time signal processing. This device operates at 150MHz with 112kB of on-chip RAM and external non-volatile memory support. The part is classified as obsolete, making identification of functionally compatible alternatives essential for ongoing system support and new design implementations.
Substiute Parts
Key Parameters
| Parameter | ADSP-21991BBCZ |
|---|---|
| Manufacturer | Analog Devices Inc. |
| Product Category | Embedded, Integrated Circuits (ICs) |
| Series | ADSP-21xx |
| Type | Fixed Point DSP Controller |
| Clock Rate | 150MHz |
| On-Chip RAM | 112kB |
| Interface | SPI, SSP |
| Voltage - Core | 2.50V |
| Voltage - I/O | 3.30V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package / Case | 196-BGA, CSPBGA |
| Mounting Type | Surface Mount |
| Product Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Substitute Part Grouping Explanation
Substitution of the ADSP-21991BBCZ is determined by the following critical parameters:
- Processor Architecture: Both parts must belong to the ADSP-21xx series and maintain fixed-point DSP controller functionality
- Interface Compatibility: SPI and SSP interface support must be present
- Voltage Specifications: Core voltage (2.50V) and I/O voltage (3.30V) must match
- Operating Temperature Range: -40°C ~ 85°C compatibility required
- Memory Architecture: External non-volatile memory support and on-chip RAM configuration
- Compliance & Certifications: ECCN and HTSUS classifications must align
The ADSP-21992BSTZ qualifies as a substitute based on these parameters. While it operates at a higher clock rate (160MHz) and provides increased on-chip RAM (128kB), it maintains the same voltage specifications, temperature range, interface protocols, and series designation. The package differs (176-LQFP vs. 196-BGA), requiring PCB layout modification but preserving functional compatibility.
Parameter Comparison
| Parameter | ADSP-21991BBCZ | ADSP-21992BSTZ | Compatibility Notes |
|---|---|---|---|
| Manufacturer | Analog Devices Inc. | Analog Devices Inc. | Same manufacturer |
| Series | ADSP-21xx | ADSP-21xx | Same series |
| Type | Fixed Point | Fixed Point | Same architecture |
| Clock Rate | 150MHz | 160MHz | Substitute operates faster |
| On-Chip RAM | 112kB | 128kB | Substitute provides more memory |
| Interface | SPI, SSP | SPI, SSP | Same interface protocols |
| Voltage - Core | 2.50V | 2.50V | Identical |
| Voltage - I/O | 3.30V | 3.30V | Identical |
| Operating Temperature | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | Identical range |
| Mounting Type | Surface Mount | Surface Mount | Same mounting technology |
| Package / Case | 196-BGA, CSPBGA | 176-LQFP | Different package; PCB redesign required |
| Product Status | Obsolete | Active | Substitute is actively manufactured |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) | Identical handling requirements |
| ECCN | 3A991A2 | 3A991A2 | Same export classification |
| HTSUS | 8542.31.0001 | 8542.31.0001 | Same tariff classification |
Engineering Selection Recommendations
The ADSP-21992BSTZ is the qualified substitute for the obsolete ADSP-21991BBCZ based on the following factors:
Product Status: The ADSP-21992BSTZ maintains active manufacturing status with Analog Devices Inc., ensuring long-term availability and supply chain continuity. The original ADSP-21991BBCZ is obsolete, making substitution necessary for new production and ongoing support.
Compliance Alignment: Both parts share identical ECCN (3A991A2) and HTSUS (8542.31.0001) classifications, maintaining regulatory and trade compliance requirements without modification.
Electrical Compatibility: Matching core voltage (2.50V), I/O voltage (3.30V), operating temperature range (-40°C ~ 85°C), and interface protocols (SPI, SSP) ensure functional integration into existing designs with minimal firmware modification.
Performance Enhancement: The substitute provides improved specifications with 160MHz clock rate (versus 150MHz) and 128kB on-chip RAM (versus 112kB), delivering performance headroom without compromising backward compatibility.
Package Consideration: The transition from 196-BGA to 176-LQFP packaging requires PCB layout redesign and footprint modification. This is the primary engineering constraint for substitution implementation.
Frequently Asked Questions (FAQ)
Q: Can the ADSP-21992BSTZ directly replace the ADSP-21991BBCZ without PCB modification?
A: No. The ADSP-21992BSTZ uses a 176-LQFP package while the original uses 196-BGA. PCB footprint redesign is required. However, the electrical interface, voltage specifications, and signal protocols are fully compatible.
Q: What are the key electrical parameters that make these parts substitutable?
A: Core voltage (2.50V), I/O voltage (3.30V), operating temperature range (-40°C ~ 85°C), and interface protocols (SPI, SSP) are identical. These parameters ensure functional compatibility at the system level.
Q: Does the higher clock rate of the ADSP-21992BSTZ (160MHz vs. 150MHz) create compatibility issues?
A: No. The higher clock rate is a performance enhancement that does not create incompatibility. Existing firmware and timing-critical applications will operate correctly, with potential for improved throughput.
Q: Are there compliance or regulatory differences between these parts?
A: No. Both parts share identical ECCN (3A991A2) and HTSUS (8542.31.0001) classifications. Export control and tariff treatment remain unchanged.
Q: What is the impact of increased on-chip RAM (128kB vs. 112kB) on substitution?
A: The increased RAM is a beneficial enhancement that does not affect compatibility. Existing code will execute without modification, and additional memory capacity is available for expanded functionality.
Q: Are there any moisture sensitivity or handling differences?
A: No. Both parts have identical Moisture Sensitivity Level (MSL) rating of 3 (168 Hours), requiring the same storage and handling procedures.
Q: What is the primary engineering consideration for implementing this substitution?
A: Package transition from 196-BGA to 176-LQFP is the primary constraint. This requires PCB redesign, but all electrical and functional parameters remain compatible.
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