ADSP-21991BBCZ Equivalent & Substitute Parts

Part Overview

The ADSP-21991BBCZ is a 16-bit fixed-point digital signal processor controller manufactured by Analog Devices Inc., designed for embedded applications requiring real-time signal processing. This device operates at 150MHz with 112kB of on-chip RAM and external non-volatile memory support. The part is classified as obsolete, making identification of functionally compatible alternatives essential for ongoing system support and new design implementations.

Substiute Parts

ADSP-21991BBCZ
Analog Devices Inc.In Stock: 2418ADSP-21991BBCZ Datasheet
ADSP-21991BBCZ
Current Part
ADSP-21992BSTZ
Analog Devices Inc.In Stock: 20487ADSP-21992BSTZ Datasheet
ADSP-21992BSTZ
Similar

Key Parameters

Parameter ADSP-21991BBCZ
Manufacturer Analog Devices Inc.
Product Category Embedded, Integrated Circuits (ICs)
Series ADSP-21xx
Type Fixed Point DSP Controller
Clock Rate 150MHz
On-Chip RAM 112kB
Interface SPI, SSP
Voltage - Core 2.50V
Voltage - I/O 3.30V
Operating Temperature -40°C ~ 85°C (TA)
Package / Case 196-BGA, CSPBGA
Mounting Type Surface Mount
Product Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution of the ADSP-21991BBCZ is determined by the following critical parameters:

  • Processor Architecture: Both parts must belong to the ADSP-21xx series and maintain fixed-point DSP controller functionality
  • Interface Compatibility: SPI and SSP interface support must be present
  • Voltage Specifications: Core voltage (2.50V) and I/O voltage (3.30V) must match
  • Operating Temperature Range: -40°C ~ 85°C compatibility required
  • Memory Architecture: External non-volatile memory support and on-chip RAM configuration
  • Compliance & Certifications: ECCN and HTSUS classifications must align

The ADSP-21992BSTZ qualifies as a substitute based on these parameters. While it operates at a higher clock rate (160MHz) and provides increased on-chip RAM (128kB), it maintains the same voltage specifications, temperature range, interface protocols, and series designation. The package differs (176-LQFP vs. 196-BGA), requiring PCB layout modification but preserving functional compatibility.

Parameter Comparison

Parameter ADSP-21991BBCZ ADSP-21992BSTZ Compatibility Notes
Manufacturer Analog Devices Inc. Analog Devices Inc. Same manufacturer
Series ADSP-21xx ADSP-21xx Same series
Type Fixed Point Fixed Point Same architecture
Clock Rate 150MHz 160MHz Substitute operates faster
On-Chip RAM 112kB 128kB Substitute provides more memory
Interface SPI, SSP SPI, SSP Same interface protocols
Voltage - Core 2.50V 2.50V Identical
Voltage - I/O 3.30V 3.30V Identical
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA) Identical range
Mounting Type Surface Mount Surface Mount Same mounting technology
Package / Case 196-BGA, CSPBGA 176-LQFP Different package; PCB redesign required
Product Status Obsolete Active Substitute is actively manufactured
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours) Identical handling requirements
ECCN 3A991A2 3A991A2 Same export classification
HTSUS 8542.31.0001 8542.31.0001 Same tariff classification

Engineering Selection Recommendations

The ADSP-21992BSTZ is the qualified substitute for the obsolete ADSP-21991BBCZ based on the following factors:

Product Status: The ADSP-21992BSTZ maintains active manufacturing status with Analog Devices Inc., ensuring long-term availability and supply chain continuity. The original ADSP-21991BBCZ is obsolete, making substitution necessary for new production and ongoing support.

Compliance Alignment: Both parts share identical ECCN (3A991A2) and HTSUS (8542.31.0001) classifications, maintaining regulatory and trade compliance requirements without modification.

Electrical Compatibility: Matching core voltage (2.50V), I/O voltage (3.30V), operating temperature range (-40°C ~ 85°C), and interface protocols (SPI, SSP) ensure functional integration into existing designs with minimal firmware modification.

Performance Enhancement: The substitute provides improved specifications with 160MHz clock rate (versus 150MHz) and 128kB on-chip RAM (versus 112kB), delivering performance headroom without compromising backward compatibility.

Package Consideration: The transition from 196-BGA to 176-LQFP packaging requires PCB layout redesign and footprint modification. This is the primary engineering constraint for substitution implementation.

Frequently Asked Questions (FAQ)

Q: Can the ADSP-21992BSTZ directly replace the ADSP-21991BBCZ without PCB modification?

A: No. The ADSP-21992BSTZ uses a 176-LQFP package while the original uses 196-BGA. PCB footprint redesign is required. However, the electrical interface, voltage specifications, and signal protocols are fully compatible.

Q: What are the key electrical parameters that make these parts substitutable?

A: Core voltage (2.50V), I/O voltage (3.30V), operating temperature range (-40°C ~ 85°C), and interface protocols (SPI, SSP) are identical. These parameters ensure functional compatibility at the system level.

Q: Does the higher clock rate of the ADSP-21992BSTZ (160MHz vs. 150MHz) create compatibility issues?

A: No. The higher clock rate is a performance enhancement that does not create incompatibility. Existing firmware and timing-critical applications will operate correctly, with potential for improved throughput.

Q: Are there compliance or regulatory differences between these parts?

A: No. Both parts share identical ECCN (3A991A2) and HTSUS (8542.31.0001) classifications. Export control and tariff treatment remain unchanged.

Q: What is the impact of increased on-chip RAM (128kB vs. 112kB) on substitution?

A: The increased RAM is a beneficial enhancement that does not affect compatibility. Existing code will execute without modification, and additional memory capacity is available for expanded functionality.

Q: Are there any moisture sensitivity or handling differences?

A: No. Both parts have identical Moisture Sensitivity Level (MSL) rating of 3 (168 Hours), requiring the same storage and handling procedures.

Q: What is the primary engineering consideration for implementing this substitution?

A: Package transition from 196-BGA to 176-LQFP is the primary constraint. This requires PCB redesign, but all electrical and functional parameters remain compatible.

Request Quote (Ships tomorrow)