ADS5424IPJY Equivalent & Substitute Parts

Part Overview

The ADS5424IPJY is a 14-bit pipelined analog-to-digital converter manufactured by Texas Instruments, designed for data acquisition applications requiring single differential input with parallel data interface. The device operates at a 105 MHz sampling rate and is housed in a 52-QFP (10x10) package.

The ADS5424IPJY carries an Obsolete product status. Identifying equivalent substitute parts is necessary to ensure design continuity, maintain supply chain reliability, and support ongoing production or maintenance requirements for systems utilizing this component.

Substiute Parts

ADS5424IPJY

Texas InstrumentsIn Stock: 1516ADS5424IPJY Datasheet

Current PartRFQ

ADS5424IPGP

Texas InstrumentsIn Stock: 1435ADS5424IPGP Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the ADS5424IPJY are identified based on strict equivalence of core electrical and functional parameters. The following criteria determine substitution eligibility:

• Resolution: 14 bits
• Sampling Rate: 105M per second
• Input Configuration: 1 differential input
• Data Interface: Parallel
• Architecture: Pipelined
• Supply Voltages: 5V analog and 5V digital
• Operating Temperature Range: -55°C ~ 125°C
• Base Product Number: ADS5424
• Compliance: ROHS3 Compliant, REACH Unaffected

The ADS5424IPGP meets all electrical and functional equivalence criteria. The primary difference is the package type: the substitute uses a 52-HTQFP (10x10) with exposed pad versus the original 52-QFP (10x10) package. Both packages are surface-mount configurations with identical pin counts and thermal characteristics suitable for equivalent board-level integration.

Parameter Comparison

Engineering Selection Recommendations

The ADS5424IPGP is the direct equivalent substitute for the ADS5424IPJY. Both components share identical electrical specifications, functional architecture, and compliance certifications. The ADS5424IPGP carries Active product status, ensuring ongoing manufacturer support and supply availability, whereas the ADS5424IPJY is Obsolete.

The package difference—52-HTQFP with exposed pad versus standard 52-QFP—provides thermal management advantages through the exposed pad design while maintaining pin-compatible footprint geometry. Both packages are 10x10 mm surface-mount configurations suitable for equivalent PCB integration.

Selection of the ADS5424IPGP is supported by ROHS3 compliance and REACH Unaffected status, meeting regulatory requirements equivalent to the original part.

Frequently Asked Questions (FAQ)

Q: Can the ADS5424IPGP directly replace the ADS5424IPJY on existing PCBs?

A: Yes. Both parts share identical pin counts, footprint dimensions (10x10 mm), and surface-mount package types. The exposed pad on the ADS5424IPGP requires connection to ground plane for thermal management, which is standard practice in modern PCB design. Existing designs may require thermal via placement under the exposed pad for optimal performance.

Q: What is the functional difference between these two parts?

A: There is no functional difference. Both devices are 14-bit pipelined ADCs with 105 MHz sampling rate, single differential input, parallel data interface, and identical supply voltage requirements. Electrical performance and pin functionality are equivalent.

Q: Why is the ADS5424IPJY listed as Obsolete?

A: The ADS5424IPJY has reached end-of-life status with Texas Instruments. The ADS5424IPGP represents the active production equivalent, incorporating the same core architecture with an improved package design featuring thermal management capabilities.

Q: Are there compliance or certification differences?

A: No. Both parts are ROHS3 Compliant and REACH Unaffected. Moisture Sensitivity Level (MSL) is identical at 3 (168 Hours). Regulatory and environmental compliance requirements are met by both components.

Q: What is the significance of the exposed pad on the ADS5424IPGP?

A: The exposed pad provides direct thermal connection to the PCB ground plane, improving heat dissipation during operation. This is a design enhancement that does not affect electrical functionality or pin compatibility. PCB layouts should include thermal vias connecting the exposed pad to internal ground planes.