ADS7806PBG4 Equivalent & Substitute Parts

Part Overview

The ADS7806PBG4 is a 12-bit Analog to Digital Converter (ADC) with a single-ended input, SAR architecture, and 40 kSPS sampling rate. Manufactured by Texas Instruments, this component features both SPI and parallel data interfaces with external and internal reference options. The device operates on 5V supply for both analog and digital domains across an extended temperature range of -40°C to 85°C.

The ADS7806PBG4 is classified as obsolete. Locating equivalent or substitute components is necessary to support legacy system maintenance, design updates, or when original inventory becomes unavailable. Substitute parts must maintain functional equivalence across critical electrical and mechanical parameters while accounting for packaging and mounting differences.

Substiute Parts

ADS7806PBG4
Texas InstrumentsIn Stock: 987ADS7806PBG4 Datasheet
ADS7806PBG4
Current Part
ADS8506IBDW
Texas InstrumentsIn Stock: 2584ADS8506IBDW Datasheet
ADS8506IBDW
MFR Recommended

Key Parameters

Parameter Value
Resolution (Bits) 12
Sampling Rate 40 kSPS
Number of Inputs 1
Input Type Single Ended
Data Interface SPI, Parallel
Architecture SAR
Reference Type External, Internal
Analog Supply Voltage 5V
Digital Supply Voltage 5V
Operating Temperature Range -40°C to 85°C
Package Type 28-DIP
Mounting Type Through Hole

Substitute Part Grouping Explanation

Substitution of the ADS7806PBG4 is determined by strict equivalence across the following critical parameters:

  • Resolution and Sampling Rate: 12-bit resolution at 40 kSPS
  • Input Configuration: Single-ended input with 1 channel
  • Data Interface: SPI and parallel interface support
  • Architecture: SAR-based conversion
  • Reference Options: External and internal reference capability
  • Supply Voltages: 5V analog and digital supplies
  • Operating Temperature: -40°C to 85°C range
  • Functional Compatibility: Pin-compatible or functionally equivalent signal processing

The ADS8506IBDW meets all electrical and functional requirements for substitution. The primary difference is packaging: the substitute uses 28-SOIC surface-mount packaging instead of the original 28-DIP through-hole format. This requires PCB layout and assembly process modifications but maintains full electrical equivalence.

Parameter Comparison

Parameter ADS7806PBG4 ADS8506IBDW Match
Manufacturer Texas Instruments Texas Instruments Yes
Resolution (Bits) 12 12 Yes
Sampling Rate (kSPS) 40 40 Yes
Number of Inputs 1 1 Yes
Input Type Single Ended Single Ended Yes
Data Interface SPI, Parallel SPI, Parallel Yes
Architecture SAR SAR Yes
Reference Type External, Internal External, Internal Yes
Analog Supply Voltage 5V 5V Yes
Digital Supply Voltage 5V 5V Yes
Operating Temperature Range -40°C to 85°C -40°C to 85°C Yes
Package / Case 28-DIP (0.300", 7.62mm) 28-SOIC (0.295", 7.50mm Width) Different
Mounting Type Through Hole Surface Mount Different
Product Status Obsolete Active Substitute is Active
RoHS Status ROHS3 Compliant ROHS3 Compliant Yes
REACH Status REACH Unaffected REACH Unaffected Yes

Engineering Selection Recommendations

The ADS8506IBDW is the manufacturer-recommended substitute for the ADS7806PBG4. Both components are ROHS3 compliant and REACH unaffected, meeting regulatory requirements for modern applications.

The primary consideration for selection is packaging and mounting technology. The ADS7806PBG4 uses through-hole DIP packaging suitable for breadboard prototyping and legacy PCB designs. The ADS8506IBDW uses surface-mount SOIC packaging, which is standard for contemporary PCB manufacturing and offers improved thermal performance and board density.

Selection of the ADS8506IBDW requires PCB redesign to accommodate SOIC footprint and surface-mount assembly processes. The substitute is actively manufactured and stocked, ensuring long-term availability compared to the obsolete original part.

Frequently Asked Questions (FAQ)

Q: Can the ADS8506IBDW directly replace the ADS7806PBG4 without PCB modification?

A: No. The ADS8506IBDW uses 28-SOIC surface-mount packaging while the ADS7806PBG4 uses 28-DIP through-hole packaging. PCB layout and footprint changes are required. Pin-to-pin electrical functionality is equivalent, but physical mounting differs.

Q: Are the electrical specifications identical between these two parts?

A: Yes. Both components share identical specifications for resolution (12-bit), sampling rate (40 kSPS), input configuration (single-ended, 1 channel), data interfaces (SPI and parallel), supply voltages (5V analog and digital), and operating temperature range (-40°C to 85°C).

Q: Why is the ADS7806PBG4 listed as obsolete?

A: The ADS7806PBG4 is an older through-hole DIP package design. Texas Instruments has transitioned to surface-mount SOIC packaging for this product line, making the DIP version obsolete while maintaining functional equivalence in the active SOIC variant.

Q: What are the moisture sensitivity differences between these parts?

A: The ADS7806PBG4 has MSL 3 (168 hours), while the ADS8506IBDW has MSL 2 (1 year). The substitute has lower moisture sensitivity, requiring less stringent handling and storage conditions.

Q: Are both parts suitable for -40°C to 85°C operating environments?

A: Yes. Both the ADS7806PBG4 and ADS8506IBDW are rated for the same extended temperature range of -40°C to 85°C.

Q: What compliance certifications apply to both parts?

A: Both components are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory standards for electronic components.

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